Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.

Abstract: An illumination system and methods for controlling the illumination system are provided. In one embodiment, the method includes providing a plurality of illumination sources, monitoring optical output power of the plurality of illumination sources over a period of time, and controlling the plurality of illumination sources to maintain a predetermined level of optical output power. The method further includes compensating for degradations of one or more of the plurality of illumination sources to maintain the predetermined level of optical output power, predicting a lifetime of the illumination system based on the parameters of the plurality of illumination sources, and performing periodic maintenance of the plurality of illumination sources according to a quality control schedule.

Abstract: Embodiments disclosed herein generally relate to adjusting a focus setting for a digital lithography system. The method includes scanning a surface of a photoresist. The photoresist is formed on a substrate. A focus setting for the digital lithography system is determined. A plurality of exposure location on the photoresist are located. A sidewall width of the exposure is measured for a plurality of focus settings. The focus setting is adjusted in response to determining a minimum sidewall width.

Abstract: Embodiments of the present disclosure generally relate to apparatuses and systems for performing photolithography processes. More particularly, compact illumination tools for projecting an image onto a substrate are provided. In one embodiment, an illumination tool includes a microLED array including one or more microLEDs. Each microLED produces at least one light beam. The illumination tool also includes a beamsplitter adjacent the microLED array, one or more refractory lens components adjacent the beam splitter, and a projection lens adjacent the one or more refractory lens components. The mounting plate advantageously provides for compact alignment in a system having a plurality of illumination tools, each of which is easily removable and replaceable.

Abstract: The present disclosure generally relates to frustrated cube assemblies having a first prism having a first surface, a second surface, and a first hypotenuse, and a second prism having a third surface, a fourth surface, and a second hypotenuse. The first and second hypotenuses face one another and are separated by an air gap. The frustrated cube assembly may include a tilted mirror adjacent the second surface. The second surface may be a reflective diffraction grating. Light is reflected to a digital micromirror device (DMD) adjacent to the frustrated cube assembly at a normal incidence angle and through an image projection system along a single optical axis. The direction of light incident on the DMD is such that light reflected from an “on” mirror is directed along the normal to the DMD surface and at 45 degrees to the hypotenuses. The input and output light beams are parallel.

Abstract: A spatial light modulator imaging system is disclosed. The system comprises an illumination module configured to provide illumination light representing data patterns to be imaged by the spatial light modulator imaging system, a projection module configured to project the illumination light to a substrate, and an illumination-projection beam separator coupled between the illumination module and the projection module, where the illumination-projection beam separator is configured to receive the illumination light along an illumination optical axis and transmit the illumination light received to the projection module along a projection optical axis, and where the illumination optical axis and the projection optical axis are substantially parallel to each other.

Abstract: System and method for applying mask data patterns to substrate in a lithography manufacturing process are disclosed. In one embodiment, a parallel imaging writer system comprises a plurality of spatial light modulator (SLM) imaging units, and a controller configured to control the plurality of SLM imaging units. Each of the plurality of SLM imaging units includes one or more illumination sources, one or more alignment sources, one or more projection lenses, and a plurality of micro mirrors configured to project light from the one or more illumination sources to the corresponding one or more projection lens. The controller synchronizes movements of the plurality of SLM imaging units with movement of a substrate in writing a mask data to the substrate in a lithography manufacturing process.

Abstract: System and method for manufacturing multiple light emitting diodes in parallel are disclosed. In one embodiment, the method includes providing an imaging writer system that includes a plurality of spatial light modulator (SLM) imaging units arranged in one or more parallel arrays, providing one or more substrates corresponding to multiple LEDs to be manufactured, receiving mask data to be written to the one or more substrates corresponding to the multiple LEDs, processing the mask data to form a plurality of partitioned mask data patterns corresponding to the plurality substrates of the multiple LEDs, assigning one or more SLM imaging units to handle each of the partitioned mask data pattern, and controlling the plurality of SLM imaging units to write the plurality of partitioned mask data patterns to the plurality substrates of the multiple LEDs in parallel.

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for performing photolithography processes. In one embodiment, a system including multiple interferometers for accurately measuring the location of a substrate during operation is provided. The system may include two chucks, and the two chucks are aligned in a first direction. The interferometers are placed along the first direction to measure the location of the substrate with respect to the first direction. The reduced distance between the interferometers and the chuck improves the accuracy of the measurement of the location of the substrate. In another embodiment, mask pattern data is provided to the system, and the mask pattern data is modified based on location and position information of the substrate. By controlling the mask pattern data with the location and position information of the substrate, less positional errors of the pattern formed on the substrate can be achieved.

Abstract: System and method for applying mask data patterns to substrate in a lithography manufacturing process are disclosed. In one embodiment, the method includes providing a parallel imaging writer system, where the parallel imaging writer system includes a plurality of multiple charged-particle beam (MCB) imaging units arranged in one or more parallel arrays, receiving a mask data pattern to be written to a substrate, processing the mask data pattern to form a plurality of partitioned mask data patterns corresponding to different areas of the substrate, identifying one or more objects in an area of the substrate to be imaged by corresponding MCB imaging units, and performing multiple exposures to image the one or more objects in the area of the substrate by controlling the plurality of MCB imaging units to write the plurality of partitioned mask data patterns in parallel.

Abstract: An illumination system and methods for controlling the illumination system are provided. In one embodiment, the method includes providing a plurality of illumination sources, monitoring optical output power of the plurality of illumination sources over a period of time, and controlling the plurality of illumination sources to maintain a predetermined level of optical output power. The method further includes compensating for degradations of one or more of the plurality of illumination sources to maintain the predetermined level of optical output power, predicting a lifetime of the illumination system based on the parameters of the plurality of illumination sources, and performing periodic maintenance of the plurality of illumination sources according to a quality control schedule.

Abstract: A method is provided for initializing an XML database. The method includes the steps of parsing an XML file to extract a plurality of records, the records arranged in a hierarchical form, creating, for each record, a plurality of class objects, each class having associated therewith one or more attributes, and creating a plurality of handling methods for each of one or more attributes associated with each class object, the handling methods defining how the database can be accessed.

Abstract: A spatial light modulator imaging system is disclosed. The system comprises an illumination module configured to provide illumination light representing data patterns to be imaged by the spatial light modulator imaging system, a projection module configured to project the illumination light to a substrate, and an illumination-projection beam separator coupled between the illumination module and the projection module, where the illumination-projection beam separator is configured to receive the illumination light along an illumination optical axis and transmit the illumination light received to the projection module along a projection optical axis, and where the illumination optical axis and the projection optical axis are substantially parallel to each other.

Abstract: A spatial light modulator imaging system is disclosed. The system comprises an illumination module configured to provide illumination light representing data patterns to be imaged by the spatial light modulator imaging system, a projection module configured to project the illumination light to a substrate, and an illumination-projection beam separator coupled between the illumination module and the projection module, where the illumination-projection beam separator is configured to receive the illumination light along an illumination optical axis and transmit the illumination light received to the projection module along a projection optical axis, and where the illumination optical axis and the projection optical axis are substantially parallel to each other.

Abstract: System and method for applying mask data patterns to substrate in a lithography manufacturing process are disclosed. In one embodiment, a parallel imaging writer system includes a plurality of spatial light modulator (SLM) imaging units, where each of the plurality of SLM imaging units includes one or more illumination sources, one or more alignment sources, one or more projection lenses, and a plurality of micro mirrors configured to project light from the one or more illumination sources to the corresponding one or more projection lens. The parallel imaging writer system further includes a controller configured to control the plurality of SLM imaging units, where the controller tunes each of the SLM imaging unit individually in writing a mask data to a substrate.

Abstract: System and method for manufacturing three-dimensional integrated circuits are disclosed. In one embodiment, the method includes providing an imaging writer system that includes a plurality of spatial light modulator (SLM) imaging units arranged in one or more parallel arrays, receiving mask data to be written to one or more layers of the three-dimensional integrated circuit, processing the mask data to form a plurality of partitioned mask data patterns corresponding to the one or more layers of the three-dimensional integrated circuit, assigning one or more SLM imaging units to handle each of the partitioned mask data pattern, and controlling the plurality of SLM imaging units to write the plurality of partitioned mask data patterns to the one or more layers of the three-dimensional integrated circuits in parallel. The method of assigning performs at least one of scaling, alignment, inter-ocular displacement, rotational factor, or substrate deformation correction.

Abstract: A method of generating complementary masks based on a target pattern having features to be imaged on a substrate for use in a multiple-exposure lithographic imaging process. In embodiments, the invention provides a double exposure lithography method which trims (i.e., removes) unwanted SB residues from the substrate, that is suitable for use, for example, when printing 65 nm or 45 nm node devices or less. According to certain aspects, the present invention provides the ability to utilize large SBs due to the mutual trimming of SBs that results from the process of the present invention. Specifically, in the given process, both the H-mask and the V-mask contain circuit features and SBs, but they are in different corresponding orientations, and therefore, there is a mutual SB trimming for the H-mask and V-mask during the two exposures.

Abstract: System and method for handling substrates in a lithography manufacturing process are disclosed. In one embodiment, a system for handling substrates in a lithography manufacturing process includes a plurality of porous chucks positioned above a substrate for imaging, a plurality of pressure sources configured to apply pressured air towards the substrate through the plurality of porous chucks, a plurality of vacuums configured to apply suction force away from the substrate, and a controller with control logic configured to hold the substrate in place by controlling the pressured air applied by the plurality of pressure sources and the suction force generated by the plurality of vacuums.

Abstract: A method of generating complementary masks based on a target pattern having features to be imaged on a substrate for use in a multiple-exposure lithographic imaging process is disclosed. The method includes defining an initial H-mask and an initial V-mask corresponding to the target pattern; identifying horizontal critical features in the H-mask and vertical critical features in the V-mask; assigning a first phase shift and a first percentage transmission to the horizontal critical features, which are to be formed in the H-mask; and assigning a second phase shift and a second percentage transmission to the vertical critical features, which are to be formed in the V-mask. The method further includes the step of assigning chrome to all non-critical features in the H-mask and the V-mask.