Abstract: A mount for mounting a door to rack includes a plate including a first end and a second end opposite the first end, and a hinge arm adjustably coupled with the plate and extending at an angle from a first side of the plate adjacent to the first end, the hinge arm including a door pin receptacle to receive a door pin therein for coupling the door to the rack via the plate.

Abstract: A system includes a support rack and a component housing. The support rack includes a pair of vertically-extending panels, and each panel of the pair of vertically-extending panels has one or more first mating members of a water coupler pair extending outwardly from the support rack. The component housing is slidably disposed between the pair of vertically-extending panels and has a front panel, a pair of sidewalls extending rearwardly from the front panel, a component water line, and two second mating members of the water coupler pair connected to each other by the component water line.

Abstract: A method and apparatus is provided for providing air to a rack system. In one embodiment, the apparatus may include a duct adapted to channel air into a receiving section of the rack system. The apparatus may also include an adjustable separator within the duct to direct incoming air into partitions corresponding to the receiving section of the rack system before exiting the duct. The adjustable separator may have an adjustability of length and have a paneling made of a flexible material.

Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

Abstract: An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.

Abstract: Identification of a material composition. The material composition is configured with a sequential pattern applied to one or more surfaces of the body. The sequential pattern identifies the specific material composition. A discrete section or sub-section of the material is analyzed, after which the discrete section or sub-section may be sorted for recycling.

Abstract: Identification of a material composition. The material composition is configured with a sequential pattern applied to one or more surfaces of the body. The sequential pattern identifies the specific material composition. A discrete section or sub-section of the material is analyzed, after which the discrete section or sub-section may be sorted for recycling.

Abstract: A mounting system, in one embodiment, includes two support ears, each support ear adapted for securing an electronic component to a rack. Each support ear includes a planar portion which includes at least one hole for receiving one or more fasteners for coupling to a side of the electronic component and a portion extending perpendicular to the planar portion having a frontal area. The perpendicular portion includes at least one pin positioned on a side opposite the frontal area for engaging with at least one hole in the rack, the at least one pin extending normal to the perpendicular portion in a direction about parallel to a plane of the planar portion, and a first fastener positioned on the side opposite the frontal area for coupling to the rack, the first fastener extending normal to the perpendicular portion in the direction about parallel to the plane of the planar portion.

Abstract: A mounting system, in one embodiment, includes two support ears, each support ear adapted for securing an electronic component to a rack. Each support ear includes a planar portion which includes at least one hole for receiving one or more fasteners for coupling to a side of the electronic component and a portion extending perpendicular to the planar portion having a frontal area. The perpendicular portion includes at least one pin positioned on a side opposite the frontal area for engaging with at least one hole in the rack, the at least one pin extending normal to the perpendicular portion in a direction about parallel to a plane of the planar portion, and a first fastener positioned on the side opposite the frontal area for coupling to the rack, the first fastener extending normal to the perpendicular portion in the direction about parallel to the plane of the planar portion.