Abstract: Methodologies enabling BEoL VNCAPs in ICs and resulting devices are disclosed. Embodiments include: providing a plurality of mandrel recesses extending horizontally on a substrate, each of the mandrel recesses having an identical width and being separated from another one of the mandrel recesses by an identical distance; providing a plurality of routes, each of the plurality of routes being positioned in a different one of the mandrel recesses; and providing first and second vertical segments on the substrate, the first vertical segment being connected to a set of the plurality of routes and separated from the second vertical segment, and the second vertical segment being separated from the set of routes.

Abstract: In Positron Emission Tomography, a time window (260) and an energy window (225) are dynamically adjusted, based on an attenuation map, count rate, clinical application, discrimination tailoring, and/or offline discrimination tailoring. Detected radiation events are filtered using the dynamically adjusted energy and time windows into scattered events, random events, and true events. The true events are input to image reconstruction, correction, and error analysis.

Abstract: A photovoltaic device includes a substrate extending between opposite edges, a plurality of photovoltaic cells electrically coupled with each other in series, wherein the plurality of photovoltaic cells includes at least one current-limiting photovoltaic cell, and at least one corrective optic lens positioned over the at least one current-limiting photovoltaic cell. The at least one corrective optic lens is configured to focus light into the at least one current-limiting photovoltaic cell so that current passing through the current-limiting photovoltaic cell is boosted. A monitoring system may include at least one light source aligned with at least one of the plurality of photovoltaic cells. The light source(s) may be configured to emit light into the at least one of the plurality of photovoltaic cells to determine if the power output of the photovoltaic device remains constant.

Abstract: An approach for providing MOL constructs using diffusion contact structures is disclosed. Embodiments include: providing a first diffusion region in a substrate; providing, via a first lithography process, a first diffusion contact structure; providing, via a second lithography process, a second diffusion contact structure; and coupling the first diffusion contact structure to the first diffusion region and the second diffusion contact structure. Embodiments include: providing a second diffusion region in the substrate; providing a diffusion gap region between the first and second diffusion regions; providing the diffusion contact structure over the diffusion gap region; and coupling, via the diffusion contact structure, the first and second diffusion regions.

Abstract: A method comprises: acquiring imaging data using a tomographic radiological imaging apparatus (10); updating a calibration (42, 52) based on current information about the imaging apparatus; calibrating the imaging data using the up-to-date calibration; and reconstructing the calibrated imaging data to generate an image. The updating may be based on a current state of an idle or parked imaging modality that is not used in acquiring the imaging data, or on a measurement acquired together with the imaging data, or on the imaging data itself. For cone-beam computed tomography (CBCT) imaging data, the updating may comprise determining an intensity scale based upon intensity of at least one air pixel measured during the acquiring of the CBCT imaging data and updating an air scan template (60) by the intensity scale.

Abstract: Provided herein are methods of incorporating additives into thin-film solar cell substrates and back contacts. In certain embodiments, sodium is incorporated into a substrate or a back contact of a thin-film photovoltaic stack where it can diffuse into a CIGS or other absorber layer to improve efficiency and/or growth of the layer. The methods involve laser treating the substrate or back contact in the presence of a sodium (or sodium-containing) solid or vapor to thereby incorporate sodium into the surface of the substrate or back contact. In certain embodiments, the surface is simultaneously smoothed.

Abstract: Methods of manufacturing photovoltaic modules are provided. One method includes providing a substrate and depositing a lower electrode above the substrate. The method also includes depositing a lower stack of microcrystalline silicon layers above the lower electrode, depositing an upper stack of amorphous silicon layers above the lower stack of microcrystalline silicon layers, and depositing an upper electrode above the upper stack of amorphous silicon layers. At least one of the lower stack and the upper stack includes an N-I-P stack of silicon layers having an n-doped silicon layer, an intrinsic silicon layer, and a p-doped silicon layer. The intrinsic silicon layer has an energy band gap that is reduced by depositing the intrinsic silicon layer at a temperature of at least 250 degrees Celsius.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: Provided herein are methods of polishing, cleaning and texturing back contacts of thin-film solar cells. According to various embodiments, the methods involve irradiating sites on the back contact with laser beams to remove contaminants and/or smooth the surface of the back contact. The back contact, e.g., a molybdenum, copper, or niobium thin-film, is smoothed prior to deposition of the absorber and other thin-films of the photovoltaic stack. In certain embodiments, laser polishing of the back contact is used to enhance the diffusion barrier characteristics of the back contact layer, with all or a surface layer of the back contact becoming essentially amorphous. In certain embodiments, the adhesion of the absorber layer is enhanced by the textured back contact and by the presence of the amorphous metal at the deposition surface.

Abstract: Provided herein are methods of polishing and texturing surfaces thin-film photovoltaic cell substrates. The methods involve laser irradiation of a surface having a high frequency roughness in an area of 5-200 microns to form a shallow and rapidly expanding melt pool, followed by rapid cooling of the material surface. The minimization of surface tension causes the surface to re-solidify in a locally smooth surface. the high frequency roughness drops over the surface with a lower frequency bump or texture pattern remaining from the re-solidification.

Abstract: A photovoltaic device includes first and second photovoltaic cells, with each of the first and second photovoltaic cells having a substrate, a lower electrode disposed above the substrate along a deposition axis and that includes a conductive light transmissive layer, one or more semiconductor layers disposed above the substrate along the deposition axis, and an upper electrode disposed above the one or more semiconductor layers along the deposition axis. The semiconductor layers convert incident light into an electric current. The first and second photovoltaic cells are separated by first and second separation gaps. The first separation gap extend along the deposition axis through the lower electrode from the substrate and the second separation gap extends from a deposition surface of the light transmissive layer of the lower electrode and through a remainder of the lower electrode and the one or more semiconductor layers along the deposition axis.

Abstract: Provided herein are improved methods of laser scribing photovoltaic structures to form monolithically integrated photovoltaic modules. The methods involve forming P1, P2 or P3 scribes by an ablative scribing mechanism having low melting, and in certain embodiments, substantially no melting. In certain embodiments, the methods involve generating an ablation shockwave at an interface of the film to be removed and the underlying layer. The film is then removed by mechanical shock. According to various embodiments, the ablation shockwave is generated by using a laser beam having a wavelength providing an optical penetration depth on the order of the film thickness and a minimum threshold intensity. In one embodiment, material including an absorber layer is scribed using an infrared laser source and a picosecond pulse width.

Abstract: A solar-cell module. The solar-cell module includes a plurality of solar cells that are electrically coupled together. The solar-cell module further includes an in-laminate-diode assembly electrically coupled with the plurality of solar cells. The in-laminate-diode assembly is configured to prevent power loss. The solar-cell module also includes a protective structure at least partially encapsulating the plurality of solar cells. In addition, the solar-cell module includes a plurality of external-connection mechanisms mounted to a respective plurality of edge regions of the protective structure. An external-connection mechanism of the plurality of external-connection mechanisms is configured to enable collection of current from the plurality of solar cells and to allow interconnection with at least one other external device.

Abstract: A photovoltaic device includes: a substrate; lower and upper electrode layers disposed above the substrate; and a semiconductor layer disposed between the lower and upper electrode layers, the semiconductor layer absorbing incident light to excite electrons from the semiconductor layer, wherein the semiconductor layer includes a built-in bypass diode extending between and coupled with the lower and upper electrode layers, the bypass diode permitting electric current to flow through the bypass diode when a reverse bias is applied across the lower and upper electrode layers.

Abstract: A method of manufacturing a photovoltaic module is provided. The method includes providing an electrically insulating substrate and a lower electrode, depositing a lower stack of silicon layers above the lower electrode, and depositing an upper stack of silicon layers above the lower stack. The lower and upper stacks include N-I-P junctions. The lower stack has an energy band gap of at least 1.60 eV while the upper stack has an energy band gap of at least 1.80 eV. The method also includes providing an upper electrode above the upper stack. The lower and upper stacks convert incident light into an electric potential between the upper and lower electrodes with the lower and upper stacks converting different portions of the light into the electric potential based on wavelengths of the light.

Abstract: A monolithically-integrated photovoltaic module is provided. The module includes an electrically insulating substrate, a lower stack of microcrystalline silicon layers above the substrate, a middle stack of amorphous silicon layers above the lower stack, an upper stack of amorphous silicon layers above the middle stack, and a light transmissive cover layer above the upper stack. An energy band gap of each of the lower, middle and upper stacks differs from one another such that a different spectrum of incident light is absorbed by each of the lower, middle and upper stacks.

Abstract: A monolithically-integrated photovoltaic module is provided. The module includes an insulating substrate and a lower electrode above the substrate. The method also includes a lower stack of microcrystalline silicon layers above the lower electrode, an upper stack of amorphous silicon layers above the lower stack, and an upper electrode above the upper stack. The upper and lower stacks of silicon layers have different energy band gaps. The module also includes a built-in bypass diode vertically extending in the upper and lower stacks of silicon layers from the lower electrode to the upper electrode. The built-in bypass diode includes portions of the lower and upper stacks that have a greater crystalline portion than a remainder of the lower and upper stacks.

Abstract: Provided herein are methods of polishing, cleaning and texturing back contacts of thin-film solar cells. According to various embodiments, the methods involve irradiating sites on the back contact with laser beams to remove contaminants and/or smooth the surface of the back contact. The back contact, e.g., a molybdenum, copper, or niobium thin-film, is smoothed prior to deposition of the absorber and other thin-films of the photovoltaic stack. In certain embodiments, laser polishing of the back contact is used to enhance the diffusion barrier characteristics of the back contact layer, with all or a surface layer of the back contact becoming essentially amorphous. In certain embodiments, the adhesion of the absorber layer is enhanced by the textured back contact and by the presence of the amorphous metal at the deposition surface.

Abstract: Provided herein are methods of polishing and texturing surfaces thin-film photovoltaic cell substrates. The methods involve laser irradiation of a surface having a high frequency roughness in an area of 5-200 microns to form a shallow and rapidly expanding melt pool, followed by rapid cooling of the material surface. The minimization of surface tension causes the surface to re-solidify in a locally smooth surface. the high frequency roughness drops over the surface with a lower frequency bump or texture pattern remaining from the re-solidification.

Abstract: Provided herein are textured substrates for thin-film solar cells. According to various embodiments, the textured substrates are characterized by substrate patterns exhibiting low-frequency roughness or flatness and long range order. The substrates may be metallic or non-metallic substrates, and in certain embodiments are stainless steel foils. According to various embodiments, the substrates may be provided in the form of a web, ready for deposition of thin-film photovoltaic stacks. Also provided are textured back contact thin films.