Abstract: A thin-film transistor (TFT) substrate having reduced defects is fabricated using a reduced number of masks. The TFT substrate includes gate wiring formed on a substrate. The gate wiring includes a gate electrode. A semiconductor pattern is formed on the gate wiring. An etch-stop pattern is formed on the semiconductor pattern. Data wiring includes a source electrode which is formed on the semiconductor pattern and the etch-stop pattern. Each of the gate wiring and the data wiring includes a copper-containing layer and a buffer layer formed on or under the copper-containing layer.

Abstract: A thin film transistor array panel includes a gate line, a gate insulating layer that covers the gate line, a semiconductor layer that is disposed on the gate insulating layer, a data line and drain electrode that are disposed on the semiconductor layer, a passivation layer that covers the data line and drain electrode and has a contact hole that exposes a portion of the drain electrode, and a pixel electrode that is electrically connected to the drain electrode through the contact hole. The data line and drain electrode each have a double layer that includes a lower layer of titanium and an upper layer of copper, and the lower layer is wider than the upper layer, and the lower layer has a region that is exposed. The gate insulating layer may have a step shape.

Abstract: A thin film transistor array panel according to an exemplary embodiment of the present invention comprises a substrate, a gate line formed on the substrate, a gate insulating layer formed on the gate line, a semiconductor layer formed on the gate insulating layer, and a data line formed on the semiconductor layer, wherein the data line comprises a lower data layer, an upper data layer, a data oxide layer, and a buffer layer, wherein the upper data layer and the buffer layer comprise a same material.

Abstract: A display substrate includes; a base substrate, a deformation preventing layer disposed on a lower surface of the base substrate, wherein the deformation preventing layer applies a force to the base substrate to prevent the base substrate from bending, a gate line disposed on an upper surface of the base substrate, a data line disposed on the base substrate, and a pixel electrode disposed on the base substrate.

Abstract: Embodiments of the present invention relate to a liquid crystal display and a driving method thereof. According to an embodiment, the liquid crystal display comprises a pixel electrode having a first subpixel electrode, a second subpixel electrode, and a third subpixel electrode electrically separated from each other. The liquid crystal display comprises a first thin film transistor connected to the first subpixel electrode, a second thin film transistor connected to the second subpixel electrode, a third thin film transistor connected to the third subpixel electrode, and a fourth thin film transistor connected to the second subpixel electrode and the third subpixel electrode. The liquid crystal display comprises a first gate line connected to the first to third thin film transistors, a second gate line connected to the fourth thin film transistor, a data line connected to the first and second thin film transistors, and a storage electrode line connected to the third thin film transistor.

Abstract: Provided are a method for preparing metallic nickel powders capable of decreasing the content of an alkaline metal in the metallic nickel powders, metallic nickel powders with the low content of an alkaline metal, a conductive paste including metallic nickel powders with the low content of an alkaline metal, and a multi-layer ceramic capacitor (MLCC) including a nickel inner electrode with the low content of an alkaline metal. The method for preparing the metallic nickel powders includes heating a mixture including an organic base, a nickel precursor compound, and a polyol. Wherein, the nickel precursor compound is converted to the metallic nickel powders through reduction by the organic base and the polyol. In the method, the organic base is used instead of the hydroxide of an alkaline metal such as NaOH and KOH. Therefore, the content of an alkaline metal such as sodium and potassium that can be incorporated as an impurity into the metallic nickel powders can be significantly reduced.

Abstract: Provided are a method for preparing metallic nickel powders capable of decreasing the content of an alkaline metal in the metallic nickel powders, metallic nickel powders with the low content of an alkaline metal, a conductive paste including metallic nickel powders with the low content of an alkaline metal, and a multi-layer ceramic capacitor (MLCC) including a nickel inner electrode with the low content of an alkaline metal. The method for preparing the metallic nickel powders includes heating a mixture including an organic base, a nickel precursor compound, and a polyol. Wherein, the nickel precursor compound is converted to the metallic nickel powders through reduction by the organic base and the polyol. In the method, the organic base is used instead of the hydroxide of an alkaline metal such as NaOH and KOH. Therefore, the content of an alkaline metal such as sodium and potassium that can be incorporated as an impurity into the metallic nickel powders can be significantly reduced.

Abstract: Provided are a method for preparing metallic nickel powders capable of decreasing the content of an alkaline metal in the metallic nickel powders, metallic nickel powders with the low content of an alkaline metal, a conductive paste including metallic nickel powders with the low content of an alkaline metal, and a multi-layer ceramic capacitor (MLCC) including a nickel inner electrode with the low content of an alkaline metal. The method for preparing the metallic nickel powders includes heating a mixture including an organic base, a nickel precursor compound, and a polyol. Wherein, the nickel precursor compound is converted to the metallic nickel powders through reduction by the organic base and the polyol. In the method, the organic base is used instead of the hydroxide of an alkaline metal such as NaOH and KOH. Therefore, the content of an alkaline metal such as sodium and potassium that can be incorporated as an impurity into the metallic nickel powders can be significantly reduced.