Abstract: A data receiver is provided which is operable to receive a signal controllably pre-distorted and transmitted by a transmitter, to generate information for adjusting the pre-distortion applied to the signal transmitted by the transmitter, and to transmit the information to the transmitter. The receiver is further operable to perform adaptive equalization to receive the signal transmitted by the transmitter.

Abstract: A structure and method for power distribution to a network for an integrated circuit chip complex are provided. The chip complex has at least two sectors, each having at least one power providing connection with at least one of said connections beings individually addressable by, and isolatable from, a given power source. At least one MEMS is positioned to selectively connect and disconnect said at least one connection to and from said given power source.

Abstract: According to one embodiment of the present invention, a microwave or millimeter wave module includes a dielectric layer having a pocket formed substantially through the dielectric layer. The dielectric is attached to a metal substrate. The pocket has substantially vertical sidewalls. An integrated circuit is disposed in the pocket. Opposing sides of the integrated circuit are substantially parallel to the sidewalls of the pocket. An interconnect electrically couples the integrated circuit to a bond pad disposed on the outer surface of the dielectric layer. The interconnect has a length that is minimized to result in reduced inductance of the semiconductor device.

Abstract: In one embodiment, a hermetic covering system includes a projectile and at least one bag. The projectile has a body and a component that houses moisture-sensitive equipment. The at least one bag may be coupled to the body such that the projectile protrudes through the opening and the component is disposed in the inner cavity to protect the component during storage of the projectile.

Abstract: A design structure embodied in a machine readable medium used in a design process can include apparatus of a semiconductor chip operable to detect an increase in resistance of a monitored element of the semiconductor chip. The design structure can include, for example, a resistive voltage divider circuit operable to output a plurality of reference voltages having different values. A plurality of comparators in the semiconductor chip may be coupled to receive the reference voltages and a monitored voltage representative of a resistance of the monitored element. Each of the comparators may produce an output indicating whether the monitored voltage exceeds the reference voltages, so that the resistance value of the monitored element may be precisely determined.

Abstract: According to one embodiment of the present invention, a microwave or millimeter wave module includes a dielectric layer having a pocket formed substantially through the dielectric layer. The dielectric is attached to a metal substrate. The pocket has substantially vertical sidewalls. An integrated circuit is disposed in the pocket. Opposing sides of the integrated circuit are substantially parallel to the sidewalls of the pocket. An interconnect electrically couples the integrated circuit to a bond pad disposed on the outer surface of the dielectric layer. The interconnect has a length that is minimized to result in reduced inductance of the semiconductor device.

Abstract: A data receiver is provided which includes a front end interface circuit having an alternating current (AC) transmission receiving mode and a direct current (DC) transmission receiving mode. The front end interface circuit includes an offset compensation circuit operable to compensate a DC voltage offset between a pair of differential signals input to the data receiver. The front end interface circuit further includes an AC/DC selection unit operable to switch between (a) the DC transmission receiving mode, and (b) the AC transmission receiving mode, such that the data receiver is operable in (i) the DC transmission mode in which the offset compensation circuit is disabled, (ii) the DC transmission mode in which the offset compensation circuit is enabled, (iii) the AC transmission mode in which the offset compensation circuit is disabled, and (iv) the AC transmission receiving mode in which the offset compensation circuit is enabled.

Abstract: According to one embodiment of the present invention, a microwave or millimeter wave module includes a dielectric layer having a pocket formed substantially through the dielectric layer. The dielectric is attached to a metal substrate. The pocket has substantially vertical sidewalls. An integrated circuit is disposed in the pocket. Opposing sides of the integrated circuit are substantially parallel to the sidewalls of the pocket. An interconnect electrically couples the integrated circuit to a bond pad disposed on the outer surface of the dielectric layer. The interconnect has a length that is minimized to result in reduced inductance of the semiconductor device.

Abstract: According to an embodiment of the present invention, a subassembly for a phased array radar includes a substrate generally lying in a first plane, the substrate including a plurality of transmit/receive modules coupled to a mounting surface and a plurality of radiating elements formed adjacent the mounting surface, and a multi-function board generally lying in a second plane parallel to the first plane. The multi-function board is in spaced apart relation to the substrate and may include RF manifolding and logic/power distribution functions for the transmit/receive modules.

Abstract: A circuit and method of testing an analog driver circuit using digital scan-based test methodologies. The circuit of the present invention comprises a control circuit for generating signals in response to a test enable signal, a differential driver circuit for receiving a differential input signal, amplifying the differential input signal and transmitting a differential output signal in response to the differential input signal and the signals generated by the control circuit, a programmable termination impedance circuit for generating a differential termination impedance at the output node of the differential driver circuit in response the signals generated by the control circuit, and a differential receiver circuit for receiving the differential output from the differential driver circuit, convert the differential output signal to a single ended signal and transmitting the single ended signal, all in response to the test enable signal.

Abstract: A circuit of testing an analog driver circuit using digital scan-based test methodologies. The circuit of the present invention includes a control circuit for generating signals in response to a test enable signal, a differential driver circuit for receiving a differential input signal, amplifying the differential input signal and transmitting a differential output signal in response to the differential input signal and the signals generated by the control circuit, a programmable termination impedance circuit for generating a differential termination impedance at the output node of the differential driver circuit in response the signals generated by the control circuit, and a differential receiver circuit for receiving the differential output from the differential driver circuit, convert the differential output signal to a single ended signal and transmitting the single ended signal, all in response to the test enable signal.

Abstract: A data receiver is provided which is operable to receive a signal controllably pre-distorted and transmitted by a transmitter, to generate information for adjusting the pre-distortion applied to the signal transmitted by the transmitter, and to transmit the information to the transmitter. The receiver is further operable to perform adaptive equalization to receive the signal transmitted by the transmitter.

Abstract: In one embodiment, a polarization control system for an antenna array comprises a number of first and second antenna elements and a beam forming network. The first antenna elements have a direction of polarization that is different from a direction of polarization of the second antenna elements. The beam forming network, which is coupled to the first and second antenna elements, is operable to provide a second signal to a first subset of the plurality of first antenna elements that is different from a first signal that is provided to the other first antenna elements and provide a third signal to a second subset of the second antenna elements that is different from the first signal that is provided to the other second antenna elements.

Abstract: According to an embodiment of the present invention, a multi-function carrier structure for a phased array radar includes a substrate that includes a mounting surface for a plurality of transmit/receive modules, a plurality of radiating elements integrally formed in the substrate adjacent the mounting surface, and a plurality of cooling channels integrally formed within a thickness of the substrate. The substrate is formed from a material having a coefficient of thermal expansion similar to respective substrates of the transmit/receive modules.

Abstract: A method of varying the gain of an amplifier and an amplifier array are provided. The amplifier array includes two or more amplifier stages (201, 202) connected in parallel with each amplifier stage having a gain control means. Input signal means (203, 204) are provided for each amplifier stage with the input signals of the amplifier stages being of different amplitude. Means for enabling and disabling an amplifier stage (216) are provided and means for summing the outputs of the enabled amplifier stages obtain an output signal (212).

Abstract: An apparatus and method for providing standby power to a node of a distributed system of devices. The apparatus includes: a current manager operable to manage supply of current to a device at the node; a normal current supplier operable to supply normal operating current to the device; and a super capacitor at the node operable to supply standby operating current to the device under control of the current manager when the normal current supplier fails to supply the normal operating current to the device. The apparatus preferably further comprises a switching regulator, operable in electrical communication with the super capacitor and the device, to regulate the standby operating current to the device.

Abstract: A method is provided for monitoring interconnect resistance within a semiconductor chip assembly. A semiconductor chip assembly can include a semiconductor chip having contacts exposed at a surface of the semiconductor chip and a substrate having exposed terminals in conductive communication with the contacts. A plurality of monitored elements of the semiconductor chip can include conductive interconnects, each interconnecting a respective pair of nodes of the semiconductor chip through wiring within the semiconductor chip. In an example of such method, a voltage drop across each monitored element is compared with a reference voltage drop across a respective reference element on the semiconductor chip at a plurality of different times during a lifetime of the semiconductor chip assembly. In that way, it can be detected when a resistance of such monitored element is over threshold. Based on a result of such comparison, a decision can be made whether to indicate an action condition.

Abstract: A data receiver is provided which is operable to receive a signal controllably pre-distorted and transmitted by a transmitter, to generate information for adjusting the pre-distortion applied to the signal transmitted by the transmitter, and to transmit the information to the transmitter. The receiver is further operable to perform adaptive equalization to receive the signal transmitted by the transmitter.

Abstract: A method of varying the gain of an amplifier and an amplifier array are provided. The amplifier array includes two or more amplifier stages (201, 202) connected in parallel with each amplifier stage having a gain control means. Input signal means (203, 204) are provided for each amplifier stage with the input signals of the amplifier stages being of different amplitude. Means for enabling and disabling an amplifier stage (216) are provided and means for summing the outputs of the enabled amplifier stages obtain an output signal (212).

Abstract: A packaged semiconductor chip is provided which includes a semiconductor chip and a package element. The semiconductor chip includes a plurality of semiconductor devices and a plurality of conductive features disposed at an exterior face of the semiconductor chip. The package element has a plurality of external features conductively connected to the plurality of conductive features of the semiconductor chip. The semiconductor chip includes a monitored element including a conductive interconnect that conductively interconnects a first node of the semiconductor chip to a second node of the semiconductor chip. A detection circuit in the semiconductor chip is operable to compare a variable voltage drop across the monitored element with a reference voltage drop across a reference element on the chip at a plurality of different times during a lifetime of the packaged semiconductor chip so as to detect when the resistance of the monitored element is over threshold.