Patents by Inventor Jay R. Wallace

Jay R. Wallace has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11361935
    Abstract: An extraction plate for an ion beam system. The extraction plate may include an insulator body that includes a peripheral portion, to connect to a first side of a plasma chamber, and further includes a central portion, defining a concave shape. As such, an extraction aperture may be arranged along a first surface of the central portion, where the first surface is oriented at a high angle with respect to the first side. The extraction plate may further include a patterned electrode, comprising a first portion and a second portion, affixed to an outer side of the insulator body, facing away from the plasma chamber, wherein the first portion is separated from the second portion by an insulating gap.
    Type: Grant
    Filed: November 7, 2020
    Date of Patent: June 14, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Costel Biloiu, Jay R. Wallace, Kevin M. Daniels, Frank Sinclair, Christopher Campbell
  • Publication number: 20220148843
    Abstract: An extraction plate for an ion beam system. The extraction plate may include an insulator body that includes a peripheral portion, to connect to a first side of a plasma chamber, and further includes a central portion, defining a concave shape. As such, an extraction aperture may be arranged along a first surface of the central portion, where the first surface is oriented at a high angle with respect to the first side. The extraction plate may further include a patterned electrode, comprising a first portion and a second portion, affixed to an outer side of the insulator body, facing away from the plasma chamber, wherein the first portion is separated from the second portion by an insulating gap.
    Type: Application
    Filed: November 7, 2020
    Publication date: May 12, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Costel Biloiu, Jay R. Wallace, Kevin M. Daniels, Frank Sinclair, Christopher Campbell
  • Publication number: 20220020557
    Abstract: An ion beam processing system including a plasma chamber, a plasma plate, disposed alongside the plasma chamber, the plasma plate defining a first extraction aperture, a beam blocker, disposed within the plasma chamber and facing the extraction aperture, a blocker electrode, disposed on a surface of the beam blocker outside of the plasma chamber, and an extraction electrode disposed on a surface of the plasma plate outside of the plasma chamber.
    Type: Application
    Filed: July 15, 2020
    Publication date: January 20, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Jay R. Wallace, Costel Biloiu, Kevin M. Daniels
  • Publication number: 20210391155
    Abstract: A processing system may include a plasma chamber operable to generate a plasma, and an extraction assembly, arranged along a side of the plasma chamber. The extraction assembly may include an extraction plate including an extraction aperture, the extraction plate having a non-planar shape, and generating an extracted ion beam at a high angle of incidence with respect to a perpendicular to a plane of a substrate, when the plane of the substrate is arranged parallel to the side of the plasma chamber.
    Type: Application
    Filed: January 27, 2021
    Publication date: December 16, 2021
    Applicant: Applied Materials, Inc.
    Inventors: Christopher Campbell, Costel Biloiu, Peter F. Kurunczi, Jay R. Wallace, Kevin M. Daniels, Kevin T. Ryan, Minab B. Teferi, Frank Sinclair, Joseph C. Olson
  • Publication number: 20180122670
    Abstract: An apparatus may include a platen to hold a substrate. A substrate plane structure may be disposed in front of the platen. The substrate plane structure has an opening therein. The apparatus may further include a removable structure disposed in the opening of the substrate plane structure. The removable structure may have an opening exposing a surface of the platen.
    Type: Application
    Filed: November 1, 2016
    Publication date: May 3, 2018
    Inventors: Ernest E. Allen, Richard John Hertel, Jay R. Wallace, Keith A. Miller
  • Patent number: 8791430
    Abstract: Disclosed are an apparatus, system, and method for scanning a substrate or other workpiece through a gas-cluster ion beam (GCIB), or any other type of ion beam. The workpiece scanning apparatus is configured to receive and hold a substrate for irradiation by the GCIB and to scan it through the GCIB in two directions using two movements: a reciprocating fast-scan movement, and a slow-scan movement. The slow-scan movement is actuated using a servo motor and a belt drive system, the belt drive system being configured to reduce the failure rate of the workpiece scanning apparatus.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: July 29, 2014
    Assignee: TEL Epion Inc.
    Inventors: Matthew C. Gwinn, Avrum Freytsis, Jay R. Wallace
  • Patent number: 8409399
    Abstract: A chemical oxide removal (COR) processing system is presented, wherein the COR processing system includes a first treatment chamber and a second treatment chamber. The first treatment chamber comprises a chemical treatment chamber that provides a temperature controlled chamber having a protective barrier. The second treatment chamber comprises a heat treatment chamber that provides a temperature-controlled chamber having a protective barrier.
    Type: Grant
    Filed: May 21, 2009
    Date of Patent: April 2, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Arthur H. LaFlamme, Jr., Thomas Hamelin, Jay R Wallace
  • Patent number: 8323410
    Abstract: A high throughput chemical treatment system for processing a plurality of substrates is described. The chemical treatment system is configured to chemically treat a plurality of substrates in a dry, non-plasma environment.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: December 4, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Jay R. Wallace, Hiroyuki Takahashi
  • Patent number: 8303716
    Abstract: A high throughput processing system having a chemical treatment system and a thermal treatment system for processing a plurality of substrates is described. The chemical treatment system is configured to chemically treat a plurality of substrates in a dry, non-plasma environment. The thermal treatment system is configured to thermally treat a plurality of substrates chemically treated in the chemical treatment system.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: November 6, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Jay R. Wallace, Thomas Hamelin
  • Patent number: 8287688
    Abstract: A high throughput chemical treatment system for processing a plurality of substrates is described. The chemical treatment system is configured to chemically treat a plurality of substrates in a dry, non-plasma environment. A substrate support in the chemical treatment system is configured to support a plurality of substrates.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: October 16, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Jay R. Wallace, Hiroyuki Takahashi
  • Publication number: 20120223249
    Abstract: Disclosed are an apparatus, system, and method for scanning a substrate or other workpiece through a gas-cluster ion beam (GCIB), or any other type of ion beam. The workpiece scanning apparatus is configured to receive and hold a substrate for irradiation by the GCIB and to scan it through the GCIB in two directions using two movements: a reciprocating fast-scan movement, and a slow-scan movement. The slow-scan movement is actuated using a servo motor and a belt drive system, the belt drive system being configured to reduce the failure rate of the workpiece scanning apparatus.
    Type: Application
    Filed: March 2, 2012
    Publication date: September 6, 2012
    Applicant: TEL EPION Inc.
    Inventors: Matthew C. GWINN, Avrum FREYTSIS, Jay R. WALLACE
  • Patent number: 8115140
    Abstract: A heater assembly configured to elevate a temperature of a processing element in a chemical treatment system is described. The heater assembly may be configured to uniformly heat a large area processing element, such as a processing element that spans a plurality of substrates. Additionally, for example, the heater assembly may be configured to elevate a temperature of an upper assembly, a gas injection assembly, a substrate holder, a chamber wall, or any combination of two or more thereof.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: February 14, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Charles R. Launsby, Jay R. Wallace
  • Publication number: 20100025389
    Abstract: A heater assembly configured to elevate a temperature of a processing element in a chemical treatment system is described. The heater assembly may be configured to uniformly heat a large area processing element, such as a processing element that spans a plurality of substrates. Additionally, for example, the heater assembly may be configured to elevate a temperature of an upper assembly, a gas injection assembly, a substrate holder, a chamber wall, or any combination of two or more thereof.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 4, 2010
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Charles R. Launsby, Jay R. Wallace
  • Publication number: 20100024982
    Abstract: A high throughput processing system having a chemical treatment system and a thermal treatment system for processing a plurality of substrates is described. The chemical treatment system is configured to chemically treat a plurality of substrates in a dry, non-plasma environment. The thermal treatment system is configured to thermally treat a plurality of substrates chemically treated in the chemical treatment system.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 4, 2010
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Jay R. Wallace, Thomas Hamelin
  • Publication number: 20100025367
    Abstract: A high throughput chemical treatment system for processing a plurality of substrates is described. The chemical treatment system is configured to chemically treat a plurality of substrates in a dry, non-plasma environment.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 4, 2010
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Jay R. Wallace, Hiroyuki Takahashi
  • Publication number: 20100024981
    Abstract: A high throughput chemical treatment system for processing a plurality of substrates is described. The chemical treatment system is configured to chemically treat a plurality of substrates in a dry, non-plasma environment. A substrate support in the chemical treatment system is configured to support a plurality of substrates.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 4, 2010
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Jay R. Wallace, Hiroyuki Takahashi
  • Patent number: 6695318
    Abstract: An arrangement for improved thermal and/or electrical coupling between parts disposed in electronic device processing equipment is provided. In an illustrated embodiment, an improved coupling between a chamber liner and a chamber wall is provided which can be utilized in semiconductor processing equipment. The arrangement includes a compressible coupling or gasket which is compressed between a wedge ring and the chamber wall. The chamber liner is coupled to the wedge ring, so that the chamber liner is coupled to the chamber wall by way of the wedge ring and compressible coupling.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: February 24, 2004
    Assignee: Tokyo Electron Limited
    Inventors: Stephen N. Golovato, Arthur H. Laflamme, Jr., Jay R. Wallace
  • Patent number: 6558506
    Abstract: The present invention provides an etching system having a plurality of etching chambers (16, 18, 20) disposed about a transfer chamber (14), wherein the etching chambers are adapted to be selectively mounted at different positions with respect to the transfer chamber.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: May 6, 2003
    Assignee: Tokyo Electron Limited
    Inventors: Richard J. Freeman, Jay R. Wallace, Yoichi Kurono, Arthur H. Laflamme, Jr., Louise Smith Barriss, Tadashi Onishi
  • Publication number: 20020093148
    Abstract: An arrangement for improved thermal and/or electrical coupling between parts disposed in electronic device processing equipment is provided. In an illustrated embodiment, an improved coupling between a chamber liner and a chamber wall is provided which can be utilized in semiconductor processing equipment. The arrangement includes a compressible coupling or gasket which is compressed between a wedge ring and the chamber wall. The chamber liner is coupled to the wedge ring, so that the chamber liner is coupled to the chamber wall by way of the wedge ring and compressible coupling.
    Type: Application
    Filed: January 17, 2001
    Publication date: July 18, 2002
    Applicant: Tokyo Electron Limited
    Inventors: Stephen N. Golovato, Arthur H. Laflamme, Jay R. Wallace