Abstract: For the management of a file system for accessing data in a storage system in which the data are stored physically in a unique manner, a first storage environment associated with a first access performance level is mounted, from a first mount point. Moreover, at least one second storage environment, different from the first storage environment, and associated with a second access performance level is mounted, from a second mount point and with total or partial overlay of data with respect to the first storage environment. The data physically stored in a unique manner in the storage system is accessed, either via the first mount point or via the second mount point, as a function of a data use case.

Abstract: A method for automatically managing the electricity consumption of a server farm including a plurality of nodes, the method including measuring an instantaneous consumption of the server farm; acquiring an instantaneous consumption limit; predicting a future consumption according to a function of at least the instantaneous consumption measurement; and, when the prediction is higher than the acquired instantaneous limit, selecting at least one node and electrically switching off the at least one selected node.

Abstract: Devices and methods are provided for controlled delivery of medical substances such as drugs and medication. For example, a microchip medical substance delivery device includes a control system, and a medical substance capsule that comprises a medical substance contained with a reservoir, and a release structure to release the medical substance from within the reservoir in response to an activation signal generated by the control system. The control system comprises a wireless signal receiving element, processor, actuator circuit, and power supply source. The wireless signal receiving element captures a wireless signal. The processor detects an activation code embedded within the captured wireless signal, and generates an actuator control signal in response to the detection of the activation code. The actuator circuit generates the activation signal in response to the actuator control signal generated by the processor. The power supply source provides power to operate components of the control system.

Abstract: A device for indicating a rack among a plurality of racks, the rack being configured to receive a plurality of pieces of computer equipment is disclosed. In one aspect, the device comprises a communication unit configured to receive at least one signal from at least one piece of equipment of the pieces of equipment. The signal comprises information enabling a state of the piece of equipment to be determined. The device further comprises a control unit configured to determine a state of the rack based at least in part on the signal. The device further comprises a display unit for displaying a representation of the state determined by the control unit.

Abstract: Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.

Abstract: A radio frequency fully depleted silicon on insulator (RF-FDSOI) device and method of fabrication are provided. A silicon wafer for digital circuits is constructed using fully depleted silicon on insulator technology having a thin buried oxide layer. Localized areas of the silicon wafer are constructed for radio frequency circuits and/or passive devices. The silicon wafer has a silicon substrate having a resistivity greater than 1 K?·cm. The localized areas of the silicon wafer may include a trap rich layer implanted underneath a thin buried oxide layer. The localized areas of the silicon wafer may include a buried oxide layer that is thicker than the thin buried oxide layer. The thicker oxide layer is between 20 and 2000 nm thick. The localized areas of the silicon wafer may include a trap rich layer implanted underneath the thicker buried oxide layer.

Abstract: In one embodiment, the disclosure relates to a method for determining a degree of homogeneity in one or more inspection images of cargo in one or more containers, comprising: determining whether a zone of interest in one or more processed inspection images comprises one or more patterns, wherein the one or more processed inspection images are processed from one or more inspection images generated by an inspection system configured to inspect the one or more containers; and in the event that one or more patterns is determined and that a variation in the determined one or more patterns is identified, classifying the one or more inspection images as having a degree of homogeneity below a predetermined homogeneity threshold.

Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.

Abstract: An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.

Abstract: According to an aspect of the present principles, methods are provided for fabricating an integrated structure. A method includes forming a very large scale integration (VLSI) structure including a semiconductor layer at a top of the VLSI structure. The method further includes mounting the VLSI structure to a support structure. The method additionally includes removing at least a portion of the semiconductor layer from the VLSI structure. The method also includes attaching an upper layer to the top of the VLSI structure. The upper layer is primarily composed of a material that has at least one of a higher resistivity or a higher transparency than the semiconductor layer. The upper layer includes at least one hole for at least one of a photonic device or an electronic device. The method further includes releasing said VLSI structure from the support structure.

Abstract: A method for monitoring the operation of an IT infrastructure including a plurality of calculation nodes, includes selecting calculation nodes for performing a calculation, performing the calculation via the selected calculation nodes, attributing, via the sequencer, a score to each one of the calculation nodes having participated in the calculation performed, with each score reflecting a difference between a measured operating parameter of the calculation node for which the score is attributed and a reference operating parameter of the calculation node for which the score is attributed, verifying the operation of the calculation nodes having participated in the calculation performed, the verification being carried out using scores attributed to the calculation nodes having participated in the calculation.

Abstract: The method relates to the monitoring of at least one routing parameter for a cluster including nodes and switches, static communication links connecting nodes and switches. Each switch includes several output ports. After having selected at least one switch, a number of routes per port is calculated for each port of each switch selected, routes being defined during a routing step for each connecting one node to another. A mean number of routes per port is then calculated for the at least one selected switch. Each number of routes per port calculated is then compared with the mean number of routes per port calculated and, in response to this comparison, a potential imbalance of routing of the cluster is notified.

Abstract: Package structures are provided for integrally packaging antennas with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter-wave and terahertz frequency ranges. For example, a package structure includes an RFIC chip, and an antenna package bonded to the RFIC chip. The antenna package includes a glass substrate, at least one planar antenna element formed on a first surface of the glass substrate, a ground plane formed on a second surface of the glass substrate, opposite the first surface, and an antenna feed line formed through the glass substrate and connected to the at least one planar antenna element. The antenna package is bonded to a surface of the RFIC chip using a layer of adhesive material.

Abstract: A semiconductor structure includes an optoelectronic device located in one region of a substrate. A dielectric material is located adjacent and atop the optoelectronic device. A top contact is located within a region of the dielectric material and contacting a topmost surface of the optoelectronic device. A bottom metal contact is located beneath the optoelectronic device and lining a pair of openings located with other regions of the dielectric material, wherein a portion of the bottom metal contact contacts an entire bottommost surface of the optoelectronic device.

Abstract: Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.

Abstract: The subject matter of the present invention is a compound characterized in that it has the general formula (I): in which P1, X, n, A, L and L1 are as defined in Claim 1. The present invention also relates to a process for preparing said compounds (I) and to the use thereof for targeting the cation-independent mannose 6-phosphate receptor (CI-M6PR). The subject matter of the invention is also a conjugate of formula (III): in which P1, X, n, A, L and L?1 are as defined in Claim 6, and the use thereof: in a method for therapeutic treatment of the human or animal body, in particular chosen from enzyme replacement therapy, photodynamic therapy or cancer treatment, and/or in a method of diagnosis, in particular of diseases or of ailments associated with an increase or with a decrease in CI-M6PR expression.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract: A commutating circuit includes a single-ended mixer and a passive network. The single-ended mixer includes a differential local oscillator terminal. The passive network includes a plurality of inductors and a capacitor. The plurality of inductors can be coupled to the differential local oscillator terminal. The plurality of inductors can provide an impedance in accordance with a common mode or a differential mode. The commutating circuit can be implemented via a device, a system and/or a method.

Abstract: An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.