Patents by Inventor Jang Fung Chen

Jang Fung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240027896
    Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.
    Type: Application
    Filed: July 25, 2022
    Publication date: January 25, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Shih-Hao Kuo, Hsiu-Jen Wang, Ulrich Mueller, Jang Fung Chen
  • Publication number: 20230314953
    Abstract: Embodiments described herein relate to methods of printing features within a lithography environment. The methods include determining a mask pattern. The mask pattern includes auxiliary features to be provided with main features to a maskless lithography device in a lithography process. The auxiliary features are determined with a rule-based process flow or a lithography model process flow.
    Type: Application
    Filed: September 16, 2021
    Publication date: October 5, 2023
    Inventors: Chi-Ming TSAI, Thomas L. LAIDIG, Douglas Joseph VAN DEN BROEKE, Jang Fung CHEN
  • Publication number: 20230288822
    Abstract: Actual physical locations of dies on a substrate package may be identified without using a full metrology scan of the substrate. Instead, one or more cameras may be used to efficiently locate the approximate location of any of the alignment features based on their expected positioning in the design file for the packages are substrate. The cameras may then be moved to locations where alignment features should be, and images may be captured to determine the actual location of the alignment feature. These actual locations of the alignment features may then be used to identify coordinates for the dies, as well as rotations and/or varying heights of the dies on the packages. A difference between the expected location from the design file and the actual physical location may be used to adjust instructions for the digital lithography system to compensate for the misalignment of the dies.
    Type: Application
    Filed: March 12, 2022
    Publication date: September 14, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Ulrich Mueller, Hsiu-Jen Wang, Shih-Hao Kuo, Jang Fung Chen
  • Patent number: 11592740
    Abstract: The present disclosure generally relates to methods and systems for manufacturing wire grid polarizers (WGP) using Markle-Dyson exposure systems and dual tone development (DTD) frequency doubling. In one embodiment, the method includes depositing a photoresist layer over an aluminum-coated display substrate, patterning the photoresist layer by dual tone development using a Markle-Dyson system to form a photoresist pattern, and transferring the photoresist pattern into the aluminum-coated display substrate to manufacture a WGP having finer pitch, for example less than or equal to about 100 nm, and increased frequency.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: February 28, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Jang Fung Chen, Christopher Dennis Bencher, David Markle
  • Publication number: 20220382171
    Abstract: Embodiments of the present disclosure relate to a system, a software application, and a method of a lithography process to update one or more of a mask pattern, maskless lithography device parameters, lithography process parameters utilizing a file readable by each of the components of a lithography environment. The file readable by each of the components of a lithography environment stores and shares textual data and facilitates communication between of the components of a lithography environment such that the mask pattern corresponds to a pattern to be written is updated, the maskless lithography device of the lithography environment is calibrated, and process parameters of the lithography process are corrected for accurate writing of the mask pattern on successive substrates.
    Type: Application
    Filed: October 8, 2019
    Publication date: December 1, 2022
    Inventors: Tamer COSKUN, Jang Fung CHEN, Douglas Joseph VAN DEN BROEKE
  • Patent number: 10983389
    Abstract: The present disclosure generally relates to systems and methods for manufacturing wire grid polarizers for LCDs using interference lithography, which are also useful for generating large-area grating patterns. In one embodiment, a method includes depositing a bottom anti-reflective coating layer over an aluminum coated flat panel display substrate, depositing a photoresist layer over the bottom anti-reflective coating layer, and exposing the photoresist layer with an image from a phase grating mask. The exposure with the phase grating mask is done by imaging the ±1 diffraction orders from the phase grating mask onto the substrate using a half Dyson optical system. A plurality of half Dyson systems are generally used in parallel to pattern fine geometry lines and spaces of a wire grid polarizer for a large area substrate. Each half Dyson system includes a primary mirror, a positive lens and a reticle.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: April 20, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: David Markle, Jang Fung Chen
  • Patent number: 10935892
    Abstract: Methods and systems are provided that, in some embodiments, print and process a layer. The layer can be on a wafer or on an application panel. Thereafter, locations of the features that were actually printed and processed are measured. Based upon differences between the measured differences and designed locations for those features at least one distortion model is created. Each distortion model is inverted to create a corresponding correction model. When there are multiple sections, a distortion model and a correction model can be created for each section. Multiple correction models can be combined to create a global correction model.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: March 2, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Tamer Coskun, Thomas L. Laidig, Jang Fung Chen
  • Patent number: 10908507
    Abstract: Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, a camera adjacent the beamsplitter, and a projection optics system adjacent the beamsplitter.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: February 2, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Jang Fung Chen, Christopher Dennis Bencher
  • Patent number: 10497658
    Abstract: In one embodiment of the invention, a method for correcting a pattern placement on a substrate is disclosed. The method begins by detecting three reference points for a substrate. A plurality of sets of three die location points are detected, each set indicative of an orientation of a die structure, the plurality of sets include a first set associated with a first dies and a second set associated with a second die. A local transformation is calculated for the orientation of the first die and the second on the substrate. Three orientation points are selected from the plurality of sets of three die location points wherein the orientation points are not set members of the same die. A first global orientation of the substrate is calculated from the selected three points from the set of points and the first global transformation and the local transformation for the substrate are stored.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: December 3, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Tamer Coskun, Jang Fung Chen
  • Patent number: 10379450
    Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: August 13, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Benjamin M. Johnston, Thomas L. Laidig, Jang Fung Chen, John White
  • Publication number: 20190049789
    Abstract: The present disclosure generally relates to systems and methods for manufacturing wire grid polarizers for LCDs using interference lithography, which are also useful for generating large-area grating patterns. In one embodiment, a method includes depositing a bottom anti-reflective coating layer over an aluminum coated flat panel display substrate, depositing a photoresist layer over the bottom anti-reflective coating layer, and exposing the photoresist layer with an image from a phase grating mask. The exposure with the phase grating mask is done by imaging the ±1 diffraction orders from the phase grating mask onto the substrate using a half Dyson optical system. A plurality of half Dyson systems are generally used in parallel to pattern fine geometry lines and spaces of a wire grid polarizer for a large area substrate. Each half Dyson system includes a primary mirror, a positive lens and a reticle.
    Type: Application
    Filed: February 10, 2017
    Publication date: February 14, 2019
    Inventors: David MARKLE, Jang Fung CHEN
  • Publication number: 20190019769
    Abstract: In one embodiment of the invention, a method for correcting a pattern placement on a substrate is disclosed. The method begins by detecting three reference points for a substrate. A plurality of sets of three die location points are detected, each set indicative of an orientation of a die structure, the plurality of sets include a first set associated with a first dies and a second set associated with a second die. A local transformation is calculated for the orientation of the first die and the second on the substrate. Three orientation points are selected from the plurality of sets of three die location points wherein the orientation points are not set members of the same die. A first global orientation of the substrate is calculated from the selected three points from the set of points and the first global transformation and the local transformation for the substrate are stored.
    Type: Application
    Filed: September 17, 2018
    Publication date: January 17, 2019
    Inventors: Tamer COSKUN, Jang Fung CHEN
  • Publication number: 20180335694
    Abstract: The present disclosure generally relates to methods and systems for manufacturing wire grid polarizers (WGP) using Markle-Dyson exposure systems and dual tone development (DTD) frequency doubling. In one embodiment, the method includes depositing a photoresist layer over an aluminum-coated display substrate, patterning the photoresist layer by dual tone development using a Markle-Dyson system to form a photoresist pattern, and transferring the photoresist pattern into the aluminum-coated display substrate to manufacture a WGP having finer pitch, for example less than or equal to about 100 nm, and increased frequency.
    Type: Application
    Filed: April 24, 2018
    Publication date: November 22, 2018
    Inventors: Jang Fung CHEN, Christopher Dennis BENCHER, David MARKLE
  • Publication number: 20180329310
    Abstract: Methods and systems are provided that, in some embodiments, print and process a layer. The layer can be on a wafer or on an application panel. Thereafter, locations of the features that were actually printed and processed are measured. Based upon differences between the measured differences and designed locations for those features at least one distortion model is created. Each distortion model is inverted to create a corresponding correction model. When there are multiple sections, a distortion model and a correction model can be created for each section. Multiple correction models can be combined to create a global correction model.
    Type: Application
    Filed: May 15, 2017
    Publication date: November 15, 2018
    Inventors: Tamer COSKUN, Thomas L. LAIDIG, Jang Fung CHEN
  • Patent number: 10115687
    Abstract: In one embodiment of the invention, a method for correcting a pattern placement on a substrate is disclosed. The method begins by detecting three reference points for a substrate. A plurality of sets of three die location points are detected, each set indicative of an orientation of a die structure, the plurality of sets include a first set associated with a first dies and a second set associated with a second die. A local transformation is calculated for the orientation of the first die and the second on the substrate. Three orientation points are selected from the plurality of sets of three die location points wherein the orientation points are not set members of the same die. A first global orientation of the substrate is calculated from the selected three points from the set of points and the first global transformation and the local transformation for the substrate are stored.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: October 30, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Tamer Coskun, Jang Fung Chen
  • Publication number: 20180226369
    Abstract: In one embodiment of the invention, a method for correcting a pattern placement on a substrate is disclosed. The method begins by detecting three reference points for a substrate. A plurality of sets of three die location points are detected, each set indicative of an orientation of a die structure, the plurality of sets include a first set associated with a first dies and a second set associated with a second die. A local transformation is calculated for the orientation of the first die and the second on the substrate. Three orientation points are selected from the plurality of sets of three die location points wherein the orientation points are not set members of the same die. A first global orientation of the substrate is calculated from the selected three points from the set of points and the first global transformation and the local transformation for the substrate are stored.
    Type: Application
    Filed: February 3, 2017
    Publication date: August 9, 2018
    Inventors: Tamer COSKUN, Jang Fung CHEN
  • Publication number: 20180188655
    Abstract: Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, a camera adjacent the beamsplitter, and a projection optics system adjacent the beamsplitter.
    Type: Application
    Filed: March 2, 2018
    Publication date: July 5, 2018
    Applicant: Applied Materials, Inc.
    Inventors: Jang Fung Chen, Christopher Dennis Bencher
  • Publication number: 20180129142
    Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.
    Type: Application
    Filed: January 10, 2018
    Publication date: May 10, 2018
    Inventors: Benjamin M. JOHNSTON, Thomas L. LAIDIG, Jang Fung CHEN, John WHITE
  • Patent number: 9927723
    Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: March 27, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Benjamin M. Johnston, Thomas L. Laidig, Jang Fung Chen, John White
  • Patent number: 9907152
    Abstract: An illumination system and methods for controlling the illumination system are provided. In one embodiment, the method includes providing a plurality of illumination sources, monitoring optical output power of the plurality of illumination sources over a period of time, and controlling the plurality of illumination sources to maintain a predetermined level of optical output power. The method further includes compensating for degradations of one or more of the plurality of illumination sources to maintain the predetermined level of optical output power, predicting a lifetime of the illumination system based on the parameters of the plurality of illumination sources, and performing periodic maintenance of the plurality of illumination sources according to a quality control schedule.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: February 27, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jeffrey Kaskey, Thomas Laidig, David Markle, Jang Fung Chen