Abstract: A dual chamber LP system includes an aLP and a vLP that collectively provide AAI+VVI operation, and selectively transition from the AAI+VVI operation to collectively providing coordinated dual chamber operation (e.g., DDD operation, but not limited thereto), and vice versa. While providing the AAI operation, the aLP performs atrial pacing when an intrinsic atrial event is not detected within a specified AA interval, performs atrial sensing, and inhibits the atrial pacing when the intrinsic atrial event is detected within the specified AA interval. While providing the VVI operation, the vLP performs ventricular pacing when an intrinsic ventricular event is not detected within a specified VV interval, performs ventricular sensing, and inhibits the ventricular pacing when the intrinsic ventricular event is detected within the specified VV interval.

Abstract: Techniques for assembling an integrated assembly are provided. An example method can include injecting a polymer into a mold of a housing base. The method can further include cooling the mold to form the housing base, the housing base forming a compartment. The method can further include arranging a first sensor in the compartment, the first sensor to be connected to the housing base. The method can further include arranging a light source in the compartment inward from the first sensor and the first opening. The method can further include sealing the first opening of the housing base with a cover plate, the cover plate comprising a second opening for permitting a light from the light source to be emitted to form an integrated sensor assembly.

Abstract: An integrated sensor assembly is described. The integrated sensor assembly can include a housing arranged on a side surface of a cabin of an autonomous vehicle and a threshold elevation from a reference surface. The integrated sensor assembly can further include a first sensor arranged in a compartment of the housing. The integrated sensor assembly can further include an arm connected at a first end to the housing and connected at a second end to the side surface of the cabin. The integrated sensor assembly can further include an actuator for rotating the arm between a first state and a second state, the arm and the housing arranged externally to the side surface in the first state and the second state. The integrated sensor assembly can further include a light source arranged in the compartment.

Abstract: An integrated sensor assembly is described. The integrated sensor assembly can include a housing comprising a compartment. The housing can be arranged on a side surface of a cabin of an autonomous vehicle and within a threshold distance of a cabin roof of the autonomous vehicle. The assembly can include a first sensor arranged in the compartment, the first sensor configured to receive a first signal from a vehicle computer and collect information for mapping an environment of the autonomous vehicle. The assembly can include a light source arranged in the compartment. The light source configured to receive a second signal from the vehicle computer and emit a light pattern for visually indicating one of a hazard, a turn, or an autonomous mode. The light source can be arranged in the compartment to emit light to traffic toward a rear of the autonomous vehicle.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: An authentication server may not support all types of user credentials. For example, an on-premise authentication server may support credentials based on user secrets (i.e. username and password) and certificate-based credentials, but not hardware-key based credentials. A client device may use an un-supported type of credential to access resources managed by the on-premise authentication server by authenticating with a web-based authentication server. The web-based authentication server may support any type of credential, and the supported types of credentials may change over time. The web-based authentication server returns an authenticated user token indicating the user has been authenticated, but without authorizing access to any resources. The client device uses the on-premise authentication server to exchange the authenticated user token for an authorized user token. The client device then uses the authorized user token to access resources on the on-premise network.

Abstract: An authentication server may not support all types of user credentials. For example, an on-premise authentication server may support credentials based on user secrets (i.e. username and password) and certificate-based credentials, but not hardware-key based credentials. A client device may use an un-supported type of credential to access resources managed by the on-premise authentication server by authenticating with a web-based authentication server. The web-based authentication server may support any type of credential, and the supported types of credentials may change over time. The web-based authentication server returns an authenticated user token indicating the user has been authenticated, but without authorizing access to any resources. The client device uses the on-premise authentication server to exchange the authenticated user token for an authorized user token. The client device then uses the authorized user token to access resources on the on-premise network.

Abstract: An occupancy alerting device for warning a driver of a child occupant in a vehicle includes a housing that is configured to be positioned in a passenger compartment of a vehicle by a driver who is transporting a child. A power module, a microprocessor, and a detector are coupled to the housing and are positioned in an interior space defined by the housing. A speaker is coupled to the housing. The microprocessor is operationally coupled to the power module, the detector, and the speaker. The detector is motion type and thus is configured to detect motion of the vehicle. The microprocessor is positioned to selectively actuate the speaker, based on a motion status of the vehicle, to broadcast an occupancy alert to an area proximate to the housing to alert the driver to the child in the vehicle.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: An applicator assembly for applying a cord to a tire-building surface that rotates during tire construction. The applicator assembly includes an applicator member to apply the cord. A first rotary device rotates the applicator member about a first axis that is transverse to the surface. A first translation device moves the applicator member in a first linear path relative to the surface. The applicator member may include a roller and/or a resilient member. A second rotary device may rotate the applicator member and the first rotary device around a second axis substantially perpendicular to the first axis. A second translation device may move the applicator member, the first rotary device, the second rotary device, and the first translation device. A system for applying the cord to a core member may further include a spindle to rotate the core member about the axis of rotation.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.

Abstract: A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

Abstract: A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

Abstract: A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

Abstract: A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

Abstract: A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs of process drift, analyzing of the process condition parameters to determine which are limiting and affecting the chip yields, analyzing the changes in the process condition parameters to determine the corrections that should be fed back into the lithography process or forwarded to an etch process, identifying specific masks that do not transfer the intended pattern to wafers as intended, and identifying groups of masks that share common characteristics and behave in a similar manner with respect to changes in process condition parameters when transferring the pattern to the wafer.

Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.