Patents by Inventor Jarmo Sääski
Jarmo Sääski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11175014Abstract: An optoelectronically functional multilayer structure as well as related methods of manufacturing an optoelectronically functional multilayer structure are described herein.Type: GrantFiled: May 17, 2021Date of Patent: November 16, 2021Assignee: TACTOTEK OYInventors: Juha-Matti Hintikka, Miikka Kärnä, Heikki Tuovinen, Tuomas Nieminen, Johannes Soutukorva, Ville Wallenius, Tero Rajaniemi, Tomi Simula, Jari Lihavainen, Mikko Heikkinen, Jarmo Sääski, Hasse Sinivaara, Antti Keränen, Ilpo Hänninen
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Patent number: 11166363Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: GrantFiled: January 11, 2019Date of Patent: November 2, 2021Assignee: TACTOTEK OYInventors: Antti Keränen, Tomi Simula, Mikko Heikkinen, Jarmo Sääski, Pasi Raappana, Minna Pirkonen
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Patent number: 11166364Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: GrantFiled: March 30, 2020Date of Patent: November 2, 2021Assignee: TACTOTEK OYInventors: Antti Keränen, Tomi Simula, Mikko Heikkinen, Jarmo Sääski, Pasi Raappana, Minna Pirkonen
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Publication number: 20210335702Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.Type: ApplicationFiled: July 6, 2021Publication date: October 28, 2021Inventors: Jarmo SÄÄSKI, Mikko HEIKKINEN, Tero HEIKKINEN, Mika PAANI, Jan TILLONEN, Ronald HAAG
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Publication number: 20210244965Abstract: The invention relates to a mouthpiece and method for antibacterial treatment of intraoral surfaces. The mouthpiece comprises a body made of light-guiding material, the body comprising facial and lingual outer surfaces and facial and lingual inner surfaces adapted to face facial and lingual surfaces of teeth, respectively. A light source is attached to the body and adapted to deliver light to surfaces of teeth, the light source being positioned on at least one of said outer surfaces and adapted to deliver said light via said inner surfaces to both the facial and lingual surfaces of the teeth, wherein a portion of light is adapted to travel through said body from the facial side to the lingual side, or vice versa.Type: ApplicationFiled: June 10, 2019Publication date: August 12, 2021Inventors: Sakari Nikinmaa, Jukka Kärkimaa, Tommi Pätilä, Katja Ivanitskiy, Mikko Heikkinen, Jarmo Sääski
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Patent number: 11088066Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.Type: GrantFiled: March 19, 2018Date of Patent: August 10, 2021Assignee: TACTOTEK OYInventors: Jarmo Sääski, Mikko Heikkinen, Tero Heikkinen, Mika Paani, Jan Tillonen, Ronald Haag
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Publication number: 20210243898Abstract: A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.Type: ApplicationFiled: March 29, 2021Publication date: August 5, 2021Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10986735Abstract: A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.Type: GrantFiled: October 24, 2018Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10986733Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.Type: GrantFiled: November 15, 2017Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10986734Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.Type: GrantFiled: September 25, 2018Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
Patent number: 10960641Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.Type: GrantFiled: October 2, 2020Date of Patent: March 30, 2021Assignee: TACTOTEK OYInventors: Vinski Bräysy, Anne Isohätälä, Jarmo Sääski, Tomi Simula -
Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
Patent number: 10946612Abstract: An integrated multilayer structure for use in sensing applications and a method of manufacture are presented. The multilayer structure includes at least one molded or cast plastic layer and a film layer on both first and second sides of said plastic layer. The film layer on the first side of said plastic layer is provided with reactance sensing electronics. The sensing electronics includes at least one sensing element and an electrical connection for connecting the sensing element to an associated control circuitry. The film layer on the second side of the plastic layer has a sensing area superimposed with the sensing element of the sensing electronics. The electrical distance between the film layer on the second side of the plastic layer and the sensing element are locally reduced by a physical feature at the position of the sensing area of the film layer to improve the associated sensing sensitivity.Type: GrantFiled: August 27, 2018Date of Patent: March 16, 2021Assignee: TACTOTEK OYInventors: Vinski Bräysy, Anne Isohätälä, Jarmo Sääski, Tomi Simula -
INTEGRATED MULTILAYER STRUCTURE FOR USE IN SENSING APPLICATIONS AND METHOD FOR MANUFACTURING THEREOF
Publication number: 20210016539Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.Type: ApplicationFiled: October 2, 2020Publication date: January 21, 2021Inventors: Vinski BRÄYSY, Anne ISOHÄTÄLÄ, Jarmo SÄÄSKI, Tomi SIMULA -
Publication number: 20200396841Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: ApplicationFiled: August 28, 2020Publication date: December 17, 2020Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10813222Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: GrantFiled: January 21, 2020Date of Patent: October 20, 2020Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Publication number: 20200229296Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: ApplicationFiled: March 30, 2020Publication date: July 16, 2020Inventors: Antti KERÄNEN, Tomi SIMULA, Mikko HEIKKINEN, Jarmo SÄÄSKI, Pasi RAAPPANA, Minna PIRKONEN
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Publication number: 20200229295Abstract: An electrical node includes a substrate for accommodating a functional element. The substrate includes a first side and an opposite second side, and hosting a number of connecting elements. The functional element includes an electronic component and conductive traces. The electrical node also includes a first material layer defining a protective covering. The first material layer defining at least a portion of the exterior surface of the nod arranged to reduce at least thermal expansion and/or mechanical deformation related stresses between one or more elements included in the node, adjacent the node and/or at least at a proximity thereto.Type: ApplicationFiled: January 11, 2019Publication date: July 16, 2020Inventors: Antti KERÄNEN, Tomi SIMULA, Mikko HEIKKINEN, Jarmo SÄÄSKI, Pasi RAAPPANA, Minna PIRKONEN
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Integrated multilayer structure for use in sensing applications and method for manufacturing thereof
Patent number: 10675834Abstract: A method for manufacturing an integrated multilayer structure for sensing applications, including obtaining at least one film including a sensing area; arranging the at least one film with reactance sensing electronics for sensing of one or more selected target quantities or qualities and conversion thereof into representative electrical signals, said sensing electronics including at least one sensing element and an electrical connection configured to connect the sensing element to an associated control circuitry; and molding or casting, and configuring, at least one plastic layer so that the plastic layer defines an integrated, intermediate layer between the sensing electronics and the sensing area and that the sensing area is superimposed with the sensing element of the sensing electronics, wherein it is further provided at least one physical feature to locally reduce the electrical distance between the sensing area and the sensing element to improve the associated sensing sensitivity.Type: GrantFiled: November 16, 2018Date of Patent: June 9, 2020Assignee: TACTOTEK OYInventors: Vinski Bräysy, Anne Isohätälä, Jarmo Sääski, Tomi Simula -
Patent number: 10667401Abstract: A method for manufacturing a multilayer structure, includes obtaining a substrate film for accommodating electronics, providing, preferably at least in part by printed electronics technology, a number of conductive traces, and optionally electronic components, at least on a first side of the substrate film to establish a predetermined circuit design, providing a connector element to said substrate film to electrically connect to the circuit, wherein the substrate film is arranged with at least one hole, preferably through hole, substantially matching the location of the connector element so that a number of electrically conductive contact members of the connector element are accessible from a second, opposite side of the substrate film via said at least one hole, and molding thermoplastic material on said first side of the substrate film and said connector element to substantially cover the established circuit and the side of the connector element facing the material.Type: GrantFiled: July 25, 2018Date of Patent: May 26, 2020Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Antti Keränen, Jarmo Sääski, Ronald H. Haag
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Patent number: 10660211Abstract: A method for manufacturing an electromechanical structure includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the film in relation to a desired three-dimensional shape of the film, forming the film into the substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film.Type: GrantFiled: September 25, 2014Date of Patent: May 19, 2020Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keranen