Abstract: A shielded through-via that reduces the effect of parasitic capacitance between the through-via and surrounding wafer while providing high isolation from neighboring signals. A shield electrode is formed in the insulating region and spaced apart from the through-via. A coupling element couples at least the time-varying portion of the signal carried on the through-via to the shield electrode. This reduces the effect of any parasitic capacitance between the through-via and the shield electrode, hence the surrounding wafer.

Abstract: A system and method for determining and displaying return-on-investment (ROI) of components on a network is described. The system includes one or more processes that initiate and receive data streams directly or indirectly from components on the network or from other databases on the network. A dependency tree is created for each component relating each component to other components and to information characterizing the component. A portal is provided to export data feeds to other systems on the network and to generate reports and display usage information on each component on the network. Usage information may be grouped or summarized according to business function or by top level manager.

Abstract: In certain implementations, a method for chip singulation is provided including etching a frontside dicing trench from a front side of a wafer, forming a temporary holding material, in the frontside dicing trench, etching a backside dicing trench from a back side of the wafer along the frontside dicing trench, removing the temporary holding material and releasing the chip from the wafer or an adjacent chip. Certain implementations may include etching through surface deposited layers on the front side of the wafer. Certain implementations may further include completely filling the frontside dicing trench with the temporary holding material and etching the backside dicing trench to the temporary holding material that is in the frontside dicing trench, such that removing the temporary holding material self-dices the wafer. Certain implementations may include surrounding MEMS structures with the temporary holding material so as to hold the structures during etching of the back side of the wafer.

Abstract: A current sensor includes a deflectable member disposed in a magnetic field. Nulling or compensating members may be mechanically coupled to the deflectable member. Feedback or readout devices coupled to the structure provide signals indicative of deflection of the deflectable member under the influence of applied current and the magnetic field. Nulling current applied to the nulling members tends to oppose deflection of the deflectable member. The nulling current may be modulated to drive the feedback signal to a desired level and is used as a basis for calculating the current to be measured. The current may be measured directly upon calibration of feedback devices coupled to the deflectable member or to the nulling members. Arrays of sensors may be coupled to common busses for applying measured and nulling currents to sensors of the arrays and for detecting feedback signals.

Abstract: A current sensor includes a deflectable member disposed in a magnetic field. Nulling or compensating members may be mechanically coupled to the deflectable member. Feedback or readout devices coupled to the structure provide signals indicative of deflection of the deflectable member under the influence of applied current and the magnetic field. Nulling current applied to the nulling members tends to oppose deflection of the deflectable member. The nulling current may be modulated to drive the feedback signal to a desired level and is used as a basis for calculating the current to be measured. The current may be measured directly upon calibration of feedback devices coupled to the deflectable member or to the nulling members. Arrays of sensors may be coupled to common busses for applying measured and nulling currents to sensors of the arrays and for detecting feedback signals.

Abstract: A method is provided for sensing and measuring an electrical current. The current to be measured is applied to a deflectable member in a sensing module in the presence of a magnetic field. Deflection of the member is detected as an indication of the current. A nulling current may be applied to one or more additional deflectable members mechanically linked to the deflectable member. Feedback or readout signals indicative of deflection of the members are monitored. The nulling current is modulated to drive the feedback signals to a desired level. The nulling current value is converted to a value representative of the current to be measured.

Abstract: A current sensor includes a deflectable member disposed in a magnetic field. Nulling or compensating members may be mechanically coupled to the deflectable member. Feedback or readout devices coupled to the structure provide signals indicative of deflection of the deflectable member under the influence of applied current and the magnetic field. Nulling current applied to the nulling members tends to oppose deflection of the deflectable member. The nulling current may be modulated to drive the feedback signal to a desired level and is used as a basis for calculating the current to be measured. The current may be measured directly upon calibration of feedback devices coupled to the deflectable member or to the nulling members. Arrays of sensors may be coupled to common busses for applying measured and nulling currents to sensors of the arrays and for detecting feedback signals.

Abstract: A current sensor includes a deflectable member disposed in a magnetic field. Nulling or compensating members may be mechanically coupled to the deflectable member, Feedback or readout devices coupled to the structure provide signals indicative of deflection of the deflectable member under the influence of applied current and the magnetic field. Nulling current applied to the nulling members tends to oppose deflection of the deflectable member. The nulling current may be modulated to drive the feedback signal to a desired level and is used as a basis for calculating the current to be measured. The current may be measured directly upon calibration of feedback devices coupled to the deflectable member or to the nulling members. Arrays of sensors may be coupled to common busses for applying measured and nulling currents to sensors of the arrays and for detecting feedback signals.

Abstract: A current sensor includes a deflectable member disposed in a magnetic field. Nulling or compensating members may be mechanically coupled to the deflectable member. Feedback or readout devices coupled to the structure provide signals indicative of deflection of the deflectable member under the influence of applied current and the magnetic field. Nulling current applied to the nulling members tends to oppose deflection of the deflectable member. The nulling current may be modulated to drive the feedback signal to a desired level and is used as a basis for calculating the current to be measured. The current may be measured directly upon calibration of feedback devices coupled to the deflectable member or to the nulling members. Arrays of sensors may be coupled to common busses for applying measured and nulling currents to sensors of the arrays and for detecting feedback signals.

Abstract: A method is provided for sensing and measuring an electrical current. The current to be measured is applied to a deflectable member in a sensing module in the presence of a magnetic field. Deflection of the member is detected as an indication of the current. A nulling current may be applied to one or more additional deflectable members mechanically linked to the deflectable member. Feedback or readout signals indicative of deflection of the members are monitored. The nulling current is modulated to drive the feedback signals to a desired level. The nulling current value is converted to a value representative of the current to be measured.

Abstract: A boardlock for an electrical connector comprises a base adapted for being attached to a housing of the electrical connector, and a latch extending from the base. The latch forms first and second barbs extending from opposite edges proximate a free end thereof. The first and second barbs are respectively bent along different lines which are slightly slanted relative to a longitudinal direction of the latch and extend toward the free end of the latch whereby the first barb extends in a direction that is not parallel to the direction that the second barb extends in. An elongate aperture is formed between the first and second barbs.