Patents by Inventor Jang Oh

Jang Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10088453
    Abstract: An aspect of the present disclosure may provide a defect detection apparatus and method for a steel plate, in which a defect in a steel plate may be detected, and particularly, only an inner defect in the steel plate may be detected, even with a relatively low amplification rate.
    Type: Grant
    Filed: December 24, 2013
    Date of Patent: October 2, 2018
    Assignee: POSCO
    Inventors: Ju-Seung Lee, Chang-Hyun Park, Geon Shin, Sang-Woo Choi, Shin-Hwan Kang, Ho-Moon Bae, Ki-Jang Oh
  • Publication number: 20160313285
    Abstract: An aspect of the present disclosure may provide a defect detection apparatus and method for a steel plate, in which a defect in a steel plate may be detected, and particularly, only an inner defect in the steel plate may be detected, even with a relatively low amplification rate.
    Type: Application
    Filed: December 24, 2013
    Publication date: October 27, 2016
    Inventors: Ju-Seung LEE, Chang-Hyun PARK, Geon SHIN, Sang-Woo CHOI, Shin-Hwan KANG, Ho-Moon BAE, Ki-Jang OH
  • Patent number: 9417212
    Abstract: Provided is a defect inspection device of a steel plate. The defect inspection device according to the present invention includes a plurality of inspection units arranged in a width direction of the steel plate, wherein each of the plurality of inspection units includes a first magnetized pole and a second magnetized pole corresponding to each other. Also, the inspection unit includes: a magnetizing part generating a magnetic flux for magnetizing the steel plate in a direction inclined at a predetermined angle with respect to a rolling direction through the first magnetized pole and the second magnetized pole; and a detection part detecting a leakage flux that leaks due to defects existing in or on the steel plate by using the flux generated by the magnetizing part. Thus, the defects may be correctly detected through the defect inspection device.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: August 16, 2016
    Assignee: POSCO
    Inventors: Ju-Seung Lee, Se-Ho Choi, Sang-Woo Choi, Jong-Pil Yun, Shin-Hwan Kang, Ki-Jang Oh
  • Publication number: 20140347041
    Abstract: Provided is a defect inspection device of a steel plate. The defect inspection device according to the present invention includes a plurality of inspection units arranged in a width direction of the steel plate, wherein each of the plurality of inspection units includes a first magnetized pole and a second magnetized pole corresponding to each other. Also, the inspection unit includes: a magnetizing part generating a magnetic flux for magnetizing the steel plate in a direction inclined at a predetermined angle with respect to a rolling direction through the first magnetized pole and the second magnetized pole; and a detection part detecting a leakage flux that leaks due to defects existing in or on the steel plate by using the flux generated by the magnetizing part. Thus, the defects may be correctly detected through the defect inspection device.
    Type: Application
    Filed: November 30, 2012
    Publication date: November 27, 2014
    Inventors: Ju-Seung Lee, Se-Ho Choi, Sang-Woo Choi, Jong-Pil Yun, Shin-Hwan Kang, Ki-Jang Oh
  • Publication number: 20140139258
    Abstract: A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.
    Type: Application
    Filed: January 28, 2014
    Publication date: May 22, 2014
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Se-jang OH, Eun-jo BYUN, Cheol-jong WOO
  • Patent number: 8674718
    Abstract: A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: March 18, 2014
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Se-jang Oh, Eun-jo Byun, Cheol-jong Woo
  • Patent number: 8606102
    Abstract: A test interface device includes a serializer, an optical transmitter, an optical receiver, and a deserializer. The serializer receives parallel test signals from automatic test equipment, and serializes the parallel test signals into a serial test signal. The optical transmitter converts the serial test signal into an optical test signal. The optical receiver receives the optical test signal from the optical transmitter, and converts the optical test signal into the serial test signal. The deserializer deserializes the serial test signal into the parallel test signals, and transmits the parallel test signals to a device under test. As a result, signal transfer speed may be improved and optical resource usage may be reduced.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: December 10, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Hoon Lee, Eun-Jo Byun, Cheol-Jong Woo, Se-Jang Oh
  • Patent number: 8149409
    Abstract: There is provided an on-line detection system and method for a weld of a steel strip, which can emit a laser beam onto the surface of a steel strip moving at a high speed and measure the reflectivity of the laser beam reflecting from the same, thereby detecting the weld of the steel strip easily on-line. In the on-line detection system, reflectivity measuring means emits a laser beam onto a moving steel strip and continuously measuring the reflectivity of the laser beam returning from the surface of the steel strip, and signal processing means detects a weld of the steel strip based on change in the reflectivity measured on the weld.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: April 3, 2012
    Assignee: Posco
    Inventors: Choong-Soo Lim, Ki-Sam Son, Kwang-Ho Son, Sang-Jin Lee, Seung-Gap Choi, Ki-Jang Oh
  • Patent number: 8139949
    Abstract: An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: March 20, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Hoon Lee, Ho-Jeong Choi, Se-Jang Oh, Young-Soo An, Gyu-Yeol Kim
  • Patent number: 8026733
    Abstract: A wafer test equipment system includes a performance board connected to a tester head of a tester. A universal block printed circuit board is positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card. A cable assembly transfers the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head. The cable assembly is soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board. A probe card is removably secured to the performance board including the universal block printed circuit board.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: September 27, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-hoon Lee, Chang-woo Ko, Young-soo An, Se-jang Oh
  • Patent number: 7973550
    Abstract: A semiconductor device test apparatus is provided. The semiconductor device test apparatus includes a test unit on which a semiconductor device under test is disposed, and an automatic test equipment (ATE) unit that inputs a test signal to the test unit and reads a test result signal output by the test unit. The semiconductor device test apparatus includes an interface unit that is interposed between the test unit and the ATE unit, and that compares the test signal with the test result signal and outputs to the ATE unit comparison signals indicating whether the semiconductor device is a failure or not or whether a specific bit failure has occurred or not.
    Type: Grant
    Filed: October 21, 2009
    Date of Patent: July 5, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eun-Jo Byun, Sang-Hoon Lee, Se-Jang Oh, Cheol-Jong Woo
  • Patent number: 7884628
    Abstract: An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: February 8, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Soo An, Sang-Hoon Lee, Se-Jang Oh
  • Patent number: 7880490
    Abstract: A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.
    Type: Grant
    Filed: August 28, 2008
    Date of Patent: February 1, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Hoon Lee, Kwang-Yong Lee, Se-Jang Oh, Young-Soo An
  • Publication number: 20100289517
    Abstract: A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.
    Type: Application
    Filed: March 24, 2010
    Publication date: November 18, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Se-jang OH, Eun-jo BYUN, Cheol-jong WOO
  • Publication number: 20100182035
    Abstract: A semiconductor device test apparatus is provided. The semiconductor device test apparatus includes a test unit on which a semiconductor device under test is disposed, and an automatic test equipment (ATE) unit that inputs a test signal to the test unit and reads a test result signal output by the test unit. The semiconductor device test apparatus includes an interface unit that is interposed between the test unit and the ATE unit, and that compares the test signal with the test result signal and outputs to the ATE unit comparison signals indicating whether the semiconductor device is a failure or not or whether a specific bit failure has occurred or not.
    Type: Application
    Filed: October 21, 2009
    Publication date: July 22, 2010
    Inventors: Eun-Jo Byun, Sang-Hoon Lee, Se-Jang Oh, Cheol-Jong Woo
  • Publication number: 20100150549
    Abstract: A test interface device includes a serializer, an optical transmitter, an optical receiver, and a deserializer. The serializer receives parallel test signals from automatic test equipment, and serializes the parallel test signals into a serial test signal. The optical transmitter converts the serial test signal into an optical test signal. The optical receiver receives the optical test signal from the optical transmitter, and converts the optical test signal into the serial test signal. The deserializer deserializes the serial test signal into the parallel test signals, and transmits the parallel test signals to a device under test. As a result, signal transfer speed may be improved and optical resource usage may be reduced.
    Type: Application
    Filed: December 3, 2009
    Publication date: June 17, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-Hoon Lee, Eun-Jo Byun, Cheol-Jong Woo, Se-Jang Oh
  • Publication number: 20100117673
    Abstract: A wafer test equipment system includes a performance board connected to a tester head of a tester. A universal block printed circuit board is positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card. A cable assembly transfers the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head. The cable assembly is soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board. A probe card is removably secured to the performance board including the universal block printed circuit board.
    Type: Application
    Filed: June 2, 2009
    Publication date: May 13, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-hoon Lee, Chang-woo Ko, Young-soo An, Se-jang Oh
  • Publication number: 20100025682
    Abstract: In an interface device for wireless testing capable of testing a semiconductor chip in a non-contact manner, a semiconductor device and a semiconductor package including the same, and a method for wirelessly testing a semiconductor device using the same are provided, the interface device for wireless testing includes an interface substrate, interface antennas on the interface substrate, and interface transmitting and receiving circuits on the interface substrate, wherein the interface transmitting and receiving circuits are electrically connected to input/output pads of a semiconductor chip via interface vias passing through the interface substrate.
    Type: Application
    Filed: August 3, 2009
    Publication date: February 4, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-Hoon Lee, Eun-Jo Byun, Se-Jang Oh, Young-Soo An, Chang-Hyun Cho
  • Publication number: 20090279096
    Abstract: There is provided an on-line detection system and method for a weld of a steel strip, which can emit a laser beam onto the surface of a steel strip moving at a high speed and measure the reflectivity of the laser beam reflecting from the same, thereby detecting the weld of the steel strip easily on-line. In the on-line detection system, reflectivity measuring means emits a laser beam onto a moving steel strip and continuously measuring the reflectivity of the laser beam returning from the surface of the steel strip, and signal processing means detects a weld of the steel strip based on change in the reflectivity measured on the weld.
    Type: Application
    Filed: May 26, 2006
    Publication date: November 12, 2009
    Applicant: POSCO
    Inventors: Choong Soo Lim, Ki Sam Son, Kwang Ho Son, Seung Gap Choi, Sang Jin Lee, Ki Jang Oh
  • Publication number: 20090189624
    Abstract: An interposer and a probe card assembly for electrical die sorting is provided. The assembly may include probes electrically contacting pads of dies on a substrate, a first wiring unit including a first wire on and electrically contacting the probes, an interposer unit including interposers on the first wiring unit and electrically contacting the first wire, and a second wiring unit including a second wire on the interposer unit and electrically contacting the interposers. At least one interposer includes a conductive member, a first connection member adjacent to a first end of the conductive member so as to electrically connect the conductive member to the first wire, a second connection member adjacent to a second end of the conductive member so as to electrically connect the conductive member to the second wire, and at least one protrusion member on an external surface of the conductive member between the first and second connection members.
    Type: Application
    Filed: September 26, 2008
    Publication date: July 30, 2009
    Inventors: Se-Jang Oh, Hal-young Lee, Young-soo An, Sang-hoon Lee, Sung-ho Joo, Dong-yeop Kim