Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes an array of fluid actuators grouped into primitives. Each actuator is disposed in a fluid chamber. The fluidic die also includes an array of fluid sensors. Each fluid sensor is disposed within a fluid chamber and determines a characteristic within the fluid chamber. A data parser of the fluidic die extracts from an incoming signal, firing instructions and measurement instructions for the fluidic die. The measurement instructions indicate at least one of a peak measurement during a nucleation event and a reference measurement during a non-nucleation event. A firing controller generates firing signals based on the firing instructions and a measurement controller activates, during a measurement interval of a printing cycle for the primitive, a measurement for a selected actuator based on the measurement instructions.

Abstract: In some examples, a system includes a device support to receive a fluid dispensing device, and a controller to identify, based on data controlling activation of fluidic actuators, a fluidic actuator that is to be activated in a first activation cycle of a group of activation cycles that correspond to activation intervals of respective fluidic actuators of a group of fluidic actuators of the fluid dispensing device, the identified fluidic actuator being part of the group of fluidic actuators. To perform a sense measurement for the identified fluidic actuator, the controller suppresses activation of the identified fluidic actuator in the first activation cycle, and causes activation of the identified fluidic actuator in a sense measurement cycle different from the first activation cycle, the sense measurement cycle being part of the group of activation cycles.

Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.

Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.

Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.

Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, and a number of heat exchangers thermally coupled to an ejection side of the fluid ejection die. Further, the fluid ejection device may include a number of cooling channels defined in the moldable material thermally coupled to the heat exchangers.

Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid recirculation pumps within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of heat exchangers thermally coupled to a fluid channel side of the fluid ejection die.

Abstract: Examples include a fluidic die. The fluidic die may comprise an array of fluid actuators, an actuation data register, a mask register, and actuation logic. The actuation data register may store actuation data that indicates fluid ejectors to actuate for a set of actuation events. The mask register may store mask data that indicates a set of fluid actuators enabled for actuation for a respective actuation event of the set of actuation events. The actuation logic may electrically actuate a subset of the fluid actuators based at least in part on the actuation data register and the mask register for the respective actuation event.

Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, and a number of heat exchangers thermally coupled to an ejection side of the fluid ejection die. Further, the fluid ejection device may include a number of cooling channels defined in the moldable material thermally coupled to the heat exchangers.

Abstract: According to an example, a fluid ejection device may include a substrate, a resistor positioned on the substrate, an overcoat layer positioned over the resistor, a fluidics layer having surfaces that form a firing chamber about the resistor, in which the overcoat layer is positioned between the resistor and the firing chamber, and a thin film membrane covering the surfaces of the fluidics layer that form the firing chamber and a portion of the overcoat layer that is in the firing chamber.

Abstract: In some examples, a circuit for a fluid ejection device includes an energy delivery device and a circuit layer. The circuit layer includes first and second activation devices connected to the energy delivery device, the first and second activation devices to activate the energy delivery device, first drive logic coupled to the first activation device, and second drive logic coupled to the second activation device. An interconnect layer couples a same address selection signal to the first drive logic and the second drive logic.

Abstract: Printheads and techniques for manufacturing printheads are disclosed. An example method includes forming drive circuit components in a circuit layer. The method also includes forming a fluidic device that causes fluid to be ejected from a nozzle. The method also includes forming an interconnect layer that couples the drive circuit components.

Abstract: A check valve for preventing reverse flow of jettable material within a jettable material firing chamber during a firing event includes a free-floating plug. The check valve further includes at least one holding post, wherein the free-floating plug is arranged between at least one wail of the firing chamber and the holding posts, the at least one wall and the holding posts restricting the movement of the free-floating plug within the chamber.

Abstract: According to an example, a fluid ejection device may include a substrate, a resistor positioned on the substrate, an overcoat layer positioned over the resistor, a fluidics layer having surfaces that form a firing chamber about the resistor, in which the overcoat layer is positioned between the resistor and the firing chamber, and a thin film membrane covering the surfaces of the fluidics layer that form the firing chamber and a portion of the overcoat layer that is in the firing chamber.

Abstract: Printheads and techniques for manufacturing printheads are disclosed. An example method includes forming drive circuit components in a circuit layer. The method also includes forming a fluidic device that causes fluid to be ejected from a nozzle. The method also includes forming an interconnect layer that couples the drive circuit components.

Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.

Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.

Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.

Abstract: The present disclosure describes a printhead circuit, devices, and methods of forming the printhead circuit. An example of a printhead circuit includes a substrate including a slot having a first, a second, and a third dimension in the substrate, circuitry on a first side and a second side of the slot, and a number of conductor traces routed across the slot along substantially a same geometrical plane as the circuitry on the first side and the second side of the slot.

Abstract: A spectrophotometer includes a plurality of sensor elements arranged together, each sensor element including a filter; a light sensor optically coupled with an output of the filter; and a barrier that surrounds the filter and light sensor and a space between the filter and light sensor. For each sensor element, the barrier blocks light that has not passed through the filter from reaching the light sensor including such that light from one sensor element is not detected by another of the sensor elements.