Abstract: A crosslinkable composition, a crosslinked composition formed upon exposure of the crosslinkable composition to ultraviolet radiation or ionizing radiation, articles containing these compositions, and methods of making the articles are described. The crosslinkable compositions contain two different (meth)acrylate copolymers and can be applied to a substrate using an extrusion process. While being extruded, the crosslinkable compositions advantageously are resistant to crosslinking and/or increased molecular weights. The crosslinked compositions can function as adhesive compositions that are particularly well suited for use in electronic devices.

Abstract: The present invention is an oil-resistant adhesive composition including a hydroxy alkyl (meth)acrylate having an alkyl group containing 2 to 4 carbons, a short alkyl (meth)acrylate having an alkyl group containing 6 or less carbons, and a photo-initiator. After the adhesive composition is soaked in oleic acid at room temperature for 7 days, the adhesive composition has an expansion percent of less than about 10%.

Abstract: The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include about 0 to about 50 wt % C1-C9 alkyl(meth)acrylate, about 40 to about 99 wt % C10-C24 (meth)acrylate, about 0 to about 30 wt % hydroxyl (meth)acrylate, about 0 to about 10 wt % of a non-hydroxy functional polar monomer, and about 0 to about 5 wt % crosslinker.

Abstract: A crosslinkable composition, a crosslinked composition formed upon exposure of the crosslinkable composition to ultraviolet radiation or ionizing radiation, articles containing these crosslinkable or crosslinked compositions, and methods of making the articles are described. The crosslinkable compositions contain two different (meth)acrylate polymers and can be applied to a substrate using an extrusion process. While being extruded, the crosslinkable compositions advantageously are resistant to crosslinking and/or significantly increasing in molecular weight. The crosslinked compositions can function as either a pressure-sensitive adhesive composition or a heat bondable adhesive composition and are particularly well suited for use in electronic devices.

Abstract: Core-sheath filaments comprising a non-tacky sheath, the non-tacky sheath exhibiting a melt flow index of less than 15 grams per 10 minutes and an adhesive core, the adhesive core comprising 10 wt.% to 99 wt.% of a polymer and a phenolic resin, where the polymer comprises an isoprene moiety, the phenolic resin comprises an alkyl-substituted phenol, and the phenolic resin is substantially free of halogens. Cured adhesive composition comprising the disclosed core-sheath filaments and methods of making such core-sheath filaments.

Abstract: Described are viscoelastic damping materials and constructions which may demonstrate low temperature performance and adhesion and which may be used in making vibration damping composites. Viscoelastic damping materials and constructions may include polymers or copolymers of monomers according to formula I: CH2?CHR1—COOR2??[I] wherein R1 is H, CH3 or CH2CH3 and R2 is a branched alkyl group containing 12 to 32 carbon atoms.

Abstract: Pressure-sensitive adhesive compositions are described comprising polymerized units of (meth)acrylate monomer. Also described are articles comprising such pressure-sensitive adhesive composition.

Abstract: A composition is described comprising a styrene-isobutylene block copolymer; and at least one ethylenically unsaturated monomer. After curing the composition comprises polymerized units of the ethylenically unsaturated monomer. In some embodiments the ethylenically unsaturated groups are selected from (meth)acryl or vinyl ether. The composition is suitable for use as a (e.g. pressure sensitive) adhesive. Articles, methods of making an article, and methods of bonding are also described.

Abstract: A composition is described comprising a styrene-isobutylene block copolymer; and at least one ethylenically unsaturated monomer. After curing the composition comprises polymerized units of the ethylenically unsaturated monomer. In some embodiments the ethylenically unsaturated groups are selected from (meth)acryl or vinyl ether. The composition is suitable for use as a (e.g. pressure sensitive) adhesive. Articles, methods of making an article, and methods of bonding are also described.

Abstract: Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10?4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10?3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.

Abstract: The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include about 0 to about 50 wt % C1-C9 alkyl(meth)acrylate, about 40 to about 99 wt % C10-C24 (meth)acrylate, about 0 to about 30 wt % hydroxyl (meth)acrylate, about 0 to about 10 wt % of a non-hydroxy functional polar monomer, and about 0 to about 5 wt % crosslinker.

Abstract: The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include about 0 to about 50 wt % C1-C9 alkyl(meth)acrylate, about 40 to about 99 wt % C10-C24 (meth)acrylate, about 0 to about 30 wt % hydroxyl(meth)acrylate, about 0 to about 10 wt % of a non-hydroxy functional polar monomer, and about 0 to about 5 wt % crosslinker.

Abstract: Provided are amorphous polyolefin compositions that can be dispensed digitally as the core in a core-sheath construction. These formulations provide dependable adhesion to both polar and non-polar surface in addition to providing a high barrier to air and moisture which is beneficial in many applications. These formulations and the method of processing these formulations provide many benefits, including low VOCs, avoiding die cutting, design flexibility, achieving intricate nonplanar bonding patterns, printing on thin and/or delicate substrates, and printing on an irregular and/or complex topography, no need for release liners or low-adhesion backsize, and no need for a post-processing step.

Abstract: Core-sheath filaments are provided that comprise cores having diene-based rubbers that are crosslinked by multifunctional acrylates, resulting in superior high-temperature performance adhesives. The adhesive compositions have excellent durability against oxygen and moisture, low and stable dielectric properties, and superior high-temperature performance. Methods of making core-sheath filaments having cores including diene-based rubbers that are crosslinked by multifunctional acrylates and uses for such core-sheath filaments.

Abstract: Pressure sensitive adhesives are provided comprising an adhesive copolymer which is a copolymer of a set of monomers comprising: a) 41.0-49.0 weight percent of isobornyl acrylate (IBOA); b) 0.0-4.5 weight percent of one or more basic-functional polar monomers comprising a polymerizable double bond; and c) 46.5-58.9 weight percent of one or more alkyl (meth)acrylate monomers, where the alkyl groups are selected from linear and branched alkyl groups comprising 2-12 carbon atoms and branched alkyl groups comprising 13-20 carbon atoms and wherein weight percentages are weight percent of all monofunctional monomers comprising the adhesive copolymer. In another aspect, the present disclosure provides tapes comprising the pressure sensitive adhesive according to the present disclosure. In some embodiments, the tapes are flexographic plate mounting tapes.

Abstract: The present invention is an oil-resistant adhesive composition including a hydroxy alkyl (meth)acrylate having an alkyl group containing 2 to 4 carbons, a short alkyl (meth)acrylate having an alkyl group containing 6 or less carbons, and a photo-initiator. After the adhesive composition is soaked in oleic acid at room temperature for 7 days, the adhesive composition has an expansion percent of less than about 10%.

Abstract: A heat-removing sheet includes a plurality of endothermic particles and a chemically cured or radiation cured resin binding the endothermic particles together. The heat-removing sheet includes the endothermic particles at greater than 60 weight percent, has a flexural modulus of less than 3000 MPa and a flexural strength of greater than 0.15 MPa. The heat-removing sheet is a single free-standing layer.

Abstract: An adhesive composition is described comprising a polyisobutylene polymer component; and up to 30 wt.-% of at least one aliphatic multifunctional component comprising at least two ethylenically unsaturated groups selected from (meth)acryl or vinyl ether. The monomer comprises a hydrocarbon moiety with greater than 12 contiguous carbon atoms. When the hydrocarbon moiety is branched, the hydrocarbon moiety comprises side chains with at least two carbon atoms. The aliphatic multifunctional component is sufficiently compatible such that crosslinked adhesive composition at a thickness of 20 microns has a haze of less than 3%. Also described are adhesive articles.

Abstract: Compositions are described comprising at least 20 wt. % of block copolymer comprising polyvinyl aromatic end blocks and a polyisoprene midblock and at least one ethylenically unsaturated monomer comprising one or more groups selected from (meth)acryl or vinyl ether. In one embodiment, the monomer has a Log P according to Moriguchi's method of at least 2.2. In another embodiment, the monomer is a multifunctional aromatic ethylenically unsaturated monomer. The composition is typically a (e.g. pressure sensitive) adhesive. Also described are methods of making an article, adhesive articles, and methods of bonding.

Abstract: A (meth)acrylate copolymer derived from a polymerizable composition containing a (meth)acrylate macromer, an adhesive composition that is a pressure-sensitive adhesive and that contains the (meth)acrylate copolymer, and an article containing the adhesive composition are provided. The articles may be, for example, an adhesive tape, an electronic device, or a flexible and/or foldable article. The articles advantageously can be used to in electronic devices that are foldable and/or flexible.