Abstract: A context-based protection system uses tiered protection structures including master protection units, shared memory protection units, a peripheral protection units to provide security to bus transfer operations between central processing units (CPUs), memory array or portions of arrays, and peripherals.

Abstract: A method is disclosed to estimate energy consumed by a component in a microcontroller during operation including identifying “event” activities, where the energy consumed by the component may be determined by the number of events executed by the component, and “duration” activities, where the energy consumed may be determined by the duration of time required to execute of the activity, and determining the energy consumed by the component based on the number of events/duration of time and an energy coefficient which corresponds to the amount of energy consumed by the component to execute the activity, under given operating conditions. In an embodiment, data transfers at a bus interface may represent event activities. Apparatus to estimate the energy consumed is disclosed including bus monitors to receive signals representing data transfers at a bus interface and provide signals indicating the number of data transfers executed.

Abstract: A method is disclosed to estimate energy consumed by a component in a microcontroller during operation including identifying “event” activities, where the energy consumed by the component may be determined by the number of events executed by the component, and “duration” activities, where the energy consumed may be determined by the duration of time required to execute of the activity, and determining the energy consumed by the component based on the number of events/duration of time and an energy coefficient which corresponds to the amount of energy consumed by the component to execute the activity, under given operating conditions. In an embodiment, data transfers at a bus interface may represent event activities. Apparatus to estimate the energy consumed is disclosed including bus monitors to receive signals representing data transfers at a bus interface and provide signals indicating the number of data transfers executed.

Abstract: Techniques for multiplexing between an execute-in-place (XIP) mode and a memory-mapped input/output (MMIO) mode for access to external memory devices are described herein. In an example embodiment, an IC device comprises a serial interface and a controller that is configured to communicate with external memory devices over the serial interface. The controller comprises a control register and a cryptography block. The control register is configured to indicate an XIP mode or a MMIO mode. Caches in XIP interfaces provide seamless access to multiple memories, or multiple portions of a single memory. The cryptography block is configured to encrypt and decrypt XIP data transfers to and from a first external memory device in the XIP mode, and to encrypt and decrypt MMIO data transfers to and from a second external memory device in the MMIO mode.

Abstract: Techniques for multiplexing between an execute-in-place (XIP) mode and a memory-mapped input/output (MMIO) mode for access to external memory devices are described herein. In an example embodiment, an IC device comprises a serial interface and a controller that is configured to communicate with external memory devices over the serial interface. The controller comprises a control register and a cryptography block. The control register is configured to indicate an XIP mode or a MMIO mode. Caches in XIP interfaces provide seamless access to multiple memories, or multiple portions of a single memory. The cryptography block is configured to encrypt and decrypt XIP data transfers to and from a first external memory device in the XIP mode, and to encrypt and decrypt MMIO data transfers to and from a second external memory device in the MMIO mode.

Abstract: Techniques for multiplexing between an execute-in-place (XIP) mode and a memory-mapped input/output (MMIO) mode for access to external memory devices are described herein. In an example embodiment, an IC device comprises a serial interface and a controller that is configured to communicate with external memory devices over the serial interface. The controller comprises a control register and a cryptography block. The control register is configured to indicate an XIP mode or a MMIO mode. The cryptography block is configured to encrypt and decrypt XIP data transfers to and from a first external memory device in the XIP mode, and to encrypt and decrypt MMIO data transfers to and from a second external memory device in the MMIO mode.

Abstract: Encryption/decryption techniques for external memory are described herein. In an example embodiment, a device comprises an internal memory and an external memory controller. The internal memory is configured to store a key. The external memory controller is configured to encrypt, with the key, an address for an access operation to an external memory device to obtain an encrypted address, and to encrypt or decrypt a block of data for the access operation based on the encrypted address.

Abstract: Techniques for multiplexing between an execute-in-place (XIP) mode and a memory-mapped input/output (MMIO) mode for access to external memory devices are described herein. In an example embodiment, an IC device comprises a serial interface and a controller that is configured to communicate with external memory devices over the serial interface. The controller comprises a control register and a cryptography block. The control register is configured to indicate an XIP mode or a MMIO mode. The cryptography block is configured to encrypt and decrypt XIP data transfers to and from a first external memory device in the XIP mode, and to encrypt and decrypt MMIO data transfers to and from a second external memory device in the MMIO mode.

Abstract: Techniques for multiplexing between an execute-in-place (XIP) mode and a memory-mapped input/output (MMIO) mode for access to external memory devices are described herein. In an example embodiment, an IC device comprises a serial interface and a controller that is configured to communicate with external memory devices over the serial interface. The controller comprises a control register and a cryptography block. The control register is configured to indicate an XIP mode or a MMIO mode. The cryptography block is configured to encrypt and decrypt XIP data transfers to and from a first external memory device in the XIP mode, and to encrypt and decrypt MMIO data transfers to and from a second external memory device in the MMIO mode.

Abstract: A method is disclosed to estimate energy consumed by a component in a microcontroller during operation including identifying “event” activities, where the energy consumed by the component may be determined by the number of events executed by the component, and “duration” activities, where the energy consumed may be determined by the duration of time required to execute of the activity, and determining the energy consumed by the component based on the number of events/duration of time and an energy coefficient which corresponds to the amount of energy consumed by the component to execute the activity, under given operating conditions. In an embodiment, data transfers at a bus interface may represent event activities. Apparatus to estimate the energy consumed is disclosed including bus monitors to receive signals representing data transfers at a bus interface and provide signals indicating the number of data transfers executed.

Abstract: A context-based protection system uses tiered protection structures including master protection units, shared memory protection units, a peripheral protection units to provide security to bus transfer operations between central processing units (CPUs), memory array or portions of arrays, and peripherals.

Abstract: Apparatus and methods of de-convolution for multi-phase scans of an array of electrodes are described. One programmable circuit includes a sequencer to initiate a multi-phase transmit (TX) scan of an array of electrodes to obtain capacitance data. The capacitance data is stored in one or more storage devices as convoluted capacitance data. The programmable circuit also includes a digital circuit block to read the convoluted capacitance data from the one or more storage devices, de-convolve the convoluted capacitance data to obtain de-convoluted capacitance data, and store the de-convoluted capacitance data in the one or more storage devices.

Abstract: Capacitive touch sensors and touchscreen data processing methods are provided. In one embodiment, the method includes sequentially integrating and converting charge from each of a plurality of sensing capacitors in an array to digital data, the digital data including sample values corresponding to a measured capacitance for each of the plurality of sensing capacitors. Noise is then separated from useful information by filtering the sample values on a sample-by-sample basis. Finally, the filtered sample values are summed and a position of at least one contact on the array determined using the filtered capacitance values. Other embodiments are also provided.

Abstract: A contact's interaction with a sensing array is subject to several external and internal stimuli which may impact a processing unit's confidence in the characteristics of that interaction or the presence of the interaction itself. Fidelity of user action is greatly improved with a step-wise and holistic analysis of a contact on an array of capacitance sensors, which allows for repetition of certain steps of processing or the entire operation if threshold confidence levels are not achieved.

Abstract: Apparatus and methods of de-convolution for multi-phase scans of an array of electrodes are described. One programmable circuit includes a sequencer to initiate a multi-phase transmit (TX) scan of an array of electrodes to obtain capacitance data. The capacitance data is stored in one or more storage devices as convoluted capacitance data. The programmable circuit also includes a digital circuit block to read the convoluted capacitance data from the one or more storage devices, de-convolve the convoluted capacitance data to obtain de-convoluted capacitance data, and store the de-convoluted capacitance data in the or more storage devices.

Abstract: Encryption/decryption techniques for external memory are described herein. In an example embodiment, a device comprises an internal memory and an external memory controller. The internal memory is configured to store a key. The external memory controller is configured to encrypt, with the key, an address for an access operation to an external memory device to obtain an encrypted address, and to encrypt or decrypt a block of data for the access operation based on the encrypted address.

Abstract: Apparatuses and methods of synchronizing a display driver integrated circuit (DDI) and a touch screen controller (TSC) integrated circuit that are coupled to a display integrated touch panel, such as an in-cell panel, and allowing multi-phase transmit (TX) scanning of the in-cell touch panel. One apparatus includes a DDI configured to receive signals on a video interface from a host processor over a video interface and to drive electrodes of a touch panel. The DDI is configured to receive control signals from a TSC over a control interface to drive different transmit (TX) phase sequences of a TX signal in different sensing interval on the electrodes of the touch panel.

Abstract: Different numbers of delay slots are assigned by a compiler/scheduler to each different type of jump operation in a pipelined processor system. The number of delay slots is variable and kept to the minimum needed by each type of jump operation. A compatible processor uses a corresponding number of branch delay slots to exploit the difference in predictability of different types of branch or jump operations. Different types of jump operations resolved their target addresses in different numbers of delay slots. As a result, the compiler/scheduler is able to generate more efficient code than for a processor with a fixed number of delay slots for all jump types, resulting in better processor performance.

Abstract: Apparatuses and methods of synchronizing a display driver integrated circuit (DDI) and a touch screen controller (TSC) integrated circuit that are coupled to a display integrated touch panel, such as an in-cell panel, and allowing multi-phase transmit (TX) scanning of the in-cell touch panel. One apparatus includes a DDI configured to receive signals on a video interface from a host processor over a video interface and to drive electrodes of a touch panel. The DDI is configured to receive control signals from a TSC over a control interface to drive different transmit (TX) phase sequences of a TX signal in different sensing interval on the electrodes of the touch panel.

Abstract: Apparatuses and methods of synchronizing a display driver integrated circuit (DDI) and a touch screen controller (TSC) integrated circuit that are coupled to a display integrated touch panel, such as an in-cell panel, and allowing multi-phase transmit (TX) scanning of the in-cell touch panel. One apparatus includes a DDI configured to receive signals on a video interface from a host processor over a video interface and to drive electrodes of a touch panel. The DDI is configured to receive control signals from a TSC over a control interface to drive different transmit (TX) phase sequences of a TX signal in different sensing interval on the electrodes of the touch panel.