Patents by Inventor Jan Richter

Jan Richter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190302725
    Abstract: The present invention relates to a method for generating control data for the secondary machining of a solid body (1), in particular wafer, which is modified by means of laser beams (10). The interior of said solid body (1) has multiple modifications (12), said modifications (12) having been produced by means of laser beams (10).
    Type: Application
    Filed: July 13, 2017
    Publication date: October 3, 2019
    Inventors: Marko Swoboda, Ralf Rieske, Jan Richter, Franz Schilling
  • Publication number: 20190237359
    Abstract: A method for the production of layers of solid material is contemplated. The method may include the steps of providing a solid body for the separation of at least one layer of solid material, generating defects by means of at least one radiation source, in particular a laser, in the inner structure of the solid body in order to determine a detachment plane along which the layer of solid material is separated from the solid body, and applying heat to a polymer layer disposed on the solid body in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the detachment plane, which crack separates the layer of solid material from the solid body.
    Type: Application
    Filed: April 9, 2019
    Publication date: August 1, 2019
    Inventors: Wolfram Drescher, Jan Richter, Christian Beyer
  • Publication number: 20190218131
    Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the centre (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).
    Type: Application
    Filed: March 21, 2019
    Publication date: July 18, 2019
    Inventors: Marko Swoboda, Christian Beyer, Franz Schilling, Jan Richter
  • Patent number: 10310470
    Abstract: A method for stipulating a starting time for an update for a control apparatus that controls at least one peripheral component in a process automation installation by producing control outputs is disclosed. The update requires at least one predetermined down time. The invention is based on a suitable starting time for performing an update in order to perform an update in the course of operation of a process automation installation without risk. The method involves detecting a current operating state for the at least one peripheral component, taking the detected operating state as a basis for using a controlled system model of the process to simulate what state trajectory the at least one peripheral component negotiates within the down time for a predetermined static control output, and checking whether the state trajectory lies exclusively within a range of admissible operating states, and, if appropriate, starting the update.
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: June 4, 2019
    Assignee: SIEMENTS AKTIENGESELLSCHAFT
    Inventors: Thomas Grosch, Jan Richter
  • Patent number: 10312135
    Abstract: A method for the production of layers of solid material is contemplated. The method may include the steps of providing a solid body for the separation of at least one layer of solid material, generating defects by means of at least one radiation source, in particular a laser, in the inner structure of the solid body in order to determine a detachment plane along which the layer of solid material is separated from the solid body, and applying heat to a polymer layer disposed on the solid body in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the detachment plane, which crack separates the layer of solid material from the solid body.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: June 4, 2019
    Assignee: Siltectra, GmbH
    Inventors: Wolfram Drescher, Jan Richter, Christian Beyer
  • Patent number: 10289636
    Abstract: A method and system for accessing database tables that contain binary large objects (BLOBs) is disclosed. The method includes encapsulating BLOB-based tables with virtual tables, which allows a user to access the content of the BLOBs via SQL. In one example, the virtual table has a generic table structure that consists of columns (e.g., class name, field name, and field value) and information regarding what level of an object hierarchy contains an element. In another example, a user can define the structure of the virtual table by identifying which object attributes to report.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: May 14, 2019
    Assignee: HERE Global B.V.
    Inventors: Martin Pfeifle, Jan Richter, Alexander Barthel
  • Patent number: 10280107
    Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the center (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: May 7, 2019
    Assignee: Siltectra, Gmbh
    Inventors: Marko Swoboda, Christian Beyer, Franz Schilling, Jan Richter
  • Patent number: 10255386
    Abstract: A system is provided that facilitates design space exploration with quantitative pruning and ranking. The system may determine a collection of component model solutions corresponding to a functional model with functional model ports for a system to be produced. The component model solutions are comprised of simulated components selected from a component library based at least in part on correspondence between component ports of the simulated components and the functional model ports of the functional model. The system may select a subset of the component model solutions from the collection, which have behaviors determined for each component model solution that are consistent with behaviors determined for the functional model. The system may determine rankings for the component model solutions of the subset relative to each other based on a comparison of behaviors for each component model solution to each other and/or to the behaviors determined for the functional model.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: April 9, 2019
    Assignee: Siemens Product Lifecycle Management Software Inc.
    Inventors: Arquimedes Martinez Canedo, Jan Richter, Lars Jordan
  • Publication number: 20190099838
    Abstract: The invention relates to a method for detaching at least one solid body layer (14) from a solid body (1), wherein by means of the modifications (2) a crack guiding region (4) is provided for guiding a crack in order to detach a solid body portion (6), in particular a solid body layer, from the solid body (1).
    Type: Application
    Filed: March 22, 2017
    Publication date: April 4, 2019
    Inventors: Ralf Rieske, Marko Swoboda, Jan Richter
  • Publication number: 20190096746
    Abstract: Providing a solid body to be split into a number of layers of solid material, introducing or generating defects in the solid body in order to determine a first detachment plane (8) along which a first layer of solid material is separated from the solid body, providing a receiving layer for holding the layer of solid material on the solid body, applying heat to the receiving layer in order to generate, in particular mechanically, stresses in the solid body, due to the stresses a crack propagating in the solid body along the detachment plane, which crack separates the first layer of solid material from the solid body, then providing a second receiving layer for holding another layer of solid material on the solid body reduced by the first layer of solid material, introducing or generating defects in the solid body in order to determine a second detachment plane (9) along which a second layer of solid material is separated from the solid body, applying heat to the second receiving layer in order to generate, in
    Type: Application
    Filed: November 26, 2018
    Publication date: March 28, 2019
    Inventors: Wolfram Drescher, Jan Richter
  • Patent number: 10229835
    Abstract: The overall yield of a splitting method for division of a solid-state starting material into at least two solid-state pieces is increased by use of a polymer hybrid material comprising one or more fillers in a polymer matrix. A corresponding splitting method comprises the steps of providing the solid-state starting material with at least one exposed surface, applying a polymer hybrid material comprising fillers in a polymer matrix to at least one exposed surface of the solid-state starting material, so as to result in a composite structure, and subjecting the composite structure to a stress field such that the solid-state starting material is split along a plane within the solid-state starting material into at least two solid-state pieces.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: March 12, 2019
    Inventors: Wolfram Drescher, Jan Richter, Christian Beyer
  • Publication number: 20190071552
    Abstract: A polymer hybrid material, a film comprising the polymer hybrid material, the use of the polymer hybrid material, a splitting method using the polymer hybrid material, and a method for producing the polymer hybrid material are provided for increasing the total yield, i.e. the efficiency with respect to the raw materials used and other resources such as energy and workforce, of a splitting method. The polymer hybrid material for use in a splitting method has at least two solid-body sections produced from a solid-body starting material. The polymer hybrid material comprises a polymer matrix and a first filler and a second filler embedded into the polymer matrix.
    Type: Application
    Filed: March 23, 2017
    Publication date: March 7, 2019
    Applicant: SILTECTRA GMBH
    Inventors: Christian BEYER, Jan RICHTER, Marko SWOBODA
  • Publication number: 20180370073
    Abstract: The invention relates to a method for separating solid-body slices (1) from a donor substrate (2).
    Type: Application
    Filed: June 23, 2016
    Publication date: December 27, 2018
    Inventors: Marko Swoboda, Christian Beyer, Franz Schilling, Jan Richter
  • Patent number: 10141219
    Abstract: A method for producing layers of solid material is contemplated.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: November 27, 2018
    Assignee: Siltectra GmbH
    Inventors: Wolfram Drescher, Jan Richter
  • Publication number: 20180290232
    Abstract: The invention relates to a method for creating a detachment zone in a solid in order to detach a solid portion, especially a solid layer, from the solid, said solid portion that is to be detached being thinner than the solid from which the solid portion has been removed.
    Type: Application
    Filed: June 8, 2018
    Publication date: October 11, 2018
    Inventors: Jan Richter, Christian Beyer, Ralf Rieske
  • Patent number: 10079171
    Abstract: The present invention relates to a method for the production of at least one three-dimensional layer of solid material, in particular for usage as wafer, and/or at least one tree-dimensional solid body.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: September 18, 2018
    Assignee: Siltectra, GmbH
    Inventor: Jan Richter
  • Publication number: 20180243944
    Abstract: The invention relates to a method for producing a multi-layer assembly.
    Type: Application
    Filed: April 7, 2016
    Publication date: August 30, 2018
    Inventors: Franz Schilling, Wolfram Drescher, Jan Richter
  • Publication number: 20180233373
    Abstract: The overall yield of a splitting method for division of a solid-state starting material into at least two solid-state pieces is increased by use of a polymer hybrid material comprising one or more fillers in a polymer matrix. A corresponding splitting method comprises the steps of providing the solid-state starting material with at least one exposed surface, applying a polymer hybrid material comprising fillers in a polymer matrix to at least one exposed surface of the solid-state starting material, so as to result in a composite structure, and subjecting the composite structure to a stress field such that the solid-state starting material is split along a plane within the solid-state starting material into at least two solid-state pieces.
    Type: Application
    Filed: October 6, 2015
    Publication date: August 16, 2018
    Applicant: SILTECTRA GMBH
    Inventors: Wolfram DRESCHER, Jan RICHTER, Christian BEYER
  • Patent number: 10029277
    Abstract: The invention relates to a method of producing at least one layer of solid material.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: July 24, 2018
    Assignee: Siltectra, GmbH
    Inventors: Lukas Lichtensteiger, Jan Richter, Wolfram Drescher
  • Publication number: 20180185957
    Abstract: The present invention relates to a method for separating solid-body slices (1) from a donor substrate (2). The method comprises the steps of: producing modifications (10) within the donor substrate (2) by means of laser beams (12), wherein a detachment region is predefined by the modifications (10), along which detachment region the solid-body layer (1) is separated from the donor substrate (2), and removing material from the donor substrate (2), starting from a surface (4) extending in the peripheral direction of the donor substrate (2), in the direction of the centre (Z) of the donor substrate (2), in particular in order to produce a peripheral indentation (6).
    Type: Application
    Filed: June 23, 2016
    Publication date: July 5, 2018
    Inventors: Marko Swoboda, Christian Beyer, Franz Schilling, Jan Richter