Patents by Inventor Jan Visser

Jan Visser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220310448
    Abstract: Embodiments of the present disclosure relate to processes for filling trenches. The process includes depositing a first amorphous silicon layer on a surface of a layer and a second amorphous silicon layer in a portion of a trench formed in the layer, and portions of side walls of the trench are exposed. The first amorphous silicon layer is removed. The process further includes depositing a third amorphous silicon layer on the surface of the layer and a fourth amorphous silicon layer on the second amorphous silicon layer. The third amorphous silicon layer is removed. The deposition/removal cyclic processes may be repeated until the trench is filled with amorphous silicon layers. The amorphous silicon layers form a seamless amorphous silicon gap fill in the trench since the amorphous silicon layers are formed from bottom up.
    Type: Application
    Filed: June 13, 2022
    Publication date: September 29, 2022
    Inventors: Xin LIU, Fei WANG, Rui CHENG, Abhijit Basu MALLICK, Robert Jan VISSER
  • Publication number: 20220293888
    Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) separated by gaps, and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a bilayer having a plurality of polymer projections on the display layer, the plurality of polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of polymer projections and an underlying surface in the spaces between the polymer projections, the dielectric layer forming side walls along sides of the polymer projections. The side walls are aligned with the gaps between the OLEDS, and/or the encapsulation layer has multiple bilayers.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 15, 2022
    Inventors: Kyuil Cho, Byung Sung Kwak, Robert Jan Visser
  • Publication number: 20220293878
    Abstract: A light-emitting diode (LED) structure includes a light-emitting diode including an emissive electroluminescent layer situated between two electrodes, a light extraction layer (LEL) comprising a UV-cured ink, and a UV blocking layer between the LEL and the light-emitting diode. The UV blocking layer has a thickness of 50-500 nm and at least 90% absorption to UV light of wavelengths for curing the UV-cured ink.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 15, 2022
    Inventors: Gang Yu, Chung-Chia Chen, Wan-Yu Lin, Hyunsung Bang, Lisong Xu, Byung Sung Kwak, Robert Jan Visser
  • Publication number: 20220267904
    Abstract: Methods of depositing a metal film by exposing a substrate surface to a halide precursor and an organosilane reactant are described. The halide precursor comprises a compound of general formula (I): MQzRm, wherein M is a metal, Q is a halogen selected from Cl, Br, F or I, z is from 1 to 6, R is selected from alkyl, CO, and cyclopentadienyl, and m is from 0 to 6. The aluminum reactant comprises a compound of general formula (II) or general formula (III): wherein R1, R2, R3, R4, R5, R6, R7, R8, Ra, Rb, Rc, Rd, Re, and Rf are independently selected from hydrogen (H), substituted alkyl or unsubstituted alkyl; and X, Y, X?, and Y? are independently selected from nitrogen (N) and carbon (C).
    Type: Application
    Filed: May 3, 2022
    Publication date: August 25, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Geetika Bajaj, Darshan Thakare, Prerna Sonthalia Goradia, Robert Jan Visser, Yixiong Yang, Jacqueline S. Wrench, Srinivas Gandikota
  • Publication number: 20220270870
    Abstract: A processing method comprises positioning a substrate in a processing chamber and setting a temperature of the substrate to a range of 50° C. to 500° C.; conducting an atomic layer deposition (ALD) cycle on the substrate; and repeating the ALD cycle to form a silicon oxide film. The ALD cycle comprises: exposing the substrate to an aminosilane precursor in the processing chamber by pulsing a flow of the aminosilane precursor; purging the processing chamber of the aminosilane precursor; exposing the substrate to an oxidizing agent by pulsing a flow of the oxidizing agent for a duration in a range of greater than or equal to 100 milliseconds to less than or equal to 3 seconds; and purging the processing chamber of the oxidizing agent.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 25, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Geetika Bajaj, Prerna Sonthalia Goradia, Seshadri Ganguli, Srinivas Gandikota, Robert Jan Visser, Suraj Rengarajan
  • Publication number: 20220252780
    Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.
    Type: Application
    Filed: April 27, 2022
    Publication date: August 11, 2022
    Inventors: Michael Yu-tak YOUNG, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN, Robert Jan VISSER
  • Publication number: 20220246888
    Abstract: A method of encapsulating an organic light-emitting diode display includes depositing a plurality of first polymer projections onto a light-emitting side of a display layer having a plurality of organic light-emitting diodes (OLEDs) such that the plurality of first polymer projections have spaces therebetween that expose an underlying surface, and conformally coating the first polymer projections and the spaces between the first polymer projections with a first dielectric layer such that the first dielectric layer has side walls along sides of the first polymer projections and defines wells in spaces between the side walls.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 4, 2022
    Inventors: Kyuil Cho, Byung Sung Kwak, Robert Jan Visser
  • Publication number: 20220223811
    Abstract: A light-emitting diode display including a substrate having a driving circuitry and a plurality of light emitting diode structures disposed on the substrate. Each light-emitting diode structure has a light emitting diode with a light emission zone having a planar portion, and a pigmentless light extraction layer of a UV-cured ink disposed over the light-emitting diode. The light extraction layer has a gradient in index of refraction along an axis normal to the planar portion, and the index of refraction of the light extraction layer decreases with distance from the planar portion.
    Type: Application
    Filed: March 31, 2022
    Publication date: July 14, 2022
    Inventors: Gang Yu, Chung-Chia Chen, Wan-Yu Lin, Hyunsung Bang, Lisong Xu, Byung Sung Kwak, Robert Jan Visser
  • Publication number: 20220216450
    Abstract: Embodiments of the present disclosure relate to an apparatus and methods for forming arrays of EL devices and forming the EL devices with overlapped mask plates. The methods utilize overlapping a first mask plate and a second mask plate to form a mask arrangement having first apertures of the first mask plate overlapped with second apertures of the second mask plate forming one or more opening areas. A material is evaporated through the mask arrangement such that layers of the material are formed in a device area of the EL devices. The device area of each of the EL devices corresponds to the opening area of the mask arrangement of the first mask plate and the second mask plate. The method described herein allows for a higher density of the EL devices and creates a smaller deposition area due to the opening area of the mask arrangement.
    Type: Application
    Filed: January 6, 2021
    Publication date: July 7, 2022
    Inventors: Chung-Chia CHEN, Byung-Sung KWAK, Robert Jan VISSER
  • Patent number: 11361991
    Abstract: Embodiments of the present disclosure relate to processes for filling trenches. The process includes depositing a first amorphous silicon layer on a surface of a layer and a second amorphous silicon layer in a portion of a trench formed in the layer, and portions of side walls of the trench are exposed. The first amorphous silicon layer is removed. The process further includes depositing a third amorphous silicon layer on the surface of the layer and a fourth amorphous silicon layer on the second amorphous silicon layer. The third amorphous silicon layer is removed. The deposition/removal cyclic processes may be repeated until the trench is filled with amorphous silicon layers. The amorphous silicon layers form a seamless amorphous silicon gap fill in the trench since the amorphous silicon layers are formed from bottom up.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: June 14, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Xin Liu, Fei Wang, Rui Cheng, Abhijit Basu Mallick, Robert Jan Visser
  • Patent number: 11362307
    Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) separated by gaps, and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a bilayer having a plurality of polymer projections on the display layer, the plurality of polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of polymer projections and an underlying surface in the spaces between the polymer projections, the dielectric layer forming side walls along sides of the polymer projections. The side walls are aligned with the gaps between the OLEDS, and/or the encapsulation layer has multiple bilayers.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: June 14, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Kyuil Cho, Byung Sung Kwak, Robert Jan Visser
  • Patent number: 11359282
    Abstract: Methods of depositing a metal film by exposing a substrate surface to a halide precursor and an organosilane reactant are described. The halide precursor comprises a compound of general formula (I): MQzRm, wherein M is a metal, Q is a halogen selected from Cl, Br, F or I, z is from 1 to 6, R is selected from alkyl, CO, and cyclopentadienyl, and m is from 0 to 6. The aluminum reactant comprises a compound of general formula (II) or general formula (III): wherein R1, R2, R3, R4, R5, R6, R7, R8, Ra, Rb, Rc, Rd, Re, and Rf are independently selected from hydrogen (H), substituted alkyl or unsubstituted alkyl; and X, Y, X?, and Y? are independently selected from nitrogen (N) and carbon (C).
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: June 14, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Geetika Bajaj, Darshan Thakare, Prerna Goradia, Robert Jan Visser, Yixiong Yang, Jacqueline S. Wrench, Srinivas Gandikota
  • Patent number: 11355724
    Abstract: An organic light-emitting diode (OLED) structure includes a stack of OLED layers; a light extraction layer (LEL) comprising a UV-cured ink; and a UV blocking layer between the LEL and the stack of OLED layers.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: June 7, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Gang Yu, Chung-Chia Chen, Wan-Yu Lin, Hyunsung Bang, Lisong Xu, Byung Sung Kwak, Robert Jan Visser
  • Publication number: 20220165995
    Abstract: Embodiments of the present disclosure generally relate to electroluminescent (EL) devices. More specifically, embodiments described herein relate to methods for forming arrays of the EL devices and selectively patterning a filler material in the EL devices. The EL device formed from the methods described herein will have improved outcoupling efficiency because of the patterned filler. The methods described herein pattern the filler and provide large area, low cost, and high resolution EL device formation by not relying on ink-jet printing or thermal evaporation with a fine metal mask.
    Type: Application
    Filed: November 25, 2020
    Publication date: May 26, 2022
    Inventors: Chung-Chia CHEN, Byung-sung Leo KWAK, Robert Jan VISSER
  • Patent number: 11327218
    Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: May 10, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Michael Yu-tak Young, Wayne McMillan, Rutger Meyer Timmerman Thijssen, Robert Jan Visser
  • Publication number: 20220128522
    Abstract: Training a neural network processor is described for providing diagnostic information of a controlled liquid chromatography pump unit. The training includes executing a sequence of operations wherein the neural network processor is trained with input signals obtained from a simulated version of the controlled liquid chromatography pump unit and associated sensors, while modifying the simulated version of the liquid chromatography pump unit to a pump fault simulation signal. Dependent on a value of the pump fault simulation signal, the simulated version of the liquid chromatography pump unit simulates operation of the liquid chromatography pump unit free from faults or the operation thereof with one or more pump faults.
    Type: Application
    Filed: October 21, 2021
    Publication date: April 28, 2022
    Inventors: Jan VISSER, Richard Charles VAN GOOR, Paul Bernard Theo WEUSTINK
  • Publication number: 20220130663
    Abstract: Embodiments of the disclosure relate to methods of selectively depositing organic and hybrid organic/inorganic layers. More particularly, embodiments of the disclosure are directed to methods of modifying hydroxyl terminated surfaces for selective deposition of molecular layer organic and hybrid organic/inorganic films. Additional embodiments of the disclosure relate to cyclic compounds for use in molecular layer deposition processes.
    Type: Application
    Filed: December 27, 2021
    Publication date: April 28, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Tapash Chakraborty, Robert Jan Visser, Prerna Sonthalia Goradia
  • Patent number: 11296296
    Abstract: An organic light-emitting diode (OLED) structure includes a stack of OLED layers that includes a light emission zone having a planar portion, and a light extraction layer formed of a UV-cured ink disposed over the light emission zone of the stack of OLED layers. The light extraction layer has a gradient in index of refraction along an axis normal to the planar portion.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: April 5, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Gang Yu, Chung-Chia Chen, Wan-Yu Lin, Hyunsung Bang, Lisong Xu, Byung Sung Kwak, Robert Jan Visser
  • Patent number: 11280717
    Abstract: Methods and apparatuses for identifying contaminants in a semiconductor cleaning solution, including: contacting a semiconductor cleaning solution with a semiconductor manufacturing component to form an effluent including one or more insoluble analytes-of-interest; contacting the effluent including one or more insoluble analytes-of-interest with an optical apparatus configured to sense fluorescence and, optionally, Raman signals from the one or more insoluble analytes-of-interest, wherein the apparatus includes an electron multiplying charged couple device and a grating spectrometer to spectrally disperse the fluorescence and project the fluorescence on to the electron multiplying charged couple device; and identifying the one or more analytes of interest.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: March 22, 2022
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Prerna Goradia, Avishek Ghosh, Robert Jan Visser
  • Publication number: 20220082738
    Abstract: Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a film stack disposed on a substrate without planarization. The method includes forming a hardmask on a top surface of a film stack. Forming a mask material on a portion of the top surface and a portion of the hardmask. Etching the top surface. Trimming the mask. Etching the top surface again. Trimming the mask a second time. Etching the top surface yet again and then stripping the mask material.
    Type: Application
    Filed: November 24, 2021
    Publication date: March 17, 2022
    Inventors: Michael Yu-tak YOUNG, Ludovic GODET, Robert Jan VISSER, Naamah ARGAMAN, Christopher Dennis BENCHER, Wayne MCMILLAN