Patents by Inventor JAY ROBERT

JAY ROBERT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MOISTURE BARRIER LAYER DIELECTRIC FOR THERMOFORMABLE CIRCUITS
    Publication number: 20140190815
    Abstract: This invention is directed to a polymer thick film moisture barrier layer dielectric composition comprising thermoplastic urethane resin, thermoplastic phenoxy resin, diacetone alcohol and fumed silica. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver above it and the polycarbonate substrate below it in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.
    Type: Application
    Filed: October 9, 2013
    Publication date: July 10, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: JAY ROBERT DORFMAN
  • MOISTURE BARRIER LAYER DIELECTRIC FOR THERMOFORMABLE CIRCUITS
    Publication number: 20140190813
    Abstract: This invention is directed to a polymer thick film moisture barrier layer dielectric composition comprising thermoplastic urethane resin, thermoplastic phenoxy resin, diacetone alcohol and fumed silica. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver above it and the polycarbonate substrate below it in capacitive switch applications.
    Type: Application
    Filed: January 8, 2013
    Publication date: July 10, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventor: JAY ROBERT DORFMAN
  • LAMINATION OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS
    Publication number: 20140170411
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
    Type: Application
    Filed: February 24, 2014
    Publication date: June 19, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: LARRY ALAN BIDWELL, Michael J. Champ, John C. Crumpton, Jay Robert Dorfman
  • Blister cards promoting intuitive dosing
    Patent number: 8752704
    Abstract: A daily blister card housing a unit dose includes a back side and a front side opposite the back side. The front side includes a manufacturer indicator visible on the front side. A face has an outer periphery and a total planar area bounded by the outer periphery. One or more blisters extend outwardly at the face that contain at least three unit doses that are visible from outside the one or more blisters. Each of the one or more blisters includes a shoulder contacting a cavity backing surface and a projected cavity area bounded by the shoulder that is projected onto the cavity backing surface. A total projected cavity area of the one or more blisters is no more than about 45 percent of the total planar area bounded by the outer periphery.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: June 17, 2014
    Assignee: The Procter & Gamble Company
    Inventors: Rosa Manuela Leon Alonso, Kelly Lee Schmeichel, Isabelle LaFosse-Marin, Angela Jane Deutsch, Thomas Alfred Inglin, Kurt Franklin Trombley, Diane Danheiser Powers, Eduardo de Abreu Mangione, Craig Andrew Hawkins, Jay Robert Morosey, Jr.
  • THERMOFORMABLE POLYMER THICK FILM SILVER CONDUCTOR AND ITS USE IN CAPACITIVE SWITCH CIRCUITS
    Publication number: 20140154501
    Abstract: This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
    Type: Application
    Filed: February 7, 2014
    Publication date: June 5, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: JAY ROBERT DORFMAN, Vincenzo Arancio
  • Maize hybrid X90C500
    Patent number: 8722965
    Abstract: A novel maize variety designated X90C500 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X90C500 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X90C500 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X90C500, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X90C500. This invention further relates to methods for producing maize varieties derived from maize variety X90C500.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: May 13, 2014
    Assignee: Pioneer Hi Bred International Inc
    Inventors: Edwin Michael Grote, Lori Lisa Carrigan, Martin Arbelbide, Stephen Joseph Szalma, Jay Robert Hotchkiss
  • Maize variety hybrid X95A923
    Patent number: 8722999
    Abstract: A novel maize variety designated X95A923 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X95A923 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X95A923 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X95A923, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X95A923. This invention further relates to methods for producing maize varieties derived from maize variety X95A923.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: May 13, 2014
    Assignee: Pioneer Hi-Bred International, Inc.
    Inventors: Todd Elliott Piper, Jay Robert Hotchkiss, Joachim Ernst Kramer, Lori Lisa Carrigan
  • Maize hybrid X95C381
    Patent number: 8716552
    Abstract: A novel maize variety designated X95C381 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X95C381 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X95C381 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X95C381, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X95C381. This invention further relates to methods for producing maize varieties derived from maize variety X95C381.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: May 6, 2014
    Assignee: Pioneer Hi Bred International Inc
    Inventors: Martin Arbelbide, Lori Lisa Carrigan, Gustavo Marcelo Garcia, Julie Ho, Jay Robert Hotchkiss, Stephen Joseph Szalma
  • Maize variety X00C175
    Patent number: 8710325
    Abstract: A novel maize variety designated X00C175 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X00C175 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X00C175 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X00C175, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X00C175. This invention further relates to methods for producing maize varieties derived from maize variety X00C175.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: April 29, 2014
    Assignee: Pioneer Hi Bred International Inc
    Inventors: Kelvin Grandy Grant, Todd Elliott Piper, Jay Robert Hotchkiss
  • Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications
    Patent number: 8704087
    Abstract: The invention is directed to a polymer thick film conductive composition comprising (a) a conductive silver-coated copper powder; and (b) an organic medium comprising two different resins and organic solvent, wherein the ratio of the weight of the conductive silver-coated copper powder to the total weight of the two different resins is between 5:1 and 45:1. The invention is further directed to a method of electrode grid and/or bus bar formation on thin-film photovoltaic cells using the composition and to cells formed from the method and the composition.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: April 22, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventor: Jay Robert Dorfman
  • Maize variety hybrid X8N355
    Patent number: 8704052
    Abstract: A novel maize variety designated X8N355 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X8N355 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X8N355 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X8N355, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X8N355. This invention further relates to methods for producing maize varieties derived from maize variety X8N355.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: April 22, 2014
    Assignee: Pioneer Hi-Bred International, Inc.
    Inventors: Todd Elliott Piper, Jay Robert Hotchkiss, Martin Arbelbide, Joseph Kevin Gogerty
  • Maize hybrid X00C165
    Patent number: 8704058
    Abstract: A novel maize variety designated X00C165 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X00C165 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X00C165 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X00C165, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X00C165. This invention further relates to methods for producing maize varieties derived from maize variety X00C165.
    Type: Grant
    Filed: February 21, 2012
    Date of Patent: April 22, 2014
    Assignee: Pioneer Hi Bred International Inc
    Inventors: Mario Rosario Carlone, Jr., Michael Philip Jines, Todd Elliott Piper, Jay Robert Hotchkiss, Martin Arbelbide, Stephen Joseph Szalma
  • Lamination of polymer thick film conductor compositions
    Patent number: 8696860
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: April 15, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Larry Alan Bidwell, Michael James Champ, John C. Crumpton, Jay Robert Dorfman
  • LAMINATION OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS
    Publication number: 20140099499
    Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.
    Type: Application
    Filed: October 10, 2012
    Publication date: April 10, 2014
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: LARRY Alan BIDWELL, Michael J. Champ, John C. Crumpton, Jay Robert Dorfman
  • Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits
    Patent number: 8692131
    Abstract: This invention is directed to a polymer thick film conductive composition that may be used in applications where thermoforming of the base substrate occurs, e.g., as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition. The electrical circuit is subsequently subjected to an injection molding process.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: April 8, 2014
    Assignee: E I du Pont de Nemours and Company
    Inventors: Jay Robert Dorfman, Vincenzo Arancio
  • Maize hybrid X03C220
    Patent number: 8692089
    Abstract: A novel maize variety designated X03C220 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X03C220 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X03C220 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X03C220, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X03C220. This invention further relates to methods for producing maize varieties derived from maize variety X03C220.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: April 8, 2014
    Assignee: Pioneer Hi Bred International Inc
    Inventors: Edwin Michael Grote, Todd Elliott Piper, Jay Robert Hotchkiss, Jennifer Ann Tarter, Wade Eugene Odland, Joseph Kevin Gogerty
  • Maize hybrid X95C442
    Patent number: 8674173
    Abstract: A novel maize variety designated X95C442 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X95C442 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X95C442 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X95C442, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X95C442. This invention further relates to methods for producing maize varieties derived from maize variety X95C442.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: March 18, 2014
    Assignee: Pioneer Hi Bred International Inc
    Inventors: Edwin Michael Grote, Todd Elliott Piper, Jay Robert Hotchkiss, Julie Ho, Thomas Craig Kevern, Michael Adam Chandler, Julia Xiuling Zhang, David B. Fischer, Dean William Christensen, Michael Joseph O'Leary
  • Maize hybrid X00C219
    Patent number: 8674174
    Abstract: A novel maize variety designated X00C219 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X00C219 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X00C219 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X00C219, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X00C219. This invention further relates to methods for producing maize varieties derived from maize variety X00C219.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: March 18, 2014
    Assignee: Pioneer Hi Bred International Inc
    Inventors: Edwin Michael Grote, Todd Elliott Piper, Jay Robert Hotchkiss, Blaine Earl Johnson, Thomas Craig Kevern, Michael Adam Chandler, Julia Xiuling Zhang, David B. Fischer, Dean William Christensen, Julie Ho, Michael Joseph O'Leary
  • Maize Variety Hybrid X95A926
    Publication number: 20140059713
    Abstract: A novel maize variety designated X95A926 and seed, plants and plant parts thereof, produced by crossing Pioneer Hi-Bred International, Inc. proprietary inbred maize varieties. Methods for producing a maize plant that comprises crossing hybrid maize variety X95A926 with another maize plant. Methods for producing a maize plant containing in its genetic material one or more traits introgressed into X95A926 through backcross conversion and/or transformation, and to the maize seed, plant and plant part produced thereby. This invention relates to the maize variety X95A926, the seed, the plant produced from the seed, and variants, mutants, and minor modifications of maize variety X95A926. This invention further relates to methods for producing maize varieties derived from maize variety X95A926.
    Type: Application
    Filed: February 8, 2013
    Publication date: February 27, 2014
    Applicant: PIONEER HI BRED INTERNATIONAL INC
    Inventors: Todd Elliott Piper, JAY ROBERT HOTCHKISS, LORI LISA CARRIGAN
  • Backpack
    Patent number: D699940
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: February 25, 2014
    Assignee: Plano Molding Company
    Inventor: Jay Robert