Abstract: The present invention is an assembly layer for a flexible device. Within a temperature range of between about ?30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10?6 1/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress. The assembly layer includes at least one of a polyisoprene, a polybutadiene, an olefin block copolymer, a polyisobutylene, and high alkyl polyolefin.

Abstract: A composition is described comprising a styrene-isobutylene block copolymer; and at least one ethylenically unsaturated monomer. After curing the composition comprises polymerized units of the ethylenically unsaturated monomer. In some embodiments the ethylenically unsaturated groups are selected from (meth)acryl or vinyl ether. The composition is suitable for use as a (e.g. pressure sensitive) adhesive. Articles, methods of making an article, and methods of bonding are also described.

Abstract: In one embodiment, an adhesive composition is described comprising a polyisobutylene polymer component, a styrene-isobutylene block copolymer, and optionally a tackifier. The polyisobutylene polymer component comprises one or more polyisobutylene polymers. The polyisobutylene polymer component has an average weight average molecular weight ranging from 100 g/mole to less than 15,000 g/mole. In some embodiments, the adhesive composition is a pressure sensitive adhesive.

Abstract: An optically clear pressure sensitive adhesive article is described herein that includes a pressure sensitive adhesive film disposed on a substrate. The pressure sensitive adhesive film includes an optically clear adhesive composition formed by polymerizing a mixture of monomers that includes at least one (C1-C18)alkyl (meth)acrylate monomer and at least one polar (meth)acrylate monomer, and surface-modified fumed silica disposed in the optically clear pressure sensitive adhesive composition. The pressure sensitive adhesive film has a haze value in a range of 0 to 5% and a visible light transmittance value of 85 to 100%. Methods for making an optically clear pressure sensitive adhesive article are also described.

Abstract: Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10?4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10?3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.

Abstract: An optically clear pressure sensitive adhesive article is described herein that includes a pressure sensitive adhesive film disposed on a substrate. The pressure sensitive adhesive film includes an optically clear adhesive composition formed by polymerizing a mixture of monomers that includes at least one (C1-C18)alkyl (meth)acrylate monomer and at least one polar (meth)acrylate monomer, and surface-modified fumed silica disposed in the optically clear pressure sensitive adhesive composition. The pressure sensitive adhesive film has a haze value in a range of 0 to 5% and a visible light transmittance value of 85 to 100%. Methods for making an optically clear pressure sensitive adhesive article are also described.

Abstract: An adhesive composition are articles are described. The adhesive composition comprises a polyisobutylene polymer component; up to 20 wt.-% of a polyolefin copolymer comprising polymerized units of an acidic monomer; and optionally, at least one tackifier. The polyolefin copolymer typically comprises C2-C4 alkylene units. The polyolefin copolymer comprises polymerized units of a carboxylic acid, or unsaturated derivative thereof. In some embodiments, the polyolefin copolymer has a melting temperature ranging from 50 to 150° C. In some embodiments, the polyolefin copolymer has an acid number of less than 40, 35, 30, or 25 mgKOH/g.

Abstract: Curable adhesive compositions are provided that can be cured using ultraviolet or visible light radiation. These curable adhesive compositions, which contain a curable (meth)acrylate copolymer, have a creep compliance that is less than 5(10?4) inverse Pascals at 25° C., a creep compliance that is greater than 1(10?3) inverse Pascals at 70° C., and a shear storage modulus greater than 40 kiloPascals when measured at 25° C. at a frequency of 1 radian/second.

Abstract: Pressure sensitive adhesives are provided comprising an adhesive copolymer which is a copolymer of a set of monomers comprising: a) 41.0-49.0 weight percent of isobornyl acrylate (IBOA); b) 0.0-4.5 weight percent of one or more basic-functional polar monomers comprising a polymerizable double bond; and c) 46.5-58.9 weight percent of one or more alkyl (meth)acrylate monomers, where the alkyl groups are selected from linear and branched alkyl groups comprising 2-12 carbon atoms and branched alkyl groups comprising 13-20 carbon atoms and wherein weight percentages are weight percent of all monofunctional monomers comprising the ON adhesive copolymer. In another aspect, the present disclosure provides tapes comprising the pressure sensitive adhesive according to the present disclosure. In some embodiments, the tapes are flexographic plate mounting tapes.

Abstract: Polymerizable compositions comprising a redox initiator system is disclosed. The redox initiators comprises a photolabile reducing agent, that photolyzes and initiates the redox cycle. Dental compositions comprising dental resins and the photolabile redox initiator system are also described.

Abstract: The present invention is an assembly layer for a flexible device. Within a temperature range of between about ?30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10?6 1 /Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress. The assembly layer includes at least one of a polyisoprene, a polybutadiene, an olefin block copolymer, a polyisobutylene, and high alkyl polyolefin.

Abstract: Pressure-sensitive adhesive compositions are described comprising polymerized units of (meth)acrylate monomer. Also described are articles comprising such pressure-sensitive adhesive composition.

Abstract: A pattern article comprising a copolymer having polymerized units derived from a cleavable crosslinking monomer, to which a pattern is imparted by the release of incipient acid from a thermal acid generator or photoacid generator. The selective release of the acid provides a pattern of high crosslink density and low crosslink density as result of the incipient acid cleaving a portion of the crosslinks.

Abstract: A composite particle that includes: a fluorescent semiconductor core/shell nanoparticle (preferably, nanocrystal); and a stabilizing additive of a (meth)acrylate copolymer having pendent phosphine, arsine or stibine groups.

Abstract: Polymerizable compositions comprising a redox initiator system is disclosed. The redox initiator system comprises a photolabile transition metal complex that photolyzes and initiates the redox cycle. Dental compositions comprising dental resins and the photolabile redox initiator system are also described.

Abstract: The present invention is an assembly layer for a flexible device. Within a temperature range of between about ?30° C. to about 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed about 2 MPa, a shear creep compliance (J) of at least about 6×10?6 l/Pa measured at 5 seconds with an applied shear stress between about 50 kPa and about 500 kPa, and a strain recovery of at least about 50% at at least one point of applied shear stress within the range of about 5 kPa to about 500 kPa within about 1 minute after removing the applied shear stress.

Abstract: The present invention is an assembly layer for a flexible device. The assembly layer is derived from precursors that include an alkyl(meth)acrylate ester having 1 to 24 carbon atoms in the alkyl group and a free-radical generating initiator. Within a temperature range of between ?30° C. to 90° C., the assembly layer has a shear storage modulus at a frequency of 1 Hz that does not exceed 2 MPa, a shear creep compliance (J) of at least 6×10?6 1/Pa measured at 5 seconds with an applied shear stress between 50 kPa and 500 kPa, and a strain recovery of at least 50% at at least one point of applied shear stress within the range of 5 kPa to 500 kPa within 1 minute after removing the applied shear stress. In a preferred embodiment, the flexible device is a flexible electronic display.

Abstract: Polymerizable dental compositions comprising a redox initiator system is disclosed. The redox initiator system comprises a photolabile transition metal complex that photolyzes and initiates the redox cycle.

Abstract: In one embodiment, an adhesive composition is described comprising a polyisobutylene polymer component, a styrene-isobutylene block copolymer, and optionally a tackifier. The polyisobutylene polymer component comprises one or more polyisobutylene polymers. The polyisobutylene polymer component has an average weight average molecular weight ranging from 15,000 g/mole to 300,000 g/mole. The weight ratio of block copolymer to polyisobutylene polymer of the adhesive composition is greater than 2.2:1. In some embodiments, the adhesive composition is a pressure sensitive adhesive.

Abstract: The present invention is an adhesive composition including at least one low molecular weight polyisobutylene polymer having a weight average molecular weight of about 75,000 or lower, at least one high molecular weight polyisobutylene polymer having a weight average molecular weight of about 120,000 or higher, and optionally, at least one tackifier.