Abstract: Apparatuses, systems, and methods for error correction. A memory device may have a number of memory cells each of which stores a bit of information. One or more error correction code (ECC) may be used to determine if the bits of information contain any errors. To mitigate the effects of failures of adjacent memory cells, the information may be divided into a first group and a second group, where each group contains information from memory cells which are non-adjacent to other memory cells of that group. Each group of information may include data bits and parity bits used to correct those data bits. For example, as part of a read operation, a first ECC circuit may receive information from even numbered memory cells, while a second ECC circuit may receive information from odd numbered memory cells.

Abstract: Memory devices are disclosed. A memory device may include a number of column planes, and at least one circuit. The at least one circuit may be configured to receive test result data for a column address for each column plane of the number of column planes of the memory array. The at least one circuit may also be configured to convert the test result data to a first result responsive to only one bit of a number of bits of the number of column planes failing a test for the column address. Further, the at least one circuit may be configured to convert the test result data to a second result responsive to only one column plane failing the test for the column address and more than one bit of the one column plane being defective. Methods of testing a memory device, and electronic systems are also disclosed.

Abstract: Memory devices, systems, and associated methods with per die temperature-compensated refresh control, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory cells and a sensor configured to measure a temperature of the memory device. The memory device determines a frequency at which it is receiving refresh commands. The memory device is further configured to skip refresh operations of the memory cells based, at least in part, on the determination and on the temperature of the memory device.

Abstract: Methods of testing memory devices are disclosed. A method may include reading from a number of memory addresses of a memory array of the memory device and identifying each memory address of the number of addresses as either a pass or a fail. The method may further include storing, for each identified fail, data associated with the identified fail in a buffer of the memory device. Further, the method may include conveying, to a tester external to the memory device, at least some of the data associated with each identified fail without conveying address data associated with each identified pass to the tester. Devices and systems are also disclosed.

Abstract: Memory devices, systems, and associated methods with per die temperature-compensated refresh control, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory cells and a sensor configured to measure a temperature of the memory device. The memory device determines a frequency at which it is receiving refresh commands. The memory device is further configured to skip refresh operations of the memory cells based, at least in part, on the determination and on the temperature of the memory device.

Abstract: Memory devices are disclosed. A memory device may include a number of fuses and a number of transmit lines configured to transmit data from the number of fuses. The memory device may also include a number of monitoring circuits. Each monitoring circuit of the number of monitoring circuits is coupled to a transmit line of the number of transmit lines. Each monitoring circuit comprises logic configured to receive the data from the number fuses via the transmit line. The logic is further configured to generate a result responsive to the data and indicative of pass/fail status of the transmit line. Associated methods and systems are also disclosed.

Abstract: Command/address (CA) pads of a wafer may be coupled with one or more logic circuits of the wafer to support transmission of a test signal between different memory dies of the wafer. A CA pad of a first memory die may be coupled with a repeater circuit in a scribe region of the wafer, and the repeater circuit may be coupled with a corresponding control circuit in the scribe region. These circuits may support repetition of a signal from a probe card to one or more other CA conductive paths of one or more other memory dies of the wafer. The repeater circuit may receive a test signal from the CA pad, which may be coupled with and receive the test signal from the probe card, and may transmit the test signal to another CA pad of another memory die based on a configuration of the control circuit.

Abstract: Methods, systems, and devices for memory device random option inversion are described. A memory device may use a second set of fuses to selectively invert options associated with a first set of fuses (e.g., blown fuses). The first set of fuses may output a first set of logic states. Option inversion logic circuitry may perform decoding based on a second set of logic states output by the second set of fuses to identify logic states of the second set of logic states that match the first set of logic states. Based on identifying the logic states, the option inversion logic circuitry may select either a logic state of the first set of logic states or an inverted logic state corresponding to the logic state, and store the selected logic state in a latch of the memory device.

Abstract: Apparatuses, systems, and methods for error correction. A memory device may have a number of memory cells each of which stores a bit of information. One or more error correction code (ECC) may be used to determine if the bits of information contain any errors. To mitigate the effects of failures of adjacent memory cells, the information may be divided into a first group and a second group, where each group contains information from memory cells which are non-adjacent to other memory cells of that group. Each group of information may include data bits and parity hits used to correct those data bits. For example, as part of a read operation, a first ECC circuit may receive information from even numbered memory cells, while a second ECC circuit may receive information from odd numbered memory cells.

Abstract: Methods, systems, and devices for data compression for global column repair are described. In some cases, a testing device may perform a first internal read operation to identify errors associated with on one or more column planes. A value (e.g., a bit) indicating whether an error occurred when testing each column plane may be stored. The testing device may perform a second internal read operation on the same column planes, or on column planes of a different bank of memory cells. The values (e.g., bits) indicating whether errors occurred during the first internal read operation and the values indicating whether errors occurred during the second internal read operation may be combined and stored in a register. The stored values may be read out (e.g., as a burst) to repair the defective column planes.

Abstract: An apparatus includes: a master die; one or more slave dies; a ZQ resister between a first node and a second node coupled to a voltage terminal; a ZQ pad coupled to each of the first node of the ZQ resister, the master die and the one or more slave dies; and a calibration channel electrically coupling the master die and the one or more slave dies, the calibration channel configured to communicate signals between the master die and the one or more slave dies for coordinating access to the ZQ pad across the master die and the one or more slave dies.

Abstract: An example fuse error detection circuit configured to receive a first data set from a fuse array during a first fuse data broadcast and to encode the first data set to provide first signature data. The fuse error detection circuit is further configured to receive a second data set from the fuse array during a second fuse data broadcast and to encode the second data set to provide second signature data. The fuse error detection circuit is further configured to compare the first signature data and the second signature data and to provide a match indication having a value based on the comparison between the first signature data and the second signature data.

Abstract: Methods, systems, and devices for memory read masking are described. In some cases, a portion of a memory device, such as a portion of a memory array, may be disabled. During a testing operation, a command for accessing one or more memory cells of the disabled portion may be received, and the associated memory cells may be attempted to be accessed. Based on attempting to access the disabled memory cells, a logic state of the disabled cells may be masked. Outputting the masked value may indicate (e.g., to a testing device) that the disabled cells pass the test (e.g., that the memory cells are valid), which may allow for the enabled memory cells and the disabled memory cells of the memory device to be tested using a single test mode.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for timing refresh operations in a memory device. An apparatus may include an oscillator that provides a periodic signal to one or more refresh timer circuits. Each of the refresh timer circuits is associated with a respective memory bank in the memory device. The refresh timer may include a counter block and a control logic block. The control logic block may gate the periodic signal to the counter block. The counter block may count the row active signal time and the row precharge time. The counter signals may be used by the control logic block to output a number of pumps of a refresh operation.

Abstract: An apparatus includes: a master die; one or more slave dies; a ZQ resister between a first node and a second node coupled to a voltage terminal; a ZQ pad coupled to each of the first node of the ZQ resister, the master die and the one or more slave dies; and a calibration channel electrically coupling the master die and the one or more slave dies, the calibration channel configured to communicate signals between the master die and the one or more slave dies for coordinating access to the ZQ pad across the master die and the one or more slave dies.

Abstract: Systems and methods for performing an efficient ZQ calibration are provided herein. The described techniques use non-linearity compensation circuitry configured to compensate for a non-linear relationship between variation in a plurality of ZQ calibration codes and corresponding resistance variations, by adjusting either: a magnitude of the adjustment to the calibration step, the ZQCODE to an alternative ZQCODE, or both the magnitude of the adjustment to the calibration step and the ZQCODE to the alternative ZQCODE.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for timing refresh operations in a memory device. An apparatus may include an oscillator that provides a periodic signal to one or more refresh timer circuits. Each of the refresh timer circuits is associated with a respective memory bank in the memory device. The refresh timer may include a counter block and a control logic block. The control logic block may gate the periodic signal to the counter block. The counter block may count the row active signal time and the row precharge time. The counter signals may be used by the control logic block to output a number of pumps of a refresh operation.

Abstract: An apparatus includes: a master die; one or more slave dies; a ZQ resister between a first node and a second node coupled to a voltage terminal; a ZQ pad coupled to each of the first node of the ZQ resister, the master die and the one or more slave dies; and a calibration channel electrically coupling the master die and the one or more slave dies, the calibration channel configured to communicate signals between the master die and the one or more slave dies for coordinating access to the ZQ pad across the master die and the one or more slave dies.

Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for timing refresh operations in a memory device. An apparatus may include an oscillator that provides a periodic signal to one or more refresh timer circuits. Each of the refresh timer circuits is associated with a respective memory bank in the memory device. The refresh timer may include a counter block and a control logic block. The control logic block may gate the periodic signal to the counter block. The counter block may count the row active signal time and the row precharge time. The counter signals may be used by the control logic block to output a number of pumps of a refresh operation.

Abstract: Systems and methods for performing an efficient ZQ calibration are provided herein. The described techniques use non-linearity compensation circuitry configured to compensate for a non-linear relationship between variation in a plurality of ZQ calibration codes and corresponding resistance variations, by adjusting either: a magnitude of the adjustment to the calibration step, the ZQCODE to an alternative ZQCODE, or both the magnitude of the adjustment to the calibration step and the ZQCODE to the alternative ZQCODE.