Abstract: A light emitting element includes a first electrode, a second electrode disposed on the first electrode, and an emission layer disposed between the first electrode and the second electrode. The emission layer may include a first compound and at least one of a second compound or a third compound. The first compound may be represented by Formula 1, the second compound may be represented by Formula HT-1, and the third compound may be represented by Formula ET-1. Accordingly, a light emitting element of an embodiment may exhibit excellent or suitable light efficiency.

Abstract: Embodiments provide a light emitting element that includes a first electrode, a second electrode facing the first electrode, and an emission layer disposed between the first electrode and the second electrode, wherein the emission layer includes a polycyclic compound represented by Formula 1, which is explained in the specification:

Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.

Abstract: A light emitting device includes a first electrode, a second electrode, and at least one emission layer between the first electrode and the second electrode and includes at least one polycyclic compound represented by Formula 1 below, thereby exhibiting long service life characteristics. In Formula 1, the substituents are the same as defined in the detailed description.

Abstract: A method includes obtaining a color transformation matrix that removes color distortion of an original color histogram of a target color space for an input image of an original color space; obtaining a color transformation image of the original color space from which color distortion of the input image is removed using the color transformation matrix; and obtaining a space transformation image with a minimum target loss value between an output vector of a neural network for one of candidate images and each of a plurality of candidate class vectors of the input image, the candidate images being spaced apart from the color transformation image of the original color space by a distance less than a threshold.

Abstract: Provided is a forceps driving apparatus including a body, a gripper installed to be received in the body and formed to be open and closed, an opening and closing member rotatably installed in the body to press or release two sides of the gripper by rotation, an elastic member connected to one side of the opening and closing member to provide an elastic force to the opening and closing member, an actuator connected to the other side of the opening and closing member to rotate the opening and closing member by contraction or extension, and a force sensing module to measure a gripping force of the gripper during the rotation of the opening and closing member.

Abstract: An aspect of the present disclosure may provide a defect detection apparatus and method for a steel plate, in which a defect in a steel plate may be detected, and particularly, only an inner defect in the steel plate may be detected, even with a relatively low amplification rate.

Abstract: An aspect of the present disclosure may provide a defect detection apparatus and method for a steel plate, in which a defect in a steel plate may be detected, and particularly, only an inner defect in the steel plate may be detected, even with a relatively low amplification rate.

Abstract: Provided is a defect inspection device of a steel plate. The defect inspection device according to the present invention includes a plurality of inspection units arranged in a width direction of the steel plate, wherein each of the plurality of inspection units includes a first magnetized pole and a second magnetized pole corresponding to each other. Also, the inspection unit includes: a magnetizing part generating a magnetic flux for magnetizing the steel plate in a direction inclined at a predetermined angle with respect to a rolling direction through the first magnetized pole and the second magnetized pole; and a detection part detecting a leakage flux that leaks due to defects existing in or on the steel plate by using the flux generated by the magnetizing part. Thus, the defects may be correctly detected through the defect inspection device.

Abstract: Provided is a defect inspection device of a steel plate. The defect inspection device according to the present invention includes a plurality of inspection units arranged in a width direction of the steel plate, wherein each of the plurality of inspection units includes a first magnetized pole and a second magnetized pole corresponding to each other. Also, the inspection unit includes: a magnetizing part generating a magnetic flux for magnetizing the steel plate in a direction inclined at a predetermined angle with respect to a rolling direction through the first magnetized pole and the second magnetized pole; and a detection part detecting a leakage flux that leaks due to defects existing in or on the steel plate by using the flux generated by the magnetizing part. Thus, the defects may be correctly detected through the defect inspection device.

Abstract: A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.

Abstract: A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.

Abstract: A test interface device includes a serializer, an optical transmitter, an optical receiver, and a deserializer. The serializer receives parallel test signals from automatic test equipment, and serializes the parallel test signals into a serial test signal. The optical transmitter converts the serial test signal into an optical test signal. The optical receiver receives the optical test signal from the optical transmitter, and converts the optical test signal into the serial test signal. The deserializer deserializes the serial test signal into the parallel test signals, and transmits the parallel test signals to a device under test. As a result, signal transfer speed may be improved and optical resource usage may be reduced.

Abstract: There is provided an on-line detection system and method for a weld of a steel strip, which can emit a laser beam onto the surface of a steel strip moving at a high speed and measure the reflectivity of the laser beam reflecting from the same, thereby detecting the weld of the steel strip easily on-line. In the on-line detection system, reflectivity measuring means emits a laser beam onto a moving steel strip and continuously measuring the reflectivity of the laser beam returning from the surface of the steel strip, and signal processing means detects a weld of the steel strip based on change in the reflectivity measured on the weld.

Abstract: An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.

Abstract: A wafer test equipment system includes a performance board connected to a tester head of a tester. A universal block printed circuit board is positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card. A cable assembly transfers the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head. The cable assembly is soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board. A probe card is removably secured to the performance board including the universal block printed circuit board.

Abstract: A semiconductor device test apparatus is provided. The semiconductor device test apparatus includes a test unit on which a semiconductor device under test is disposed, and an automatic test equipment (ATE) unit that inputs a test signal to the test unit and reads a test result signal output by the test unit. The semiconductor device test apparatus includes an interface unit that is interposed between the test unit and the ATE unit, and that compares the test signal with the test result signal and outputs to the ATE unit comparison signals indicating whether the semiconductor device is a failure or not or whether a specific bit failure has occurred or not.

Abstract: An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.

Abstract: A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.

Abstract: A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.