Abstract: Disclosed herein is an integrated photonics device including an on-chip wavelength stability monitor. The wavelength stability monitor may include one or more interferometric components, such as Mach-Zehnder interferometers and can be configured to select among the output signals from the interferometric components for monitoring the wavelength emitted by a corresponding photonic component, such as a light source. The selection may be based on a slope of the output signal and in some examples may correspond to a working zone at or around a wavelength or wavelength range. In some examples, the interferometric components can be configured with different phase differences such that the corresponding working zones have different wavelengths. In some examples, the slopes of the output signals may be weighted based on the steepness of the slope and all of the output signals may include information for wavelength locking the measured wavelength to the target wavelength.

Abstract: Configurations for an optical coupler that includes waveguides that provide asymmetric mode confinement. The optical coupler may include first and second rib waveguides, and the width of the shoulder of at least one rib waveguide may taper to provide the asymmetric mode confinement. In some instances the shoulders of one or both rib waveguides may have different heights in a central region of the optical coupler.

Abstract: Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

Abstract: Disclosed herein is an integrated photonics device including an on-chip wavelength stability monitor. The wavelength stability monitor may include one or more interferometric components, such as Mach-Zehnder interferometers and can be configured to select among the output signals from the interferometric components for monitoring the wavelength emitted by a corresponding photonic component, such as a light source. The selection may be based on a slope of the output signal and in some examples may correspond to a working zone at or around a wavelength or wavelength range. In some examples, the interferometric components can be configured with different phase differences such that the corresponding working zones have different wavelengths. In some examples, the slopes of the output signals may be weighted based on the steepness of the slope and all of the output signals may include information for wavelength locking the measured wavelength to the target wavelength.

Abstract: A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.

Abstract: Described here are optical sampling architectures and methods for operation thereof. An optical sampling architecture can be capable of emitting a launch sheet light beam towards a launch region and receiving a detection sheet light beam from a detection region. The launchregion can have one dimension that is elongated relative to another dimension. The detection region can also have one dimension elongated relative to another dimension such that the system can selectively accept light having one or more properties (e.g., angle of incidence, beam size, beam shape, etc.). In some examples, the elongated dimension of the detection region can be greater than the elongated dimension of the launch region. In some examples, the system can include an outcoupler array and associated components for creating a launch sheet light beam having light rays with different in-plane launch positions and/or in-plane launch angles.

Abstract: An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

Abstract: A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.

Abstract: An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

Abstract: This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

Abstract: This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

Abstract: Configurations for a photonics device with a vertical outcoupler and fabrication operations thereof are disclosed. The photonics device may include an off-cut substrate with a cavity. The cavity may be coated with a buffer layer, which may form the vertical outcoupler. The cavity may be filled with a fill material that provides structural integrity to the cavity. The off-cut substrate may have a first and a second cladding layer above and below it, to provide cladding for the waveguide structure. In some examples, light may propagate through the off-cut substrate and may be received by the outcoupler. The outcoupler may reflect and redirect the light out of the waveguide structure and toward one or more optical elements. The optical element(s) may provide the light to a launch region in a system interface and/or to a sample.

Abstract: Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

Abstract: A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.

Abstract: Described herein are one or more methods for integrating an optical component into an integrated photonics device. The die including a light source, an outcoupler, or both, may be bonded to a wafer having a cavity. The die can be encapsulated using an insulating material, such as an overmold, that surrounds its edges. Another (or the same) insulating material can surround conductive posts. Portions of the die, the overmold, and optionally, the conductive posts can be removed using a grinding and polishing process to create a planar top surface. The planar top surface enables flip-chip bonding and an improved connection to a heat sink. The process can continue with forming one or more additional conductive layers and/or insulating layers and electrically connecting the p-side and n-side contacts of the laser to a source.

Abstract: A device including a plurality of epitaxial chips is disclosed. An epitaxial chip can have one or more of a light source and a detector, where the detector can be configured to measure the optical properties of the light emitted by a light source. In some examples, one or more epitaxial chips can have one or more optical properties that differ from other epitaxial chips. The epitaxial chips can be dependently operable. For example, the detector located on one epitaxial chip can be configured for measuring the optical properties of light emitted by a light source located on another epitaxial chip by way of one or more optical signals. The collection of epitaxial chips can also allow detection of a plurality of laser outputs, where two or more epitaxial chips can have different material and/or optical properties.

Abstract: An integrated photonics device that emits light out towards a measured sample value is disclosed. The device can include a discrete optical unit that attaches to a supporting layer. The discrete optical unit can include mirror(s), optics, detector array(s), and traces. The supporting layer can include one or more cavities having facet walls. Light emitter(s) can emit light that propagate through waveguide(s). The emitted light can exit the waveguide(s) (via termination point(s)), enter the one or more cavities at the facet walls, and be received by receiving facets of the discrete optical unit. The mirror(s) of the discrete optical unit can redirect the received light towards collimating optics, which can direct the light out of the device through the system interface. The discrete optical unit can be formed separately from the supporting layer or bonded to the supporting layer after the mirror, optics, detector arrays, and traces are formed.

Abstract: In example implementations, an apparatus includes a plurality of nodes, a pump coupled to the plurality of nodes and a connection network. In one example, each one of the plurality of nodes may store a value. The pump provides energy to the each one of the plurality of nodes. The connection network may include a two dimensional array of elements, wherein each group of the two dimensional array of elements is in communication with a respective one of the plurality of nodes, wherein the connection network may be tuned with parameters associated with encoding of an Ising problem. The connection network may process the value stored in each one of the plurality of nodes. The Ising problem may be solved by the value stored in each one of the plurality of nodes at a minimum energy level.

Abstract: Described here are optical sampling architectures and methods for operation thereof. An optical sampling architecture can be capable of emitting a launch sheet light beam towards a launch region and receiving a detection sheet light beam from a detection region. The launch region can have one dimension that is elongated relative to another dimension. The detection region can also have one dimension elongated relative to another dimension such that the system can selectively accept light having one or more properties (e.g., angle of incidence, beam size, beam shape, etc.). In some examples, the elongated dimension of the detection region can be greater than the elongated dimension of the launch region. In some examples, the system can include an outcoupler array and associated components for creating a launch sheet light beam having light rays with different in-plane launch positions and/or in-plane launch angles.

Abstract: Described herein is a top-side vertical outcoupler for use in an integrated photonics device. The integrated photonics device can include a photonics circuit, where light can propagate through waveguide(s) to outcoupler(s). The outcoupler(s) can redirect the light to optics, which can then collimate, focus, and/or direct the light to a launch region located on an external surface of the device. The integrated photonics device can include a plurality of layers deposited on a supporting layer. The plurality of layers can be used to form the waveguide(s) and the outcoupler(s). By forming the outcoupler(s) of the same material as the waveguide(s), the amount of light that is lost can be reduced or minimized. Additionally, the reduced number of interfaces that the light has to pass through to reach the outcoupler(s) can allow for better control of the divergence angles of the emitted light.