Patents by Inventor Jay R. Wallace

Jay R. Wallace has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE SUPPORT FOR HIGH THROUGHPUT CHEMICAL TREATMENT SYSTEM
    Publication number: 20100024981
    Abstract: A high throughput chemical treatment system for processing a plurality of substrates is described. The chemical treatment system is configured to chemically treat a plurality of substrates in a dry, non-plasma environment. A substrate support in the chemical treatment system is configured to support a plurality of substrates.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 4, 2010
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Jay R. Wallace, Hiroyuki Takahashi
  • Electronic device processing equipment having contact gasket between chamber parts
    Patent number: 6695318
    Abstract: An arrangement for improved thermal and/or electrical coupling between parts disposed in electronic device processing equipment is provided. In an illustrated embodiment, an improved coupling between a chamber liner and a chamber wall is provided which can be utilized in semiconductor processing equipment. The arrangement includes a compressible coupling or gasket which is compressed between a wedge ring and the chamber wall. The chamber liner is coupled to the wedge ring, so that the chamber liner is coupled to the chamber wall by way of the wedge ring and compressible coupling.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: February 24, 2004
    Assignee: Tokyo Electron Limited
    Inventors: Stephen N. Golovato, Arthur H. Laflamme, Jr., Jay R. Wallace
  • Etching system and etching chamber
    Patent number: 6558506
    Abstract: The present invention provides an etching system having a plurality of etching chambers (16, 18, 20) disposed about a transfer chamber (14), wherein the etching chambers are adapted to be selectively mounted at different positions with respect to the transfer chamber.
    Type: Grant
    Filed: October 24, 2001
    Date of Patent: May 6, 2003
    Assignee: Tokyo Electron Limited
    Inventors: Richard J. Freeman, Jay R. Wallace, Yoichi Kurono, Arthur H. Laflamme, Jr., Louise Smith Barriss, Tadashi Onishi
  • Electronic device processing equipment having contact gasket between chamber parts
    Publication number: 20020093148
    Abstract: An arrangement for improved thermal and/or electrical coupling between parts disposed in electronic device processing equipment is provided. In an illustrated embodiment, an improved coupling between a chamber liner and a chamber wall is provided which can be utilized in semiconductor processing equipment. The arrangement includes a compressible coupling or gasket which is compressed between a wedge ring and the chamber wall. The chamber liner is coupled to the wedge ring, so that the chamber liner is coupled to the chamber wall by way of the wedge ring and compressible coupling.
    Type: Application
    Filed: January 17, 2001
    Publication date: July 18, 2002
    Applicant: Tokyo Electron Limited
    Inventors: Stephen N. Golovato, Arthur H. Laflamme, Jay R. Wallace