Abstract: A design structure for an integrated circuit including a first wire of a first level of wiring tracks, a second wire of a second level of wiring tracks, a third wire of a third level of wiring tracks, and a fourth wire located a first distance from the second wire in the second level of wiring tracks. A first via connects the first and second wires at a first location of the second wire. A second via connects the second and third wires at the first location, the second via is substantially axially aligned with the first via. A third via connecting the third and fourth wires at a second location of the fourth wire. A fourth via connecting the first and fourth wires at the second location, the fourth via is substantially axially aligned with the third via. The second, third, and fourth vias, and the third and fourth wires form a path between the first and second wires redundant to the first via.

Abstract: A method of estimating integrated circuit yield comprises providing an integrated circuit layout and a set of systematic defects based on a manufacturing process. Next, the method represents a systematic defect by modifying structures in the integrated circuit layout to create modified structures. More specifically, for short-circuit-causing defects, the method pre-expands the structures when the structures comprise a higher systematic defect sensitivity level, and pre-shrinks the structures when the structures comprise a lower systematic defect sensitivity level. Following this, a critical area analysis is performed on the integrated circuit layout using the modified structures, wherein dot-throwing, geometric expansion, or Voronoi diagrams are used. The method then computes a fault density value, random defects and systematic defects are computed.

Abstract: A method, apparatus, system, and computer program product that performs yield estimates using critical area analysis on integrated circuits having redundant and non-redundant elements. The non-redundant elements are ignored or removed from the critical area analysis performed for undesired opens.

Abstract: A method of layout optimization containing parameterized cells includes reading a physical design containing parameterized cells, creating a new version for each of usage of a given parameterized cell. The method optimizes physical design shapes of each new version of the parameterized cell by assigning variables to parameters of the parameterized cell according to a desired objective. Then, the method updates the parameters of each new version of the parameterized cell and replaces each new version of the parameterized cell with an instance of the parameterized cell having updated parameters. The method can optionally adjust physical design shapes based on constraints related to the parameters.

Abstract: A method, apparatus, and computer program product that performs yield estimates using critical area analysis on integrated circuits having redundant and non-redundant elements. The non-redundant elements are ignored or removed from the critical area analysis performed for undesired opens.

Abstract: A method of modifying a VLSI layout for performance optimization includes defining a revised set of ground rules for a plurality of original device shapes to be modified and flattening the plurality of original device shapes to a prime cell. A layout optimization operation is performed on the flattened device shapes, based on the revised set of ground rules, so as to create a plurality of revised device shapes. An overlay cell is then created from a difference between the revised device shapes and the original device shapes.

Abstract: A method of polygonal area design rule correction for use in an electronic design automation tool for governing integrated circuit (IC) design layouts using one-dimensional (1-D) optimization, with steps of analyzing IC design layout data to identify violating polygons, partitioning violating polygons into rectangles in a direction of optimization, formulating an area constraint for each violating polygon to formulate a global linear programming (LP) problem that includes each constraint for each violating polygon and solving the global LP problem to obtain a real-valued solution. A next LP problem is created for each area constraint, and solved. The creating a next and solving the next LP problem and solving are repeated until the last “next LP problem” is solved using constraints and objectives representing sums or differences of no more than two optimization variables.

Abstract: A method, system and program product for context aware sub-circuit layout modification are disclosed. The method may include defining at least one context for the sub-circuit for each circuit that uses the sub-circuit; in the case that a plurality of contexts are defined, minimizing a number of contexts for the sub-circuit by combining contexts into at least one stage; placing each stage into a staged layout; and modifying the sub-circuit by modifying the staged layout.

Abstract: A method of estimating integrated circuit yield comprises providing an integrated circuit layout and a set of systematic defects based on a manufacturing process. Next, the method represents a systematic defect by modifying structures in the integrated circuit layout to create modified structures. More specifically, for short-circuit-causing defects, the method pre-expands the structures when the structures comprise a higher systematic defect sensitivity level, and pre-shrinks the structures when the structures comprise a lower systematic defect sensitivity level. Following this, a critical area analysis is performed on the integrated circuit layout using the modified structures, wherein dot-throwing, geometric expansion, or Voronoi diagrams are used. The method then computes a fault density value, random defects and systematic defects are computed.

Abstract: Disclosed herein are embodiments of a system and an associated method for analyzing an integrated circuit to determine the value of a particular attribute (i.e., a physical or electrical property) in that integrated circuit. In the embodiments, an open deterministic sequencing technique is used to select a sequence of points representing centers of sample windows in an integrated circuit layout. Then, the value of the particular attribute is determined for each sample window and the results are accumulated in order to infer an overall value for that particular attribute for the entire integrated circuit layout. This sequencing technique has the advantage of allowing additional sample windows to be added and/or the sizes and shapes of the windows to be varied without hindering the quality of the sample.

Abstract: A method comprises extracting a hierarchical grid constraint set and modeling one or more critical objects of at least one cell as a variable set. The method further comprises solving a linear programming problem based on the hierarchical grid constraint set with the variable set to provide initial locations of the critical objects of the at least one cell and determining target on-grid locations of the one or more critical objects in the at least one cell using the results of the linear programming solution.

Abstract: Methods of independently migrating a hierarchical design are disclosed. A method for migrating a macro in an integrated circuit comprises: determining an interface strategy between a base cell in the macro and the macro, the base cell including an interface element involved in the interface strategy; migrating the base cell independently with respect to the macro based on the interface strategy; initially scaling the macro; swapping the migrated base cell into the macro; and legalizing content of the initially scaled macro.

Abstract: A method, apparatus, and computer program product for optimizing the layout of an integrated circuit design. Base ground rules and recommended ground rules are prioritized according to the impact they have on the yield of the integrated circuit design. The layout is optimized according to the prioritized base ground rules and recommended ground rules.

Abstract: An integrated circuit and program product for predicting yield of a VLSI design. An integrated circuit is provided including a system for identifying and grouping sub-circuits contained within an integrated circuit design by circuit type; a critical area calculation system for determining critical area values for different regions, wherein each different region is associated with a circuit type; a tallying system for calculating a plurality of tallies of critical area values based on circuit type; and a plurality of modeling subsystems for separately modeling each of the plurality of tallies based on circuit type.

Abstract: Disclosed is a method that predicts test yield for a semiconductor product, prior to design layout. This is accomplished by applying a critical area analysis to individual library elements that are used to form a specific product and by estimating the test yield impact of combining these library elements. For example, the method considers the test yield impact of sensitivity to library element to library element shorts and the test yield impact of sensitivity to wiring faults. The disclosed method further allows die size growth to be traded off against the use of library elements with higher test yield in order to provide an optimal design solution. Thus, the method may be used to modify library element selection so as to optimize test yield. Lastly, the method further repeats itself at key design checkpoints to revalidate initial test yield (and cost) assumptions made when the product was quoted to a customer.

Abstract: A method of optimizing hierarchical very large scale integration (VLSI) design by use of cluster-based cell cloning. The method of the present invention provides improved yield or migration by reusing cells in order to reduce the number of unique instances of at least one of the reused cells. The method performs hierarchal optimization on the reduced set of clones (i.e., clusters). The method of the present disclosure includes, but is not limited to, the steps of setting the initial clustering parameters; assembling the physical design from existing reused cells; for each cell type, performing a full cloning operation in order to create a full set of duplicate cells; for each cell type, performing a full optimization of the design; for each cell type, performing an analyses of all cell environments and performing a clustering operation; and analyzing the overall results in order to determine whether the optimization objectives are achieved.

Abstract: A method, apparatus, and computer program product for visually indicating the interaction between one or more edges of a design that contribute to a defined critical area pattern.

Abstract: Embodiments herein provide a method and computer program product for optimizing router settings to increase IC yield. A method begins by reviewing yield data in an IC manufacturing line to identify structure-specific mechanisms that impact IC yield. Next, the method establishes a structural identifier for each structure-specific mechanism, wherein the structural identifiers include wire codes, tags, and/or unique identifiers. Different structural identifiers are established for wires having different widths. Furthermore, the method establishes a weighting factor for each structure-specific mechanism, wherein higher weighting factors are established for structure-specific mechanisms comprising thick wires proximate to multiple thick wires. The method establishes the structural identifiers and the weighting factors for incidence of spacing between single wide lines, double wide lines, and triple wide lines and for incidence of wires above large metal lands.

Abstract: VLSI lithographic fidelity is improved via reducing the pattern space of difficult patterns or structures in a design layout for an integrated circuit design, and thereby increasing the regularity of the design, by converting patterns or structures that are similar but not identical to one another into a smaller set of canonical geometric configurations. By doing so, lithographic processing can be tuned to handle the smaller set of configurations more accurately and efficiently.

Abstract: An integrated circuit including a first wire of a first level of wiring tracks, a second wire of a second level of wiring tracks, a third wire of a third level of wiring tracks, and a fourth wire located a first distance from the second wire in the second level of wiring tracks. A first via connects the first and second wires at a first location of the second wire. A second via connects the second and third wires at the first location, the second via is substantially axially aligned with the first via. A third via connecting the third and fourth wires at a second location of the fourth wire. A fourth via connecting the first and fourth wires at the second location, the fourth via is substantially axially aligned with the third via. The second, third, and fourth vias, and the third and Fourth wires form a path between the first and second wires redundant to the first via.