Patents by Inventor Jang-woo Lee

Jang-woo Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220208515
    Abstract: A substrate treating apparatus includes a process chamber having a reaction space with one or more insulation members exposed to the reaction space; a substrate support member supporting a substrate at the reaction space; a gas supply member selectively supplying a passivation gas and a process gas to the reaction space; a plasma source exciting a gas into a plasma; and a controller which controls the gas supply member and the plasma source, and after a substrate to be treated is taken into the reaction space and supported by the support member, the controller controls the gas supply member and the plasma source to supply the passivation gas and the process gas to the reaction space simultaneously or sequentially, and generate a plasma in the reaction space under the condition of stopping a supply of the passivation gas but supplying the process gas.
    Type: Application
    Filed: December 29, 2021
    Publication date: June 30, 2022
    Inventors: Jin Woo CHOI, Seung Jun OH, Jin Woo NAM, Jang Hee LEE, Young Hak PARK, Ahn Na SEO
  • Publication number: 20220194434
    Abstract: An autonomous driving control apparatus may include a processor configured to determine a wear degree of a tire of a vehicle based on image data of the tire during autonomous driving of the vehicle, and to perform vehicle control depending on the wear degree of the tire; and a storage electrically connected to the processor and configured to store the image data and algorithms driven by the processor.
    Type: Application
    Filed: August 25, 2021
    Publication date: June 23, 2022
    Inventors: Chang Woo HA, Tae Sik KIM, Ho Jun KIM, Chang Eui SON, Eun Ho LEE, Jang Soon HAN
  • Publication number: 20220195083
    Abstract: Disclosed is an antistatic agent for a metallocene olefin polymerization process and a polymerization method using the same, by which discontinuity event due to sheeting or drooling occurring in the olefin polymerization process can be effectively reduced, enabling continuous operation for a long time, and the obtained final product can be applied to various applications including food contact use. The present disclosure includes an olefin polymerization method, which comprises forming a mixture in which an antistatic agent containing diglycerol oleate is mixed with a low molecular weight hydrocarbon, supplying the antistatic agent mixture and a metallocene-based catalyst composition comprising a metallocene catalyst and aluminoxane to two or more polymerization reactors, and polymerizing one or more alpha-olefins in the presence of the antistatic agent mixture and catalyst composition.
    Type: Application
    Filed: December 22, 2021
    Publication date: June 23, 2022
    Inventors: Jang Woo LEE, Sung Woo KANG, Byung Soon CHUN, Soon Jae KWON
  • Publication number: 20220201149
    Abstract: An image reading apparatus includes an image sensor, a document feeder, and a processor. The document feeder includes a first driving device, a second driving device, a third driving device, a first sensor, and a second sensor. The first driving device includes a pick-up member to move documents from a tray to a document conveying path using a driving force through a first clutch. The second driving device is to move the tray with the documents to a side of the pick-up member using a driving force through a second clutch. The third driving device to move the documents along the document conveying path onto the image sensor using the driving force of the motor The first and second sensors detect the documents on the document conveying path. The processor controls an operation of the first clutch based on the signals of the first and second sensors.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 23, 2022
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Jung Hoon Lee, Takuya Ito, Jang Won Seo, Jae Hoon Lee, Whan Woo Lee, Soo Hyun Kim, Seung Rae Kim, Seung Beom Yang, Ji Young Lee, Sung Hyun Yoon, Koo Won Park
  • Publication number: 20220179017
    Abstract: An atomic magnetometer, which operates in a communication system using a magnetic signal in a very low frequency (VLF) band, may comprise: a vapor cell comprising one or more alkaline metal atoms; a pump light source configured to provide circularly polarized pump beams to the vapor cell; an irradiation light source configured to provide linearly polarized irradiation beams to the vapor cell; a magnetic signal detecting unit configured to detect a magnetic signal by measuring a polarization rotation angle from the linearly polarized irradiation beam passing through the vapor cell; and a bias magnetic field control unit configured to control a bias magnetic field applied to the vapor cell.
    Type: Application
    Filed: November 30, 2021
    Publication date: June 9, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Hyun Joon LEE, Jang Yeol KIM, Jae Woo LEE, In Kui CHO, Sang Won KIM, Seong Min KIM, Jung Ick MOON, Je Hoon YUN, Dong Won JANG
  • Patent number: 11332553
    Abstract: A catalyst composition for polymerizing a polyolefin having excellent processability and impact strength, a process for producing a polyolefin and a polyolefin resin thereof are disclosed. The catalyst composition comprises at least one first organometallic compound of following formula 1; at least one second organometallic compound of following formula 2; and aluminoxane. The polyolefin resin satisfies following properties (i) to (iv) and (vi), (i) melt flow index (ASTM D1238), measured at 190° C., under a load of 2.16 kg: 0.1 to 1.5 g/10 min, (ii) density: 910 to 930 kg/m3, (iii) the ratio (Mw/Mn), as measured by gel permeation chromatography (GPC): 3.0 to 7.0, (iv) the ratio (Mz/Mw), as measured by GPC: 2.2 to 4.5, and (vi) when the TREF curve of multimodal distribution is deconvoluted, the area of TREF curve having a peak at 50 to 74° C. is 40 to 75% of the total area of the TREF curve.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: May 17, 2022
    Assignee: DL CHEMICAL CO., LTD.
    Inventors: Da Jung Kim, Byung Keel Sohn, Jang Woo Lee, Su Hyun Park, Sung Ho Choi, Hee Jun Lee
  • Publication number: 20220145461
    Abstract: The present disclosure relates to a compound capable of implementing thin film deposition through vapor deposition, and more particularly, to a rare earth compound which is applicable to atomic layer deposition (ALD) or chemical vapor deposition (CVD) and has excellent thermal stability and reactivity, a rare earth precursor containing the same, a method of preparing the same, and a method of forming a thin film using the same.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 12, 2022
    Inventors: Mi-Ra PARK, Kyu-Hyun YEOM, Hyun-Kyung LEE, Jang-Hyun SEOK, Jung-Woo PARK
  • Publication number: 20220102257
    Abstract: A semiconductor package including: a first substrate including a first surface including a first region and a second region at least partially surrounding the first region, wherein the first substrate includes a first insulating layer, a first conductive pattern in the first insulating layer, a first passivation layer disposed in the first region and the second region, and a second passivation layer disposed on the first passivation layer in the second region; an interposer overlapping the first substrate and including a second insulating layer and a second conductive pattern in the second insulating layer; a first connection terminal disposed on the first passivation layer in the first region; and a second connection terminal disposed on the second passivation layer in the second region, wherein the first conductive pattern and the second conductive pattern are connected to each other through the first connection terminal and the second connection terminal.
    Type: Application
    Filed: August 16, 2021
    Publication date: March 31, 2022
    Inventors: Dong Ho KIM, Jang Woo LEE
  • Publication number: 20220102315
    Abstract: A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip connection units to connect the first package substrate to the first semiconductor chip, an interposer on the first semiconductor chip, the interposer having a width greater than a width of the first semiconductor chip in a direction parallel to an upper surface of the first package substrate, and an upper filling layer including a center portion and an outer portion, the center portion being between the first semiconductor chip and the interposer, and the outer portion surrounding the center portion and having a thickness greater than a thickness of the center portion in a direction perpendicular to the upper surface of the first package substrate.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 31, 2022
    Inventors: Jang-woo LEE, Un-byoung KANG, Ji-hwang KIM, Jong-bo SHIM, Young-kun JEE
  • Patent number: 11244738
    Abstract: Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.
    Type: Grant
    Filed: August 4, 2020
    Date of Patent: February 8, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dae Hoon Na, Jang Woo Lee, Jin Do Byun, Jeong Don Ihm
  • Patent number: 11227855
    Abstract: A semiconductor package includes a first package substrate, a first semiconductor chip on the first package substrate, a plurality of first chip connection units to connect the first package substrate to the first semiconductor chip, an interposer on the first semiconductor chip, the interposer having a width greater than a width of the first semiconductor chip in a direction parallel to an upper surface of the first package substrate, and an upper filling layer including a center portion and an outer portion, the center portion being between the first semiconductor chip and the interposer, and the outer portion surrounding the center portion and having a thickness greater than a thickness of the center portion in a direction perpendicular to the upper surface of the first package substrate.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: January 18, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jang-woo Lee, Un-byoung Kang, Ji-hwang Kim, Jong-bo Shim, Young-kun Jee
  • Publication number: 20210359347
    Abstract: The present disclosure provides an electrical device including a battery cell, a voltage sensor operatively coupled to the battery cell in order to measure a voltage level of the battery cell, a current sensor operatively coupled to the battery cell in order to measure an amount of current drawn from or supplied to the battery cell, and a battery management system (BMS). The battery management system includes a controller In communication with the voltage sensor and the current sensor. The controller is configured to execute a program stored in the BMS to calculate a state of health of the individual battery electrodes comprising a battery cell using a first differential voltage point, a second differential voltage point, and a characteristic curve of a fresh battery electrode of a fresh battery cell, wherein the battery cell includes a second battery electrode not exhibiting distinct phase transitions during a charge-discharge cycle.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 18, 2021
    Inventors: Anna G. Stefanopoulou, Suhak Lee, Jason B. Siegel, Jang-Woo Lee, Tae-Kyung Lee
  • Publication number: 20210343617
    Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.
    Type: Application
    Filed: July 15, 2021
    Publication date: November 4, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ji Hwang KIM, Jong Bo SHIM, Jang Woo LEE, Yung Cheol KONG, Young Hoon HYUN
  • Patent number: 11069592
    Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: July 20, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji Hwang Kim, Jong Bo Shim, Jang Woo Lee, Yung Cheol Kong, Young Hoon Hyun
  • Patent number: 11016637
    Abstract: A device for managing applications installed on the device and a method thereof are provided. The device includes a controller configured to obtain driving information of the applications in response to the applications being executed, and determine an application satisfying an uninstall condition, among the applications, based on the driving information. The device further includes an interface configured to change a display of an object indicating the determined application, based on the uninstall condition.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: May 25, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-hyun Ryu, Yong-gook Park, Jang-woo Lee, Jae-young Lee, Jae-ho Jung, Yang-wook Kim
  • Patent number: 11017877
    Abstract: Provided are multi-chip packages. A multi-chip package includes a first memory chip and a second memory chip on a printed circuit board; a memory controller electrically connected to the first memory chip and the second memory chip via a first bonding wire and a second bonding wire; and a strength control module configured to control a drive strength of each of a first output driver of the first memory chip and a second output driver of the second memory chip, wherein the memory controller includes an interface circuit configured to receive each of first test data and second test data from the first output driver and the second output driver in which the drive strength is set by the strength control module, and output detection data for detecting whether the first bonding wire and the bonding wire are short-circuited based on the first and second test data.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: May 25, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dae Hoon Na, Jang Woo Lee, Jin Do Byun, Jeong Don Ihm
  • Publication number: 20210132151
    Abstract: A method of estimating a state of health of a battery, the method being performed by a computing apparatus, the method including: preparing a trained artificial neural network; generating input data by measuring at least one parameter of a battery; acquiring a plurality of output values each corresponding to a plurality of classes by inputting the input data into the trained artificial neural network; and generating a state of health estimation value of the battery using a plurality of preset health state sections each corresponding to the plurality of classes and the plurality of output values each corresponding to the plurality of classes.
    Type: Application
    Filed: October 6, 2020
    Publication date: May 6, 2021
    Inventors: Jang-Woo LEE, Jungsoo KIM, Huiyong CHUN, Soohee HAN, Tae-Kyung LEE
  • Publication number: 20210115236
    Abstract: Disclosed are a polyolefin resin composition and a production method using same. The polyolefin resin satisfies the following conditions: (1) melt index (MI2.16, 190° C., under a load of 2.16 kg) is 0.1 to 1.5 g/10 min; (2) density is 0.91 to 0.93 g/cc; (3) polydispersity Index (Mw (weight-average molecular weight)/Mn (number-average molecular weight)) is 3 to 7; (4) Mz (Z-average molecular weight)/Mw (weight-average molecular weight) is 2.3 to 4.5; and (5) COI (Comonomer Orthogonal Index) value calculated by Equation 1 in the specification is 5 to 12. In Equation 1, “SCB number at Mz” represents average number of branches derived from comonomers per 1000 carbon atoms at Z-average molecular weight (Mz), and “SCB number at Mn” represents average number of branches derived from comonomers per 1000 carbon atoms at number-average molecular weight (Mn) based on a molecular weight-comonomer distribution graph.
    Type: Application
    Filed: April 2, 2019
    Publication date: April 22, 2021
    Inventors: Jang Woo LEE, Byung Keel SOHN, Sah Mun HONG, Da Jung KIM, Hee Jun LEE, Sung Ho CHOI, Su Hyun PARK
  • Patent number: 10964618
    Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jang-woo Lee, Kyung-suk Oh, Yung-cheol Kong, Woo-hyun Park, Jong-bo Shim, Jae-myeong Cha
  • Publication number: 20200379862
    Abstract: A memory device includes a path state check circuit configured to check states of signal transmission paths, each signal transmission path including a data transmission path and a clock transmission path of the memory device. The path state check circuit includes a sampling circuit configured to perform a sampling operation by using pattern data that has passed through the data transmission path and a clock signal that has passed through the clock transmission path, and generate sample data, and a management circuit configured to generate a comparison of the sample data with the pattern data and manage check result information indicating whether a re-training operation for the memory device is to be performed, based on a result of the comparison.
    Type: Application
    Filed: August 21, 2020
    Publication date: December 3, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Won-joo Jung, Jang-woo Lee, Byung-hoon Jeong, Jeong-don Ihm