Abstract: The invention relates to a method for manufacturing a portable electronic-chip-comprising object including a body and a metal-air battery that is integrated into the body, the battery comprising an electrolyte layer and a protective air-porous membrane covering the electrolyte. The method includes a step of forming at least one air-supply duct extending from the protective membrane to an air source. An air-porous material is contained in the duct and completely blocks the duct at least in one place on its course. The invention also relates to the object corresponding to this method.

Abstract: The invention relates to an electronic module comprising a dielectric support film having a first side, conductor paths that are printed on said first side, and a semiconductor component which connects the conductor paths by means of electrical connections. The electronic module of the invention is characterized in that each electrical connection includes a lead wire that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad.

Abstract: The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.

Abstract: The invention relates to a method for manufacturing a portable electronic-chip-comprising object including a body and a metal-air battery that is integrated into the body, the battery comprising an electrolyte layer and a protective air-porous membrane covering the electrolyte. The method includes a step of forming at least one air-supply duct extending from the protective membrane to an air source. An air-porous material is contained in the duct and completely blocks the duct at least in one place on its course. The invention also relates to the object corresponding to this method.

Abstract: The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.

Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.

Abstract: The invention relates to a method for creating a multi-component device, including the following steps, creating a module having a multilayer structure comprising electrical/electronic components arranged on at least one substrate in stacked layers, the components each having a main surface exposed to the outside, wherein the components are arranged such that the respective main surfaces thereof are oriented in mutually opposite directions. The invention also relates to the corresponding device.

Abstract: A device according to claim 6, characterised in that the interrupting zone is positioned outside the switch zone in which two wires (54, 56) of a circuit are so arranged as to cooperate with the switch are positioned.

Abstract: Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires, and device thereby obtained. The invention relates to a method of producing a device having at least two distinct components which are interconnected on a substrate by at least one interconnecting wire. The method includes the following steps: creating the interconnecting wire by depositing individual wires on the substrate in a predefined interconnecting pattern, the wire comprising at least one terminal connection portion which is exposed on the substrate, bringing at least one contact of a component to face the terminal portion and connecting the contact to this terminal portion. The invention also relates to the device thereby obtained and to a multi-component product comprising same.

Abstract: The invention relates to an electronic module comprising a dielectric support film having a first side, conductor paths that are printed on said first side, and a semiconductor component which connects the conductor paths by means of electrical connections. The electronic module of the invention is characterized in that each electrical connection includes a lead wire that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad.

Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.

Abstract: A device having an integrated-circuit chip includes an insulating body containing at least one conductive pad, at least one electrical contact opposite the electrically conductive pad, and at least one recess in the body, including a bottom and one aperture. The recess is connected, at the bottom thereof, to the conductive pad and, at the aperture thereof, to the electrical contact. At least one coil spring is arranged in the recess and connecting the conductive pad to the electrical contact. The installation of the spring in the recess is facilitated by means of the friction of the central portion of the spring relative to the walls of the recess. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite the electrically conductive pad.

Abstract: A device having an integrated-circuit chip includes an insulating body containing at least one conductive pad, at least one electrical contact opposite the electrically conductive pad, and at least one recess in the body, including a bottom and one aperture. The recess is connected, at the bottom thereof, to the conductive pad and, at the aperture thereof, to the electrical contact. At least one coil spring is arranged in the recess and connecting the conductive pad to the electrical contact. The installation of the spring in the recess is facilitated by means of the friction of the central portion of the spring relative to the walls of the recess. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite the electrically conductive pad.

Abstract: The invention relates to a method for creating a multi-component device, including the following steps, creating a module having a multilayer structure comprising electrical/electronic components arranged on at least one substrate in stacked layers, the components each having a main surface exposed to the outside, wherein the components are arranged such that the respective main surfaces thereof are oriented in mutually opposite directions. The invention also relates to the corresponding device.

Abstract: The invention relates to a format adapter comprising a storage device having: a front surface provided with electrical contact pads opposite a rear surface defining a lower peripheral border (2a); a body having a cavity (4) for receiving the device and opening on a front and rear side of the body, and; an adhesive film (8a), which is sensitive to pressure, adhered to the rear side of the body and which has at least one adhesive portion inside the cavity in order to hold the storage device. The adhesive film has an inner recess (10) essentially centered on the cavity and has at least one shoulder bordering on the cavity that assures a localized adhesion only on the lower peripheral border (2a) of the storage device. The invention also relates to a method for producing the adapter and to a use of the adapter for manufacturing and packaging the storage device.

Abstract: The invention concerns a USB-key type electronic device (73) comprising an electronic circuit mounted on a support (60), a gripping element showing a graphic print and/or customization (p), a protective case (70) arranged at the element so as to cause the graphic print and/or customization to be visible through the case. The invention is characterized in that the graphic print and/or customization is produced on the support (60) bearing the electronic circuit, and in that the case covers directly said support (60). The invention also concerns a method including the following steps: producing an electronic circuit support in the form of a printed smart card with contacts in conformity with the USB standard, producing a graphic customization on a support surface, protecting said graphic customization with a transparent protective shell.

Abstract: The invention relates to an electronic radiofrequency-transaction device that comprises a first switch capable of providing a radiofrequency operation of the device upon actuation of the switch and an operation stop when the actuation is released. The device is characterised in that it comprises a timer circuit capable of maintaining, after the actuation of the first switch, a continuous radiofrequency operation for a duration at least equal to the duration of a transaction to be carried out. The invention also relates to a smart card containing the device and to a module for an electronic radiofrequency-transaction device.

Abstract: A method of producing a smart card having a reduced format in relation to a second standard format and an adapter with the second format, which is associated with the smart card. A card body has a zone for the extraction of the smart card and a zone for the extraction of the adapter. At least the smart card is extracted from the support. The smart card is extracted from a zone located outside the peripheral outline of the adapter extraction zone. The invention also relates to the support thus obtained.

Abstract: Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires, and device thereby obtained. The invention relates to a method of producing a device having at least two distinct components which are interconnected on a substrate by at least one interconnecting wire. The method includes the following steps: creating the interconnecting wire by depositing individual wires on the substrate in a predefined interconnecting pattern, the wire comprising at least one terminal connection portion which is exposed on the substrate, bringing at least one contact of a component to face the terminal portion and connecting the contact to this terminal portion. The invention also relates to the device thereby obtained and to a multi-component product comprising same.

Abstract: A method for producing radiofrequency communication devices with or without an operation switch and devices obtained. The invention relates to a method for producing a radiofrequency communication device comprising an electronic component, an antennae circuit associated with the electronic component and a switch on the circuit capable of switching off the antennae circuit; the method being differentiated in that comprises the following steps: —the antennae (22) is made with a portion in the form of a closed circuit (15, 17) in a reception zone of the switch, —an interrupting zone (I) of the antennae circuit is created on the said portion at least by removing matter from the antenna. The invention also relates to the resulting devices.