Patents by Inventor JAY ROBERT

JAY ROBERT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Blister Cards Promoting Intuitive Dosing
    Publication number: 20150272826
    Abstract: A daily blister card housing a unit dose includes a back side and a front side opposite the back side. The front side includes a manufacturer indicator visible on the front side. A face has an outer periphery and a total planar area bounded by the outer periphery. One or more blisters extend outwardly at the face that contains at least three unit doses that are visible from outside the one or more blisters. Each of the one or more blisters includes a shoulder contacting a cavity backing surface and a projected cavity area bounded by the shoulder that is projected onto the cavity backing surface. A total projected cavity area of the one or more blisters is no more than about 45 percent of the total planar area bounded by the outer periphery.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 1, 2015
    Applicant: The Procter & Gamble Company
    Inventors: Rosa Manuela Leon Alonso, Kelly Lee Schmeichel, Isabella La Fosse-Marin, Angela Jane Deutsch, Thomas Alfred Inglin, Kurt Franklin Trombley, Diane Danheiser Powers, Eduardo de Abreu Mangione, Craig Andrew Hawkins, Jay Robert Morosey, JR.
  • THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR WITH HAPTIC RESPONSE AND ITS USE IN CAPACITIVE SWITCH CIRCUITS
    Publication number: 20150279508
    Abstract: This invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
    Type: Application
    Filed: March 17, 2015
    Publication date: October 1, 2015
    Inventors: JAY ROBERT DORFMAN, JOHN D. VOULTOS
  • Maize hybrid X95D076
    Patent number: 9144218
    Abstract: A novel maize variety designated X95D076 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X95D076 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X95D076 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X95D076, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X95D076. This invention further relates to methods for producing maize varieties derived from maize variety X95D076.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: September 29, 2015
    Assignee: PIONEER HI-BRED INTERNATIONAL, INC.
    Inventors: Jay Robert Hotchkiss, Julia Xiuling Zhang, Todd Elliot Piper, Edwin Michael Grote, Thomas Craig Kevern, Michael Joseph O'Leary, Suzanne Michelle Mickelson, Dean William Christensen, Michael Adam Chandler
  • THERMOFORMABLE POLYMER THICK FILM TRANSPARENT CONDUCTOR AND ITS USE IN CAPACITIVE SWITCH CIRCUITS
    Publication number: 20150267068
    Abstract: This invention is directed to a polymer thick film transparent conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Depending on the specific design, the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to a injection molding process.
    Type: Application
    Filed: March 20, 2014
    Publication date: September 24, 2015
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: JAY ROBERT DORFMAN
  • Sunscreen compositions
    Patent number: 9126059
    Abstract: The present invention provides a taste-masked sunscreen composition comprising at least one sunscreen and a spider ester wherein the sunscreen and the spider ester are in intimate association. A method of making the taste-masked sunscreen composition is provided.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: September 8, 2015
    Assignee: Wyeth LLC
    Inventors: Bhalchandra Somabhai Patel, Jay Roberts Dickerson, Gary Robert Agisim, Richard John Kenny
  • PHOTONIC SINTERING OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS
    Publication number: 20150213916
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods.
    Type: Application
    Filed: April 13, 2015
    Publication date: July 30, 2015
    Inventors: VINCENZO ARANCIO, JAY ROBERT DORFMAN
  • OUTDOOR PACK WITH COMPANION FRAME
    Publication number: 20150196110
    Abstract: A backpack system is described herein comprising a frame and a pack (e.g., backpack or outdoor pack) that may be used by individuals engaging in different type of events such as hunting, fishing, hiking, sports and the like. The pack may be configured to be readily engaged with the frame. The pack may comprise one or more pocket sections that may be quickly detached for easy access to its contents by a user while still wearing the main part of the pack which may remain engaged with the frame.
    Type: Application
    Filed: December 31, 2014
    Publication date: July 16, 2015
    Inventors: Jay ROBERT, Timothy S. MAKOS
  • Maize inbred PH1MDJ
    Patent number: 9043973
    Abstract: A novel maize variety designated PH1MDJ and seed, plants and plant parts thereof. Methods for producing a maize plant that comprise crossing maize variety PH1MDJ with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into PH1MDJ through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. Hybrid maize seed, plant or plant part produced by crossing the variety PH1MDJ or a locus conversion of PH1MDJ with another maize variety.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: June 2, 2015
    Assignee: PIONEER HI BRED INTERNATIONAL INC
    Inventor: Jay Robert Hotchkiss
  • STRETCHABLE POLYMER THICK FILM SILVER CONDUCTOR FOR HIGHLY PERMEABLE SUBSTRATES
    Publication number: 20150137048
    Abstract: This invention is directed to a polymer thick film conductor composition. The polymer thick film (PTF) conductor composition may be used in applications where significant stretching is required, particularly on highly permeable substrates. A particular type of substrate which is suitable is a woven polyester coated with polyamide. An electrical circuit containing a conductor formed from the composition and a process to make such a circuit are provided.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 21, 2015
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: MARK STEVEN CRITZER, Jay Robert Dorfman
  • Photonic sintering of polymer thick film conductor compositions
    Patent number: 9034417
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: May 19, 2015
    Assignee: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Vince Arancio, Jay Robert Dorfman
  • Maize inbred PH18PF
    Patent number: 9035157
    Abstract: A novel maize variety designated PH18PF and seed, plants and plant parts thereof. Methods for producing a maize plant that comprise crossing maize variety PH18PF with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into PH18PF through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. Hybrid maize seed, plant or plant part produced by crossing the variety PH18PF or a locus conversion of PH18PF with another maize variety.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: May 19, 2015
    Assignee: Pioneer Hi Bred International Inc
    Inventor: Jay Robert Hotchkiss
  • Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications
    Patent number: 9024179
    Abstract: The invention is directed to a polymer thick film conductive composition comprising (a) a conductive silver-coated copper powder; and (b) an organic medium comprising two different resins and organic solvent, wherein the ratio of the weight of the conductive silver-coated copper powder to the total weight of the two different resins is between 5:1 and 45:1. The invention is further directed to a method of electrode grid and/or bus bar formation on thin-film photovoltaic cells using the composition and to cells formed from the method and the composition.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: May 5, 2015
    Assignee: E I du Pont de Nemours and Company
    Inventor: Jay Robert Dorfman
  • UV-curable thermoformable dielectric for thermoformable circuits
    Patent number: 9012555
    Abstract: This invention is directed to a polymer thick film UV-curable thermoformable dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate below it in capacitive switch applications. The thermoformed capacitive switch circuit may be subsequently subjected to an injection molding process.
    Type: Grant
    Filed: October 9, 2013
    Date of Patent: April 21, 2015
    Assignee: E I du Pont de Nemours and Company
    Inventor: Jay Robert Dorfman
  • Maize hybrid X00C220
    Patent number: 9012740
    Abstract: A novel maize variety designated X00C220 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X00C220 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X00C220 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X00C220, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X00C220. This invention further relates to methods for producing maize varieties derived from maize variety X00C220.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: April 21, 2015
    Assignee: Pioneer Hi Bred International Inc
    Inventors: Jay Robert Hotchkiss, Matthew David Smalley
  • Child-Resistant Blister Package
    Publication number: 20150096920
    Abstract: A child-resistant blister package. The package has a top face, a bottom face, and a periphery. The package also has a protection layer with a top face, a bottom face and a periphery; a blister layer with one or more cavities; and an access layer with a top face, a bottom face, and a periphery. The bottom face of the access layer has a line of weakness that allows the unit dose to be removed from the cavity in one-step by applying a force to the top of the cavity and pressing the unit dose through the line of weakness. The bottom face of the protection layer and the top face of the access layer are permanently joined along substantially the entire periphery of the package. The blister package can also contain a tear resistant layer.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 9, 2015
    Applicant: The Procter & Gamble Company
    Inventors: Kurt Franklin Trombley, Karen Lai-Ting Chan, Isabelle Lafosse-Marin, Jay Robert Morosey, JR., Karla Mishell Sanchez, Kelly Lee Schmeichel
  • Lamination of polymer thick film conductor compositions
    Patent number: 8986579
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: March 24, 2015
    Assignee: E I du Pont de Nemours and Company
    Inventors: Larry Alan Bidwell, Michael J. Champ, John C. Crumpton, Jay Robert Dorfman
  • Bird vest
    Patent number: D737025
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: August 25, 2015
    Assignee: Plano Molding Company
    Inventor: Jay Robert
  • Backpack
    Patent number: D737046
    Type: Grant
    Filed: January 2, 2014
    Date of Patent: August 25, 2015
    Assignee: PLANO MOLDING COMPANY
    Inventor: Jay Robert
  • Backpack
    Patent number: D737047
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: August 25, 2015
    Assignee: PLANO MOLDING COMPANY
    Inventor: Jay Robert
  • Turkey pack
    Patent number: D737568
    Type: Grant
    Filed: January 3, 2014
    Date of Patent: September 1, 2015
    Assignee: Plano Molding Company
    Inventor: Jay Robert