Abstract: A method for manufacturing an electronic assembly and electronic assemblies are presented. The method includes obtaining a substrate film for accommodating electronics, providing at least an electrical contact pad to the substrate film, coupling an electrically conductive member to the electrical contact pad, and molding, such as injection molding, a material layer onto the substrate film to embed the elastic electrically conductive member utilizing a mold structure defining a cavity for molding. The elastic electrically conductive member is arranged to extend during the molding from the electrical contact pad through the cavity to be in contact with an element on a different side of the cavity with respect to the electrical contact pad for maintaining at least a part of the elastic electrically conductive member accessible after the molding to provide an electrical connection through the material layer to the electrical contact pad.

Abstract: A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208). The invention also relates to a method for manufacturing a multilayer structure for an electronic device.

Abstract: Multilayer structure, including a substrate film having a first and second opposite side, said substrate film including electrically insulating material, conductive traces on the first side of the substrate film for establishing a predetermined circuit design, a connector element laid upon the first side of, said substrate film, one side of the connector element facing the structure internals and the other, opposite side facing the environment on the second side of the substrate film including a number of electrically conductive contact members electrically connected to the circuit on the first side of the substrate film and configured to contact one or more electrical contact members of an external element responsive to mating the external element with the connector element, and a plastic layer molded onto the substrate film and the connector element so as to cover said one side of the connector element and the circuit.

Abstract: A multilayer structure for an electronic device including a flexible substrate film for accommodating electronics; at least one electronic component provided on the substrate film; and a number of conductive traces provided on the substrate film for electrically powering and/or connecting electronics including the at least one electronic component, wherein at least one preferably thermoformed cover is attached to the substrate film on top of the at least one electronic component, the at least one thermoformed cover and the substrate film accommodating the electronics being overmolded with thermoplastic material. The invention also relates to a method for manufacturing a multilayer structure for an electronic device.

Abstract: Method for manufacturing an electromechanical structure, comprising: producing conductors and/or graphics on a substantially flat film 106, attaching electronic elements on the said film 108 in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape 110, using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film 112, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure. A corresponding arrangement for carrying out said method is also presented.

Abstract: A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208).

Abstract: Method for manufacturing an electromechanical structure, com-prising: producing conductors and/or graphics on a substantially flat film 106, attaching electronic elements on the said film 108 in relation to the de-sired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape 110, using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film 112, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure. A corresponding arrangement for carrying out said method is also presented.

Abstract: The invention relates to a case structure for a sensor structure attachable to and detachable from a shoe, the case structure comprising a case and an attachment arrangement for attaching the case to the shoe, the attachment arrangement comprising an attachment projection structure intended to attach the case to the shoe such that shoelaces remain between a bottom comprised by the case and the attachment projection structure below the bottom. The essential feature in the invention is that the attachment projection structure is a branched projection structure comprising a first projection branch and a second projection branch, and, between the projection branches, an intermediate area intended to enable the placing of the case structure in position even if the shoelaces were arranged to support a tongue of the shoe.