Abstract: A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.

Abstract: A built off testing apparatus coupled between a semiconductor device and an external testing apparatus to test a semiconductor device. The built off testing apparatus can include a frequency multiplying unit to generate a test clock frequency by multiplying the frequency of a clock input by the external testing apparatus according to the operation speed of the semiconductor device, an instruction decoding unit to generate test information by decoding test signals input by the external testing apparatus according to the test clock frequency, and a test execution unit to test the semiconductor device according to the test information, and can determine whether the semiconductor device is failed or not based on test data output by the semiconductor device, and can transmit resulting data to the external testing apparatus.

Abstract: A semiconductor device test apparatus is provided. The semiconductor device test apparatus includes a test unit on which a semiconductor device under test is disposed, and an automatic test equipment (ATE) unit that inputs a test signal to the test unit and reads a test result signal output by the test unit. The semiconductor device test apparatus includes an interface unit that is interposed between the test unit and the ATE unit, and that compares the test signal with the test result signal and outputs to the ATE unit comparison signals indicating whether the semiconductor device is a failure or not or whether a specific bit failure has occurred or not.

Abstract: A test interface device includes a serializer, an optical transmitter, an optical receiver, and a deserializer. The serializer receives parallel test signals from automatic test equipment, and serializes the parallel test signals into a serial test signal. The optical transmitter converts the serial test signal into an optical test signal. The optical receiver receives the optical test signal from the optical transmitter, and converts the optical test signal into the serial test signal. The deserializer deserializes the serial test signal into the parallel test signals, and transmits the parallel test signals to a device under test. As a result, signal transfer speed may be improved and optical resource usage may be reduced.

Abstract: A wafer test equipment system includes a performance board connected to a tester head of a tester. A universal block printed circuit board is positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card. A cable assembly transfers the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head. The cable assembly is soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board. A probe card is removably secured to the performance board including the universal block printed circuit board.

Abstract: In an interface device for wireless testing capable of testing a semiconductor chip in a non-contact manner, a semiconductor device and a semiconductor package including the same, and a method for wirelessly testing a semiconductor device using the same are provided, the interface device for wireless testing includes an interface substrate, interface antennas on the interface substrate, and interface transmitting and receiving circuits on the interface substrate, wherein the interface transmitting and receiving circuits are electrically connected to input/output pads of a semiconductor chip via interface vias passing through the interface substrate.

Abstract: There is provided an on-line detection system and method for a weld of a steel strip, which can emit a laser beam onto the surface of a steel strip moving at a high speed and measure the reflectivity of the laser beam reflecting from the same, thereby detecting the weld of the steel strip easily on-line. In the on-line detection system, reflectivity measuring means emits a laser beam onto a moving steel strip and continuously measuring the reflectivity of the laser beam returning from the surface of the steel strip, and signal processing means detects a weld of the steel strip based on change in the reflectivity measured on the weld.

Abstract: An interposer and a probe card assembly for electrical die sorting is provided. The assembly may include probes electrically contacting pads of dies on a substrate, a first wiring unit including a first wire on and electrically contacting the probes, an interposer unit including interposers on the first wiring unit and electrically contacting the first wire, and a second wiring unit including a second wire on the interposer unit and electrically contacting the interposers. At least one interposer includes a conductive member, a first connection member adjacent to a first end of the conductive member so as to electrically connect the conductive member to the first wire, a second connection member adjacent to a second end of the conductive member so as to electrically connect the conductive member to the second wire, and at least one protrusion member on an external surface of the conductive member between the first and second connection members.

Abstract: An electrical test system includes a test head, a performance board, a probe card and coaxial cables. The performance board includes a first side and an opposite second side, where the first side of the performance board is electrically connected to the test head and the second side of the performance board includes first coaxial cable connection portions. The probe card includes a first side and an opposite second side, where the first side of the probe card includes second coaxial cable connection portions and the second side includes a wafer test probes. The coaxial cables respectively electrically connect the first coaxial cable connection portions of the performance board to the second coaxial cable connection portions of the probe card.

Abstract: An interposer may include a first base, at least one first signal line in the first base, and at least one first ground line in the first base, wherein the ground line surrounds the at least one first signal line. The at least one first signal line and the at least one first ground line may be exposed through an upper surface of the first base. The at least one first signal line may be configured to conduct a test current through the first base. An interposer may also include a second base below the first base and may include a printed circuit board between the first base and the second base. A probe card may include a multilayer substrate having at least one contact needle, a coaxial board having at least one coaxial signal cable and the above described interposer between the multilayer substrate and the coaxial board.

Abstract: A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.

Abstract: An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.

Abstract: An electrical test system includes a test head, a performance board, a probe card and coaxial cables. The performance board includes a first side and an opposite second side, where the first side of the performance board is electrically connected to the test head and the second side of the performance board includes first coaxial cable connection portions. The probe card includes a first side and an opposite second side, where the first side of the probe card includes second coaxial cable connection portions and the second side includes a wafer test probes.

Abstract: The present invention relates to a communication apparatus and a method for controlling the same, which controls an operation mode of a communication unit in a portable terminal capable of supporting the portable Internet (Wibro). In the present invention, when the communication unit of the portable terminal that provides the Wibro service is in a sleep mode, the communication unit is not periodically switched (waken up) to a normal mode but is switched to the normal mode only when a traffic indication message containing a mode-setting value for returning to the normal mode is received from a base station. Then, the portable terminal can receive a signal transmitted from the base station through the Wibro. Therefore, the present invention has an advantage in that power consumption of the portable terminal is reduced when the Wibro service is not used.

Abstract: A battery charge control apparatus includes a memory unit that stores charge termination currents that correspond to a plurality of charge modes, respectively. A control unit receives a designed capacity (full charge capacity) of a battery and an actual charge capacity thereof from a battery pack through a smart bus, and confirms whether the battery is currently in a full charge state. If it is confirmed that the battery is not in the full charge state, the control unit sends a charge unit a charge initiation control signal for controlling initiation of battery charging. Further, if a charge mode is designated, the control unit reads a charge termination current corresponding to the designated charge mode from the memory unit. Moreover, the control unit detects a charge voltage, i.e., a voltage difference ?V between both ends of a resistor R connected between a power supply and the battery pack, and calculates a charge current I using the detected voltage V and the resistance of resistor R.

Abstract: A power management system includes a graphic controller configured to generate a first display information signal and a second display information signal. The system includes a memory device operatively connected with the graphic controller and a parallel terminal unit. The memory device and the parallel terminal unit are configured to collectively support the graphic controller to generate the first display information signal at a first clock speed and at a first power consumption level. The memory device is configured to support the graphic controller without the parallel terminal unit to generate the second display information signal at a second clock speed and at a second power consumption level.

Abstract: A method, apparatus or stored program for adjusting the clock throttle rate of a central processing unit (CPU) included in a computer, in which the usage of the CPU is measured, so that the clock throttle rate of the CPU can be automatically adjusted on the measured usage of the CPU, thereby reducing the consumption of electric power without any influence on the performance of the computer.

Abstract: A power control apparatus includes a driver for controlling an operation of a storage device, a filter driver for monitoring a state of the storage device, and a management program part for controlling a power supply to the storage device. The management program part is configured to output a control signal based upon the monitored state to a control part operatively connected to the storage device.

Abstract: A charging operation for a battery includes determining an actual full charge capacity of the battery and a design capacity of the battery. The actual full charge capacity of the battery is compared with the design capacity of the battery. One or more of a charge voltage and a cut-off current, such as with an embedded controller, is adjusted if the actual full charge capacity is less than the design capacity. The battery is controlled by charging the battery with one or more of an adjusted cut-off current and/or an adjusted charge voltage.

Abstract: A power-saving function for a touch screen device provides efficient use of power, such as from a battery for a portable device. The touch screen device may include a sampling unit for digitizing an input to the touch screen. The power-saving function is provided with a battery level-monitoring unit for monitoring a battery level, and a sampling rate controller for controlling a sampling rate of the sampling unit based on the battery level monitored by the battery level-monitoring unit.