Abstract: A method for encapsulating a micro component positioned on and/or in a substrate, including: depositing at least one sacrificial material covering the micro component, making a cap covering the sacrificial material, removing the sacrificial material via at least one opening formed through the cap and forming a cavity in which the micro component is positioned, depositing, at least on the cap, at least one layer of plugging material that plugs the at least one opening, and performing a localized deposition of at least one portion of mechanically reinforcing material of the cap, covering at least the cap, wherein the mechanically reinforcing material is not subsequently etched.

Abstract: It consists of a microcomponent comprising a cavity (13) delimited by a cap (12) enclosing an active part (10) supported by a substrate (11). The cap (12) comprises a top wall (12a) comprising stiffening means with at least one projecting stiffening member (12b), said stiffening member (12b) being located between two recessed areas (12c) of the top wall (12a) and having one end (14) at a distance from the recessed areas (12c) without coming into contact with the substrate (11).

Abstract: A method for producing a sealed cavity, including: a) producing a sacrificial layer on a substrate; b) producing a cover layer covering at least the sacrificial layer and a portion of the face of the substrate not covered by the sacrificial layer, the cover layer including lateral flanks forming, with the substrate, an angle of less than 90°; c) producing a hole through one of the lateral flanks of the cover layer such that a maximum distance between the substrate and an edge of the hole is less than approximately 3 ?m, the hole crossing a portion of the cover layer deposited on a portion of the substrate not covered by the sacrificial layer; d) eliminating the sacrificial layer through the hole, forming the cavity; and e) depositing at least one material plugging the hole in a sealed fashion.

Abstract: A method for encapsulating a micro component positioned on and/or in a substrate, including the following steps: depositing at least one sacrificial material covering the micro component, making a cap covering the sacrificial material, removing the sacrificial material via at least one opening formed through the cap, forming a cavity in which the micro component is positioned, depositing, on the cap, at least one layer of plugging material capable of plugging the opening, localized deposition of a portion of mechanically reinforcing material of the cap, covering at least the cap.

Abstract: The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1) exposed inside the cavity (4). Application in particular in MEMS.

Abstract: A method of encapsulating a microelectronic device arranged on a substrate, comprising at least the following steps: a) formation of a portion of sacrificial material covering at least one part of the microelectronic device, the volume of which occupies a space intended to form at least one part of a cavity in which the device is intended to be encapsulated; b) deposition of a layer based on at least one getter material, covering at least one part of the portion of sacrificial material; c) formation of at least one orifice through at least the layer of getter material, forming an access to the portion of sacrificial material; d) elimination of the portion of sacrificial material via the orifice, forming the cavity in which the microelectronic device is encapsulated; and e) sealing of the cavity.

Abstract: It consists of a microcomponent comprising a cavity (13) delimited by a cap (12) enclosing an active part (10) supported by a substrate (11) The cap (13) comprises a top wall (12a) comprising stiffening means with at least one projecting stiffening member (12b) said stiffening member (12b) being located between two recessed areas (12c) of the top wall (12a) and having one end (14) at a distance from the recessed areas (12c) without coming into contact with the substrate (11).

Abstract: The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1) exposed inside the cavity (4). Application in particular in MEMS.

Abstract: Device comprising a carrier (100) and at least one cover (104) able to be bonded to the carrier to form with the carrier at least one cavity (114) having a controlled atmosphere around at least one component (102). In accordance with the invention, at least one of either the cover or the carrier is provided with at least one wedge (110) in fusible material and a strip of insulation (112) formed around said component, and before bonding, the wedge of fusible material is of sufficient thickness to prevent the strip of insulation (112) from coming into contact both with the cover and with the carrier when they are assembled together. Particular application to the encapsulation of electronic, mechanical or electromagnetic components.

Abstract: A method and device for hybridization of components by solder beads on a substrate using an oven, comprising: raising the temperature of a heating element of the oven, with no contact either with substrate or with component, bringing substrate into thermal contact with heating element for time .DELTA.t, and uncoupling substrate and heating element at the end of time .DELTA.t.

Abstract: A process for exchanging a detection module hybridized by welding beads, balls or bumps, employs an interconnection support having first and second groups of welding elements. The module to be hybridized is provided with blocks wettable by the weld, and positioned facing elements of the first group during hybridization. A replacement module is provided with blocks wettable by the weld and positioned facing elements of the second group during hybridization. The module which has been hybridized is dehybridized, and the replacement module is hybridized by means of the second group of elements.

Abstract: Method and machine to interconnect electric components by welding elements.The components (20,24) are provided with electric contact blocks and, given the fact that two components are to be interconnected, the blocks of one of these components are covered with welding elements made of a low melting point metallic material able to be welded to the blocks, the latter being wettable by the material in its molten state, whereas their environment is not so. The components are placed in contact so that these elements cover the corresponding blocks of the other component and the assembly obtained is heated to a temperature enabling the material to be melted.Application for microelectronics.