Patents by Inventor Jang Fung Chen

Jang Fung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10908507
    Abstract: Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, a camera adjacent the beamsplitter, and a projection optics system adjacent the beamsplitter.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: February 2, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Jang Fung Chen, Christopher Dennis Bencher
  • Patent number: 10497658
    Abstract: In one embodiment of the invention, a method for correcting a pattern placement on a substrate is disclosed. The method begins by detecting three reference points for a substrate. A plurality of sets of three die location points are detected, each set indicative of an orientation of a die structure, the plurality of sets include a first set associated with a first dies and a second set associated with a second die. A local transformation is calculated for the orientation of the first die and the second on the substrate. Three orientation points are selected from the plurality of sets of three die location points wherein the orientation points are not set members of the same die. A first global orientation of the substrate is calculated from the selected three points from the set of points and the first global transformation and the local transformation for the substrate are stored.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: December 3, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Tamer Coskun, Jang Fung Chen
  • Patent number: 10379450
    Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: August 13, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Benjamin M. Johnston, Thomas L. Laidig, Jang Fung Chen, John White
  • Publication number: 20190049789
    Abstract: The present disclosure generally relates to systems and methods for manufacturing wire grid polarizers for LCDs using interference lithography, which are also useful for generating large-area grating patterns. In one embodiment, a method includes depositing a bottom anti-reflective coating layer over an aluminum coated flat panel display substrate, depositing a photoresist layer over the bottom anti-reflective coating layer, and exposing the photoresist layer with an image from a phase grating mask. The exposure with the phase grating mask is done by imaging the ±1 diffraction orders from the phase grating mask onto the substrate using a half Dyson optical system. A plurality of half Dyson systems are generally used in parallel to pattern fine geometry lines and spaces of a wire grid polarizer for a large area substrate. Each half Dyson system includes a primary mirror, a positive lens and a reticle.
    Type: Application
    Filed: February 10, 2017
    Publication date: February 14, 2019
    Inventors: David MARKLE, Jang Fung CHEN
  • Publication number: 20190019769
    Abstract: In one embodiment of the invention, a method for correcting a pattern placement on a substrate is disclosed. The method begins by detecting three reference points for a substrate. A plurality of sets of three die location points are detected, each set indicative of an orientation of a die structure, the plurality of sets include a first set associated with a first dies and a second set associated with a second die. A local transformation is calculated for the orientation of the first die and the second on the substrate. Three orientation points are selected from the plurality of sets of three die location points wherein the orientation points are not set members of the same die. A first global orientation of the substrate is calculated from the selected three points from the set of points and the first global transformation and the local transformation for the substrate are stored.
    Type: Application
    Filed: September 17, 2018
    Publication date: January 17, 2019
    Inventors: Tamer COSKUN, Jang Fung CHEN
  • Publication number: 20180335694
    Abstract: The present disclosure generally relates to methods and systems for manufacturing wire grid polarizers (WGP) using Markle-Dyson exposure systems and dual tone development (DTD) frequency doubling. In one embodiment, the method includes depositing a photoresist layer over an aluminum-coated display substrate, patterning the photoresist layer by dual tone development using a Markle-Dyson system to form a photoresist pattern, and transferring the photoresist pattern into the aluminum-coated display substrate to manufacture a WGP having finer pitch, for example less than or equal to about 100 nm, and increased frequency.
    Type: Application
    Filed: April 24, 2018
    Publication date: November 22, 2018
    Inventors: Jang Fung CHEN, Christopher Dennis BENCHER, David MARKLE
  • Publication number: 20180329310
    Abstract: Methods and systems are provided that, in some embodiments, print and process a layer. The layer can be on a wafer or on an application panel. Thereafter, locations of the features that were actually printed and processed are measured. Based upon differences between the measured differences and designed locations for those features at least one distortion model is created. Each distortion model is inverted to create a corresponding correction model. When there are multiple sections, a distortion model and a correction model can be created for each section. Multiple correction models can be combined to create a global correction model.
    Type: Application
    Filed: May 15, 2017
    Publication date: November 15, 2018
    Inventors: Tamer COSKUN, Thomas L. LAIDIG, Jang Fung CHEN
  • Patent number: 10115687
    Abstract: In one embodiment of the invention, a method for correcting a pattern placement on a substrate is disclosed. The method begins by detecting three reference points for a substrate. A plurality of sets of three die location points are detected, each set indicative of an orientation of a die structure, the plurality of sets include a first set associated with a first dies and a second set associated with a second die. A local transformation is calculated for the orientation of the first die and the second on the substrate. Three orientation points are selected from the plurality of sets of three die location points wherein the orientation points are not set members of the same die. A first global orientation of the substrate is calculated from the selected three points from the set of points and the first global transformation and the local transformation for the substrate are stored.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: October 30, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Tamer Coskun, Jang Fung Chen
  • Publication number: 20180226369
    Abstract: In one embodiment of the invention, a method for correcting a pattern placement on a substrate is disclosed. The method begins by detecting three reference points for a substrate. A plurality of sets of three die location points are detected, each set indicative of an orientation of a die structure, the plurality of sets include a first set associated with a first dies and a second set associated with a second die. A local transformation is calculated for the orientation of the first die and the second on the substrate. Three orientation points are selected from the plurality of sets of three die location points wherein the orientation points are not set members of the same die. A first global orientation of the substrate is calculated from the selected three points from the set of points and the first global transformation and the local transformation for the substrate are stored.
    Type: Application
    Filed: February 3, 2017
    Publication date: August 9, 2018
    Inventors: Tamer COSKUN, Jang Fung CHEN
  • Publication number: 20180188655
    Abstract: Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, a camera adjacent the beamsplitter, and a projection optics system adjacent the beamsplitter.
    Type: Application
    Filed: March 2, 2018
    Publication date: July 5, 2018
    Applicant: Applied Materials, Inc.
    Inventors: Jang Fung Chen, Christopher Dennis Bencher
  • Publication number: 20180129142
    Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.
    Type: Application
    Filed: January 10, 2018
    Publication date: May 10, 2018
    Inventors: Benjamin M. JOHNSTON, Thomas L. LAIDIG, Jang Fung CHEN, John WHITE
  • Patent number: 9927723
    Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: March 27, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Benjamin M. Johnston, Thomas L. Laidig, Jang Fung Chen, John White
  • Patent number: 9907152
    Abstract: An illumination system and methods for controlling the illumination system are provided. In one embodiment, the method includes providing a plurality of illumination sources, monitoring optical output power of the plurality of illumination sources over a period of time, and controlling the plurality of illumination sources to maintain a predetermined level of optical output power. The method further includes compensating for degradations of one or more of the plurality of illumination sources to maintain the predetermined level of optical output power, predicting a lifetime of the illumination system based on the parameters of the plurality of illumination sources, and performing periodic maintenance of the plurality of illumination sources according to a quality control schedule.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: February 27, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jeffrey Kaskey, Thomas Laidig, David Markle, Jang Fung Chen
  • Publication number: 20180024448
    Abstract: Embodiments disclosed herein generally relate to adjusting a focus setting for a digital lithography system. The method includes scanning a surface of a photoresist. The photoresist is formed on a substrate. A focus setting for the digital lithography system is determined. A plurality of exposure location on the photoresist are located. A sidewall width of the exposure is measured for a plurality of focus settings. The focus setting is adjusted in response to determining a minimum sidewall width.
    Type: Application
    Filed: July 13, 2017
    Publication date: January 25, 2018
    Inventors: Yeishin TUNG, Douglas Joseph VAN DEN BROEKE, Antoine P. MANENS, Jang Fung CHEN
  • Publication number: 20180017781
    Abstract: The present disclosure generally relates to frustrated cube assemblies having a first prism having a first surface, a second surface, and a first hypotenuse, and a second prism having a third surface, a fourth surface, and a second hypotenuse. The first and second hypotenuses face one another and are separated by an air gap. The frustrated cube assembly may include a tilted mirror adjacent the second surface. The second surface may be a reflective diffraction grating. Light is reflected to a digital micromirror device (DMD) adjacent to the frustrated cube assembly at a normal incidence angle and through an image projection system along a single optical axis. The direction of light incident on the DMD is such that light reflected from an “on” mirror is directed along the normal to the DMD surface and at 45 degrees to the hypotenuses. The input and output light beams are parallel.
    Type: Application
    Filed: June 30, 2017
    Publication date: January 18, 2018
    Inventors: David MARKLE, Thomas L. LAIDIG, Timothy N. THOMAS, Jang Fung CHEN
  • Publication number: 20180017876
    Abstract: Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, one or more refractory lens components adjacent the beam splitter, and a projection lens adjacent the one or more refractory lens components. The mounting plate advantageously provides for compact alignment in a system having a plurality of illumination tools, each of which is easily removable and replaceable.
    Type: Application
    Filed: July 13, 2017
    Publication date: January 18, 2018
    Inventors: Jang Fung CHEN, Christopher Dennis BENCHER
  • Patent number: 9733573
    Abstract: A spatial light modulator imaging system is disclosed. The system comprises an illumination module configured to provide illumination light representing data patterns to be imaged by the spatial light modulator imaging system, a projection module configured to project the illumination light to a substrate, and an illumination-projection beam separator coupled between the illumination module and the projection module, where the illumination-projection beam separator is configured to receive the illumination light along an illumination optical axis and transmit the illumination light received to the projection module along a projection optical axis, and where the illumination optical axis and the projection optical axis are substantially parallel to each other.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: August 15, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: David Markle, Thomas Laidig, Jeffrey Kaskey, Jang Fung Chen
  • Patent number: 9519226
    Abstract: System and method for applying mask data patterns to substrate in a lithography manufacturing process are disclosed. In one embodiment, a parallel imaging writer system comprises a plurality of spatial light modulator (SLM) imaging units, and a controller configured to control the plurality of SLM imaging units. Each of the plurality of SLM imaging units includes one or more illumination sources, one or more alignment sources, one or more projection lenses, and a plurality of micro mirrors configured to project light from the one or more illumination sources to the corresponding one or more projection lens. The controller synchronizes movements of the plurality of SLM imaging units with movement of a substrate in writing a mask data to the substrate in a lithography manufacturing process.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: December 13, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jang Fung Chen, Thomas Laidig
  • Patent number: 9507271
    Abstract: System and method for manufacturing multiple light emitting diodes in parallel are disclosed. In one embodiment, the method includes providing an imaging writer system that includes a plurality of spatial light modulator (SLM) imaging units arranged in one or more parallel arrays, providing one or more substrates corresponding to multiple LEDs to be manufactured, receiving mask data to be written to the one or more substrates corresponding to the multiple LEDs, processing the mask data to form a plurality of partitioned mask data patterns corresponding to the plurality substrates of the multiple LEDs, assigning one or more SLM imaging units to handle each of the partitioned mask data pattern, and controlling the plurality of SLM imaging units to write the plurality of partitioned mask data patterns to the plurality substrates of the multiple LEDs in parallel.
    Type: Grant
    Filed: September 3, 2011
    Date of Patent: November 29, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Jang Fung Chen, Thomas Laidig
  • Publication number: 20160282728
    Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.
    Type: Application
    Filed: March 24, 2016
    Publication date: September 29, 2016
    Inventors: Benjamin M. JOHNSTON, Thomas L. LAIDIG, Jang Fung CHEN, John WHITE