Patents by Inventor Jay S Nigen
Jay S Nigen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160357232Abstract: Systems and methods are disclosed for determining a current machine state of a processing device, predicting a future processing task to be performed by the processing device at a future time, and predicting a list of intervening processing tasks to be performed by a first time (e.g. a current time) and the start of the future processing task. The future processing task has an associated initial state. A feed-forward thermal prediction model determines a predicted future machine state at the time for starting the future processing task. Heat mitigation processes can be applied in advance of the starting of the future processing task, to meet the future initial machine state for starting the future processing task.Type: ApplicationFiled: September 30, 2015Publication date: December 8, 2016Inventors: Nagarajan Kalyanasundaram, Jay S. Nigen, James S. Ismail, Richard H. Tan
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Publication number: 20160357231Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.Type: ApplicationFiled: August 19, 2016Publication date: December 8, 2016Inventors: Brett W. DEGNER, William F. LEGGETT, Jay S. NIGEN, Frank F. LIANG, Richard H. TAN
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Publication number: 20160307819Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.Type: ApplicationFiled: June 23, 2016Publication date: October 20, 2016Inventors: Jay S. NIGEN, Ron A. HOPKINSON, Derek J. YAP, Eric A. KNOPF, William F. LEGGETT, Richard H. TAN
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Patent number: 9423841Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.Type: GrantFiled: February 1, 2016Date of Patent: August 23, 2016Assignee: Apple Inc.Inventors: Brett W. Degner, William F. Leggett, Jay S. Nigen, Frank F. Liang, Richard H. Tan
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Patent number: 9408328Abstract: The disclosed embodiments relate to a system that facilitates thermal conductance in a system that includes a module comprising a circuit board with integrated circuits, such as a solid-state drive. A thermal-coupling material between one side of the circuit board and an adjacent baseplate is used to increase thermal conduction between the circuit board and the baseplate. Furthermore, the module may include another thermal-coupling material between the baseplate and a housing that at least in part surrounds the circuit board, thereby increasing thermal conduction between the baseplate and the housing. In these ways, the baseplate and/or the housing may be used as a heat-transfer surfaces or heat spreaders that reduce hotspots associated with operation of the integrated circuits.Type: GrantFiled: November 21, 2012Date of Patent: August 2, 2016Assignee: Apple Inc.Inventors: Jay S. Nigen, Ron A. Hopkinson, Derek J. Yap, Eric A. Knopf, William F. Leggett, Richard H. Tan
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Publication number: 20160147269Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.Type: ApplicationFiled: February 1, 2016Publication date: May 26, 2016Inventors: Brett W. DEGNER, William F. LEGGETT, Jay S. NIGEN, Frank F. LIANG, Richard H. TAN
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Patent number: 9285846Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.Type: GrantFiled: June 5, 2014Date of Patent: March 15, 2016Assignee: Apple Inc.Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
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Patent number: 9280177Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The laptop computer can include a uni-body top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing.Type: GrantFiled: November 21, 2013Date of Patent: March 8, 2016Assignee: Apple Inc.Inventors: Brett W. Degner, Christiaan A. Ligtenberg, Ron A. Hopkinson, Bartley K. Andre, Jeremy Bataillou, Jay S. Nigen, Matthew S. Theobald, Matthew P. Casebolt, Charles A. Schwalbach, Brandon S. Smith, William F. Leggett
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Patent number: 9282656Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.Type: GrantFiled: December 18, 2012Date of Patent: March 8, 2016Assignee: Apple Inc.Inventors: Brett W. Degner, William F. Leggett, Jay S. Nigen, Frank F. Liang, Richard H. Tan
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Publication number: 20150253822Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.Type: ApplicationFiled: May 26, 2015Publication date: September 10, 2015Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
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Patent number: 9069535Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.Type: GrantFiled: June 5, 2014Date of Patent: June 30, 2015Assignee: Apple Inc.Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
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Publication number: 20150163960Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.Type: ApplicationFiled: February 18, 2015Publication date: June 11, 2015Applicant: Apple Inc.Inventors: Brett W. Degner, Bartley K. Andre, Jeremy D. Batailou, Jay S. Nigen, Christiaan A. Ligtenberg, Ron A. Hopkinson, Charles A. Schwalbach, Matthew P. Casebolt, Nicholas A. Rundle, Frank F. Liang
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Publication number: 20150152883Abstract: The described embodiments relate to improving efficiency of a low-profile cooling fan. In one embodiment, an impeller of the cooling fan includes a shroud which covers a central portion of the impeller, thereby allowing a central inlet portion of the blades to have an increased fan blade height when compared to a cooling fan constrained by minimum part tolerances between the fan blades and a portion of the fan housing. In some embodiments, the impeller includes splitter blades that can improve performance of the low-profile cooling fan.Type: ApplicationFiled: December 3, 2014Publication date: June 4, 2015Inventors: Jesse T. Dybenko, Anthony Joseph Aiello, Nicholas D. Mancini, Jay S. Nigen, Arash Naghib Lahouti
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Patent number: 8964383Abstract: The disclosed embodiments related to a component for use in a portable electronic device. The component includes a wall of the portable electronic device, containing an intake zone that includes a set of intake vents directed at a first angle toward one or more heat-generating components of the portable electronic device. The wall also includes an exhaust zone containing a set of exhaust vents directed at a second angle out of the portable electronic device.Type: GrantFiled: September 26, 2012Date of Patent: February 24, 2015Assignee: Apple Inc.Inventors: Brett W. Degner, Bartley K. Andre, Jeremy D. Bataillou, Jay S. Nigen, Christiaan A. Ligtenberg, Ron A. Hopkinson, Charles A. Schwalbach, Matthew P. Casebolt, Nicholas A. Rundle, Frank F. Liang
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Publication number: 20140362522Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.Type: ApplicationFiled: June 5, 2014Publication date: December 11, 2014Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
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Publication number: 20140362523Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.Type: ApplicationFiled: June 5, 2014Publication date: December 11, 2014Inventors: Brett W. Degner, Eric R. Prather, David H. Narajowski, Frank F. Liang, Jay S. Nigen, Jesse T. Dybenko, Connor R. Duke, Eugene A. Whang, Christopher J. Stringer, Joshua D. Banko, Caitlin Elizabeth Kalinowski, Jonathan L. Berk, Matthew P. Casebolt, Kevin S. Fetterman, Eric J. Weirshauser
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Patent number: 8888450Abstract: The described embodiments relate generally to optimizing airflow in a computer system. By modifying the external surface of centrifugal cooling fan enclosures the pressure drop associated with airflow moving around the enclosures can be reduced. This is generally accomplished by rounding off hard edges from the outside of the cooling fan enclosure as well as forming cover surfaces rather than simply using flat cover surfaces. In some cases this can also involve modifying the shape of the fan inlet, or even contouring the shape of the cooling fan blades to allow air to flow more easily through the computer enclosure.Type: GrantFiled: September 23, 2011Date of Patent: November 18, 2014Inventors: Brett W. Degner, Jay S. Nigen, Jesse T. Dybenko
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Patent number: 8768530Abstract: A predefined mathematical relationship that is stored in the memory of a computing system is accessed, wherein the relationship refers to temperatures of a number of points in the system, wherein the points together define a zone. The mathematical relationship yields a representative temperature for the zone. Temperature data from sensors in the system is obtained and applied to thermal models, to estimate the temperatures of at least some of the points that define the zone. The representative temperature for the zone is computed using the estimated temperatures as input to the mathematical relationship. A decision is then made on whether or not to change a power consuming activity limit in the system, based on the computed representative temperature. Other embodiments are also described and claimed.Type: GrantFiled: August 23, 2010Date of Patent: July 1, 2014Assignee: Apple Inc.Inventors: Frank Faqiu Liang, Jay S. Nigen, Amaury J. Heresztyn, Keith Cox
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Publication number: 20140077670Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The laptop computer can include a uni-body top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing.Type: ApplicationFiled: November 21, 2013Publication date: March 20, 2014Applicant: Apple Inc.Inventors: Brett W. DEGNER, Christiaan A. LIGTENBERG, Ron A. HOPKINSON, Bartley K. ANDRE, Jeremy BATAILLOU, Jay S. NIGEN, Matthew S. THEOBALD, Matthew P. CASEBOLT, Charles A. SCHWALBACH, Brandon S. SMITH, William F. LEGGETT
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Patent number: 8616748Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The laptop computer can include a uni-body top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing.Type: GrantFiled: June 8, 2012Date of Patent: December 31, 2013Assignee: Apple Inc.Inventors: Brett W. Degner, Christiaan A. Ligtenberg, Ron A. Hopkinson, Bartley K. Andre, Jeremy Bataillou, Jay S Nigen, Matthew S. Theobald, Matthew P. Casebolt, Charles A. Schwalbach, Brandon S. Smith, William F. Leggett