Patents by Inventor James R. Przybyla

James R. Przybyla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11312129
    Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes an array of firing subassemblies grouped into zones. Each firing subassembly includes 1) a firing chamber, 2) a fluid actuator, and 3) a sensor plate. The fluidic die also includes a measurement device per zone to measure a voltage indicative of an impedance within a selected firing chamber. The fluidic die includes a selector per firing subassembly to couple a selected sensor plate to the measurement device. A selector is adjacent a respective firing subassembly and a distance between the selector and the measurement device is different as compared to other selectors.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: April 26, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Eric Martin, James R. Przybyla, Daryl E. Anderson
  • Patent number: 11305537
    Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: April 19, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-Iam J Choy
  • Patent number: 11292250
    Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes an array of fluid actuators grouped into primitives. Each actuator is disposed in a fluid chamber. The fluidic die also includes an array of fluid sensors. Each fluid sensor is disposed within a fluid chamber and determines a characteristic within the fluid chamber. A data parser of the fluidic die extracts from an incoming signal, firing instructions and measurement instructions for the fluidic die. The measurement instructions indicate at least one of a peak measurement during a nucleation event and a reference measurement during a non-nucleation event. A firing controller generates firing signals based on the firing instructions and a measurement controller activates, during a measurement interval of a printing cycle for the primitive, a measurement for a selected actuator based on the measurement instructions.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Eric Martin, Tsuyoshi Yamashita, James R. Przybyla
  • Patent number: 11247470
    Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: February 15, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
  • Publication number: 20210370668
    Abstract: One example provides a fluidic die including a nozzle layer disposed on a substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is exposed to the upper surface of the nozzle layer and extends proximate to a portion of the nozzle orifices, an impedance of the conductive trace indicative of a surface condition of the upper surface of the nozzle layer.
    Type: Application
    Filed: January 31, 2019
    Publication date: December 2, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Eric Martin, Daryl E. Anderson, James R. Przybyla, Chien-Hua Chen, Diane R. Hammerstad
  • Publication number: 20210362508
    Abstract: The fluid ejection device includes a plurality of nozzles and a plurality of ejection chambers that includes a respective ejection chamber fluidically coupled to a respective nozzle. A plurality of inlet passages are fluidically coupled to the ejection chambers and input fluid to the ejection chambers at a first pressure. A plurality of outlet passages are fluidically coupled to the ejection chambers and output fluid from the ejection chambers at a second pressure that is less than the first pressure. Fluid circulates through the ejection chambers based on the pressure difference between the first and second pressure. The fluid ejection device also includes at least one micropump fluidically coupled to at least one ejection chamber to pump fluid through the at least one ejection chamber.
    Type: Application
    Filed: July 23, 2018
    Publication date: November 25, 2021
    Inventors: James R. Przybyla, Jordan E. Morris
  • Patent number: 11173712
    Abstract: In some examples, a system includes a device support to receive a fluid dispensing device, and a controller to identify, based on data controlling activation of fluidic actuators, a fluidic actuator that is to be activated in a first activation cycle of a group of activation cycles that correspond to activation intervals of respective fluidic actuators of a group of fluidic actuators of the fluid dispensing device, the identified fluidic actuator being part of the group of fluidic actuators. To perform a sense measurement for the identified fluidic actuator, the controller suppresses activation of the identified fluidic actuator in the first activation cycle, and causes activation of the identified fluidic actuator in a sense measurement cycle different from the first activation cycle, the sense measurement cycle being part of the group of activation cycles.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: November 16, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Eric T. Martin, Daryl E. Anderson, James R. Przybyla
  • Publication number: 20210347169
    Abstract: One example provides a fluidic device including a substrate, a nozzle layer disposed on the substrate, the nozzle layer having an upper surface opposite the substrate including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A number of conductive traces are disposed in direct contact with the nozzle layer to provide electrical pathways above the substrate.
    Type: Application
    Filed: January 31, 2019
    Publication date: November 11, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: James R. Przybyla, Eric Martin, Daryl E. Anderson, Chien-Hua Chen
  • Publication number: 20210347171
    Abstract: One example provides a fluidic die including a semiconductor substrate, and a nozzle layer disposed on the substrate, the nozzle layer having a top surface opposite the substrate and including a nozzle formed therein, the nozzle including a fluid chamber disposed below the top surface and a nozzle orifice extending through the nozzle layer from the top surface to the fluid chamber, the fluid chamber to hold fluid, and the nozzle to eject fluid drops from the fluid chamber via the nozzle orifice. An electrode is disposed in contact with the nozzle layer about a perimeter of the nozzle orifice, the electrode to carry an electrical charge to adjust movement of electrically charged components of the fluid.
    Type: Application
    Filed: January 31, 2019
    Publication date: November 11, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E. Anderson, Eric Martin, James R. Przybyla, Chien-Hua Chen
  • Publication number: 20210323228
    Abstract: In one example in accordance with the present disclosure, an additive manufacturing module is described. The additive manufacturing module includes an agent distributor to selectively distribute a fabrication agent onto layers of build material. The agent distributor includes at least one fluidic ejection die. Each fluidic ejection die includes a plurality of nozzles arranged a long a die length and a die width, the plurality of nozzles arranged such that, for each set of neighboring nozzles, a respective subset of each set of neighboring nozzles are positioned at different die width positions along the width of the fluidic ejection die. The fluidic ejection die also includes, for each respective nozzle of the plurality of nozzles, a respective ejection chamber fluidically coupled to the respective nozzle and for each respective ejection chamber, at least one respective fluid feed hole fluidically coupled to the respective ejection chamber.
    Type: Application
    Filed: March 12, 2018
    Publication date: October 21, 2021
    Inventors: James R Przybyla, Jason Hower, Michael G Monroe, Galen P Cook
  • Publication number: 20210291520
    Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
  • Publication number: 20210276331
    Abstract: One example of a fluid ejection system includes a plurality of fluid ejection devices, a corresponding plurality of indicators, an operator interface, and a controller. Each indicator is on a corresponding fluid ejection device. The operator interface is to select a fluid ejection device. The controller is to turn on the corresponding indicator for the selected fluid ejection device.
    Type: Application
    Filed: July 11, 2017
    Publication date: September 9, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Daryl E Anderson, James R Przybyla
  • Publication number: 20210245496
    Abstract: One example provides a fluidic device including a substrate and a nozzle layer disposed on the substrate, the nozzle layer having an upper surface opposite the substrate and including a plurality of nozzles formed therein, each nozzle including a fluid chamber and a nozzle orifice extending through the nozzle layer from the upper surface to the fluid chamber. A conductive trace is disposed in direct contact with the nozzle layer and extending proximate to a portion of the nozzle orifices, the conductive trace having an electrical property indicative of damage to the nozzle layer.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 12, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: James R Przybyla, Chien-Hua Chen, Michaei G Groh
  • Publication number: 20210206161
    Abstract: Examples include a fluidic die. The fluidic die comprises an array of field effect transistors. Connecting members electrically connect at least some of the field effect transistors of the array of field effect transistors, and the field effect transistors of the array are arranged into respective sets of field effect transistors. The fluidic die further comprises a first fluid actuator connected to a first set of field effect transistors having a first number of field effect transistors. The die includes a second fluid actuator connected to a second respective set of field effect transistors having a second number of field effect transistors that is different than the first number of field effect transistors.
    Type: Application
    Filed: September 24, 2018
    Publication date: July 8, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Eric Martin, James R Przybyla, Rogelio Cicili
  • Patent number: 11046073
    Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid recirculation pumps within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of heat exchangers thermally coupled to a fluid channel side of the fluid ejection die.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: June 29, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, James R Przybyla
  • Patent number: 11037036
    Abstract: Examples include a fluidic die. The fluidic die may comprise an array of fluid actuators, an actuation data register, a mask register, and actuation logic. The actuation data register may store actuation data that indicates fluid ejectors to actuate for a set of actuation events. The mask register may store mask data that indicates a set of fluid actuators enabled for actuation for a respective actuation event of the set of actuation events. The actuation logic may electrically actuate a subset of the fluid actuators based at least in part on the actuation data register and the mask register for the respective actuation event.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: June 15, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daryl E. Anderson, Eric T. Martin, James R. Przybyla
  • Patent number: 11034151
    Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: June 15, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
  • Patent number: 10967646
    Abstract: A check valve for preventing reverse flow of jettable material within a jettable material firing chamber during a firing event includes a free-floating plug. The check valve further includes at least one holding post, wherein the free-floating plug is arranged between at least one wall of the firing chamber and the holding posts, the at least one wall and the holding posts restricting the movement of the free-floating plug within the chamber.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: April 6, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kianoush Naeli, James R. Przybyla
  • Patent number: 10960661
    Abstract: In some examples, a circuit for a fluid ejection device includes an energy delivery device and a circuit layer. The circuit layer includes first and second activation devices connected to the energy delivery device, the first and second activation devices to activate the energy delivery device, first drive logic coupled to the first activation device, and second drive logic coupled to the second activation device. An interconnect layer couples a same address selection signal to the first drive logic and the second drive logic.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: March 30, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Eric T. Martin, Chris Bakker, James R. Przybyla
  • Publication number: 20210053343
    Abstract: A fluidic die including fluid chambers, each including an electrode exposed to an interior of the fluid chamber and each having a corresponding fluid actuator operating at a first voltage level. Monitoring circuitry, operating at a second voltage level lower than the first voltage level, includes a select transistor and a pulldown transistor for each fluid chamber to selectively couple to the electrode, at least the select transistor being a high voltage tolerant transistor to operate at the second voltage in a normal operating condition and having a breakdown voltage level greater than the first voltage level to prevent a fault current from flowing into the select transistor from the electrode in a fault condition if the fluid actuator short-circuits to the electrode.
    Type: Application
    Filed: May 15, 2018
    Publication date: February 25, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Eric Martin, James R. Przybyla, Rogelio Cicili