Abstract: A method (20, 104) for processing a panel (26, 128) during semiconductor device (52) fabrication entails forming grooves (72, 142) in a surface (34, 132) of the panel (26, 128) coincident with a dicing pattern (54) for the panel (26, 128). The grooves (72, 142) extend partially through the panel (26, 128) so that the panel (26, 128) remains intact. The grooves (72, 142) relieve stress in the panel (26, 128) to reduce panel (26, 128) warpage, thus enabling the panel (26, 128) to be reliably held on a support structure (88, 98, 138) via vacuum when undergoing further processing, such as solder printing (86). The method (20, 104) further entails, dicing (96, 152) through the panel (26, 128) from the surface (34, 132) in accordance with the dicing pattern (54) while the panel (26, 128) is mounted on the support structure (98, 138) to singularize the semiconductor devices (52).

Abstract: Polishing pads with a window, systems containing such polishing pads, and processes that use such polishing pads are disclosed. In embodiments, a polishing pad includes a backing layer having an opening, a polishing layer having an opening aligned with the opening in the backing layer, a solid window of a first material in the opening of the polishing layer, a layer of a first adhesive material between the backing layer and the solid window, and a layer of a second adhesive material between the layer of the first adhesive material and the window.

Abstract: Polishing pads with a window, systems containing such polishing pads, and processes that use such polishing pads are disclosed.