Abstract: The invention relates to a format adapter comprising a storage device having: a front surface provided with electrical contact pads opposite a rear surface defining a lower peripheral border (2a); a body having a cavity (4) for receiving the device and opening on a front and rear side of the body, and; an adhesive film (8a), which is sensitive to pressure, adhered to the rear side of the body and which has at least one adhesive portion inside the cavity in order to hold the storage device. The adhesive film has an inner recess (10) essentially centered on the cavity and has at least one shoulder bordering on the cavity that assures a localized adhesion only on the lower peripheral border (2a) of the storage device. The invention also relates to a method for producing the adapter and to a use of the adapter for manufacturing and packaging the storage device.

Abstract: A method of producing a smart card having a reduced format in relation to a second standard format and an adapter with the second format, which is associated with the smart card. A card body has a zone for the extraction of the smart card and a zone for the extraction of the adapter. At least the smart card is extracted from the support. The smart card is extracted from a zone located outside the peripheral outline of the adapter extraction zone. The invention also relates to the support thus obtained.

Abstract: The invention concerns a USB-key type electronic device (73) comprising an electronic circuit mounted on a support (60), a gripping element showing a graphic print and/or customization (p), a protective case (70) arranged at the element so as to cause the graphic print and/or customization to be visible through the case. The invention is characterized in that the graphic print and/or customization is produced on the support (60) bearing the electronic circuit, and in that the case covers directly said support (60). The invention also concerns a method including the following steps: producing an electronic circuit support in the form of a printed smart card with contacts in conformity with the USB standard, producing a graphic customization on a support surface, protecting said graphic customization with a transparent protective shell.

Abstract: The invention concerns an electronic device such as a smart card which includes at least a microcircuit embedded in a carrier medium and which includes exit hubs linked to interface elements composed of a terminal block and/or an antenna. The connections between the exit hubs and the interface elements are made by depositing a low-viscosity conducting substance which remains flexible after its application, using a syringe or similar device. Preferably, a polymer resin charged with conducting or intrinsically conducting particles is used for the connections.

Abstract: A method for mounting, on a support, at least a microcircuit in the form of a chip produced on a very thin semiconductor substrate. An interconnection point is provided at the chip in the form of a bump contact in weldable material. The bump contact has a welding surface in the same plane as at least one of the chip faces. An interconnection pad is provided on the support that is designed to be welded with a corresponding bump contact of the chip. The welding face of each bump contact of the chip is placed opposite each corresponding interconnection pad of the support. Each bump contact of the chip is welded with each corresponding interconnection pad of the support. The method can be applied to a device such as a chip card.

Abstract: The invention concerns an electronic device such as a smart card which includes at least a microcircuit embedded in a carrier medium and which includes exit hubs linked to interface elements composed of a terminal block and/or an antenna. The connections between the exit hubs and the interface elements are made by depositing a low-viscosity conducting substance which remains flexible after its application, using a syringe or similar device. Preferably, a polymer resin charged with conducting or intrinsically conducting particles is used for the connections.

Abstract: An electronic module or label which is adapted to be rendered adhesive including a support film having an insulative film and at a communication interface disposed on the insulative film, at least one microcircuit, the communication interface being connected to the microcircuit by connections, an adhesive tape including an activatable adhesive adhered to the insulative film and a perforation coinciding with a predetermined area of the support film that includes the microcircuit and connections, a coating resin protecting the microcircuit and the connections and covering the predetermined area within the perforation. The adhesive tape can also include a removable protective film. After removing the removable protective film, the module or label can be adhered to a card body, forming a electronic card such as a smart card. In other embodiments, adhesive is applied to the support film so as to form a delimitation in which the coating resin is applied.

Abstract: The invention concerns a method for making an electronic device such as a smart card which includes at least a microcircuit embedded in a carrier medium and which includes exit hubs linked to interface elements composed of a terminal block and/or an antenna. The connections between the exit hubs and the interface elements are made by depositing a low-viscosity conducting substance which remains flexible after its application, using a syringe or similar device. Preferably, a polymer resin charged with conducting or intrinsically conducting particles is used for the connections.

Abstract: A standard size smart card has a flat support with a slot in the support to define the boundary of a minicard attached to the support by lugs. Each lug has two types of grooves opposite each other so they provide sufficient resistance to bending and flexing. One of the grooves is configured so it starts to crack when the minicard is purposely subject to pressure.

Abstract: The present invention relates to a method of fabricating at least one electronic module or label which is adapted to be rendered adhesive. The method includes the following steps: an insulative film is supplied including at least one contact and/or antenna type interface, and an adhesive tape is supplied including an activatable adhesive and a removable protective film. The tape includes at least one perforation corresponding to the area of the resin on the module or label. The adhesive tape is applied to the support film so that the perforation coincides with the area of the resin and the adhesive is activated so that it fixes the tape to the film. The coating resin is dispensed over the intended area at least within the perforation and in contact with the perforation. The invention also provides a method in which the activatable adhesive is deposited with no protection film.

Abstract: The invention aims at the manufacturing of a device having a support associated with at least one microcircuit in the form of a chip, and comprises the replacement of at least one chip having a defect either within it or at its connection to the communication interface; provision is made for:

Abstract: A contactless smart card includes a card body, an antenna and an integrated circuit chip connected to the antenna's connecting terminals. The connecting terminals of the antenna are further connected to conductive via holes emerging at the card surface. A junction based on an electrically conductive substance is flush with the card surface and connects the conductive via holes. The electrically conductive substance is designed to be removed by scraping, and prevents the card from being used until it is removed.

Abstract: Process for producing an electronic card comprising a micromodule inserted in the card body, wherein one layer of the body contacting the micromodule is of polymerized plastic material. A mixture containing a low viscosity liquid monomer is spread on a substrate used for producing the card and the polymerization of the monomer is initiated with a polymerization initiator. The process is particularly useful for the production of microcircuit cards such as contactless cards and advantageously uses an acrylic or methacrylic compound.

Abstract: A method for the manufacture of a contact-free card comprising a card body and an electronic module having an integrated circuit chip connected to an antenna, a frame is deposited on a lower thermoplastic sheet demarcating the edges of a cavity; the electronic module is positioned at the bottom of the cavity; this cavity is filled with a polymerizable resin; and the frame and the resin-filled cavity are covered with an upper thermoplastic sheet to which slight pressure is applied. The resin polymerizes, and the card is cut out within the frame.

Abstract: A method of manufacturing a hybrid chip card comprises the steps of providing a card body; forming a cavity in the card body; mounting the electronic module in the cavity of the card body; and connecting an antenna to the electronic module. The cavity opens out on a face of the card body and is adapted for receiving an electronic module. The electronic module includes an integrated circuit chip. The mounting step further includes the step of exposing a plurality of contact pads of the electronic module on the outer surface of the card. The plurality of contact pads permit contact communication between the electronic module and the chip card reader, and the antenna permits contact-free communication between the electronic module and the chip card reader. The hybrid chip card thus manufactured is capable of both contact and contact-free communication with a chip card reader.

Abstract: A contact-free card and a method for the manufacture of such a card. The card comprises a card body, an electronic module having an integrated chip card and two contact zones, and an antenna connected to the contact zones of said module by two contact terminals, wherein said module furthermore has contact pads connected to said chip for a contact-using operation of said card. Said method has a step according to which a layer of the card body is negative-molded on the antenna and a cavity is made in the card body, revealing said contact terminals of the antenna, followed by a step according to which the electronic module is mounted in the cavity of the card body. The invention can be applied to the manufacture of contact-free cards, which may or may not be combined and designed, for example, for remote cash type of operations.

Abstract: The system has a reader of electronic labels comprising several devices for the transmission/reception of electromagnetic waves, offset angularly about a median axis so that, when the reader is placed in the vicinity of a label and irrespectively of their relative orientation, at least a part of the lines of the magnetic field generated by at least one of said transmission/reception devices can get looped by passing into the coil of the label in the direction of its axis. The label has a foil made of amagnetic and conductive material placed against the antenna and parallel to it to form a reflective screen for the electromagnetic waves. Application to the contact-free identification of objects, notably metal objects, such as gas cylinders.

Abstract: A system for protecting integrated circuits on smart cards is described. The circuit (103) is placed in a cavity (102) in a ceramic package (101). Standard contacts (104) are deposited on the side of the package opposite to the cavity opening and connected to the chip (103) via feed-through conductors (106) extending into the cavity (102) and connected therein to wires (105) which are welded to the chip (103). The cavity (102) is either sealed by a lead (108) or filled with a protective material (208). Smart cards with a lifetime of over ten years may thus be obtained.