Patents by Inventor Jeahyeong HAN
Jeahyeong HAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11756894Abstract: Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding. A RFIC package includes an IC die layer that includes a RFIC die(s) mounted on a substrate that includes substrate metallization layers, a substrate core, and substrate antenna layers. The RFIC package includes an EMI shield surrounding the IC die layer and extending down shared sidewalls of the IC die layer and the substrate. The EMI shield extends down the sidewalls of the IC die layer and substrate metallization layers of the substrate to at least the interface between the substrate metallization layers and the substrate core, and without extending adjacent to the sidewall of the substrate antenna layers. In this manner, antenna performance of the antenna module may not be degraded, because extending the EMI shield down sidewalls of the substrate antenna layers can create a resonance cavity in the substrate.Type: GrantFiled: May 20, 2020Date of Patent: September 12, 2023Assignee: QUALCOMM INCORPORATEDInventors: Jeahyeong Han, Rajneesh Kumar, Jeongil Jay Kim, Chin-Kwan Kim
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Patent number: 11696390Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.Type: GrantFiled: November 20, 2020Date of Patent: July 4, 2023Assignee: QUALCOMM INCORPORATEDInventors: Jeahyeong Han, Suhyung Hwang, Mina Iskander, Rajneesh Kumar, Darryl Sheldon Jessie
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Patent number: 11670599Abstract: Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.Type: GrantFiled: July 9, 2020Date of Patent: June 6, 2023Assignee: QUALCOMM INCORPORATEDInventors: Jeahyeong Han, David Fraser Rae, Rajneesh Kumar
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Patent number: 11658391Abstract: Aspects disclosed herein include a device including a first antenna substrate including one or more antennas. The device also includes a metallization structure. The device also includes a first spacer disposed between the first antenna substrate and the metallization structure, configured to maintain a constant distance between the first antenna substrate and the metallization structure. The device also includes a first plurality of conductive elements, disposed within the first spacer, configured to electrically couple the first antenna substrate to the metallization structure. The device also includes where the first spacer is configured to enclose all the conductive elements, electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure. The device also includes where the first plurality of conductive elements is separated by air in the air gap.Type: GrantFiled: December 21, 2020Date of Patent: May 23, 2023Assignee: QUALCOMM INCORPORATEDInventors: Hong Bok We, Aniket Patil, Jeahyeong Han, Mohammad Ali Tassoudji
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Publication number: 20230155273Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.Type: ApplicationFiled: November 4, 2022Publication date: May 18, 2023Inventors: Jeahyeong HAN, Rajneesh KUMAR, Suhyung HWANG, Jaehyun YEON, Mohammad Ali TASSOUDJI, Darryl Sheldon JESSIE, Ameya GALINDE
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Patent number: 11495873Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.Type: GrantFiled: March 5, 2020Date of Patent: November 8, 2022Assignee: Qualcomm IncorporatedInventors: Jeahyeong Han, Rajneesh Kumar, Suhyung Hwang, Jaehyun Yeon, Mohammad Ali Tassoudji, Darryl Sheldon Jessie, Ameya Galinde
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Patent number: 11399435Abstract: A device that includes a flexible printed circuit board (PCB), a package coupled to the flexible PCB, a first antenna device coupled to the flexible PCB, and a second antenna device coupled to the flexible PCB. The first antenna device is configured to transmit and receive a first signal having a first frequency. The second antenna device is configured to transmit and receive a second signal having a second frequency. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to the second surface of the flexible PCB. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to a first surface of the flexible PCB.Type: GrantFiled: November 10, 2020Date of Patent: July 26, 2022Assignee: QUALCOMM IncorporatedInventors: Jaehyun Yeon, Suhyung Hwang, Rajneesh Kumar, Jeahyeong Han
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Publication number: 20220200166Abstract: Aspects disclosed herein include a device including a first antenna substrate including one or more antennas. The device also includes a metallization structure. The device also includes a first spacer disposed between the first antenna substrate and the metallization structure, configured to maintain a constant distance between the first antenna substrate and the metallization structure. The device also includes a first plurality of conductive elements, disposed within the first spacer, configured to electrically couple the first antenna substrate to the metallization structure. The device also includes where the first spacer is configured to enclose all the conductive elements, electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure. The device also includes where the first plurality of conductive elements is separated by air in the air gap.Type: ApplicationFiled: December 21, 2020Publication date: June 23, 2022Inventors: Hong Bok WE, Aniket PATIL, Jeahyeong HAN, Mohammad Ali TASSOUDJI
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Publication number: 20220013472Abstract: Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.Type: ApplicationFiled: July 9, 2020Publication date: January 13, 2022Inventors: Jeahyeong HAN, David Fraser RAE, Rajneesh KUMAR
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Publication number: 20210410274Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.Type: ApplicationFiled: November 20, 2020Publication date: December 30, 2021Inventors: Jeahyeong Han, Suhyung Hwang, Mina Iskander, Rajneesh Kumar, Darryl Sheldon Jessie
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Publication number: 20210366838Abstract: Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding. A RFIC package includes an IC die layer that includes a RFIC die(s) mounted on a substrate that includes substrate metallization layers, a substrate core, and substrate antenna layers. The RFIC package includes an EMI shield surrounding the IC die layer and extending down shared sidewalls of the IC die layer and the substrate. The EMI shield extends down the sidewalls of the IC die layer and substrate metallization layers of the substrate to at least the interface between the substrate metallization layers and the substrate core, and without extending adjacent to the sidewall of the substrate antenna layers. In this manner, antenna performance of the antenna module may not be degraded, because extending the EMI shield down sidewalls of the substrate antenna layers can create a resonance cavity in the substrate.Type: ApplicationFiled: May 20, 2020Publication date: November 25, 2021Inventors: Jeahyeong Han, Rajneesh Kumar, Jeongil Jay Kim, Chin-Kwan Kim
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Publication number: 20210345492Abstract: A device that includes a flexible printed circuit board (PCB), a package coupled to the flexible PCB, a first antenna device coupled to the flexible PCB, and a second antenna device coupled to the flexible PCB. The first antenna device is configured to transmit and receive a first signal having a first frequency. The second antenna device is configured to transmit and receive a second signal having a second frequency. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to the second surface of the flexible PCB. The first antenna device may be coupled to a second surface of the flexible PCB, and the second antenna device is coupled to a first surface of the flexible PCB.Type: ApplicationFiled: November 10, 2020Publication date: November 4, 2021Inventors: Jaehyun YEON, Suhyung HWANG, Rajneesh KUMAR, Jeahyeong HAN
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Patent number: 11139224Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.Type: GrantFiled: December 5, 2019Date of Patent: October 5, 2021Assignee: QUALCOMM IncorporatedInventors: Chaoqi Zhang, Rajneesh Kumar, Li-Sheng Weng, Darryl Sheldon Jessie, Suhyung Hwang, Jeahyeong Han, Xiaoming Chen, Jaehyun Yeon
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Publication number: 20210280959Abstract: A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.Type: ApplicationFiled: March 5, 2020Publication date: September 9, 2021Inventors: Jeahyeong HAN, Rajneesh KUMAR, Suhyung HWANG, Jaehyun YEON, Mohammad Ali TASSOUDJI, Darryl Sheldon JESSIE, Ameya GALINDE
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Publication number: 20210175152Abstract: A package that includes a substrate having a routing region and a non-routing region along a periphery of the substrate. The non-routing region includes a plurality of vias configured as a shield. The package includes an integrated device coupled to the substrate, and an encapsulation layer located over the substrate such that the encapsulation layer encapsulates the integrated device.Type: ApplicationFiled: December 5, 2019Publication date: June 10, 2021Inventors: Chaoqi ZHANG, Rajneesh KUMAR, Li-Sheng WENG, Darryl Sheldon JESSIE, Suhyung HWANG, Jeahyeong HAN, Xiaoming CHEN, Jaehyun YEON