Abstract: Systems and methods for MEMS device fabrication. A layer of photoresist is formed on a substrate. A first region of the substrate is exposed to a radiation source through a photomask. The first region of exposed photoresist is developed with a developer solution in order to etch the exposed regions to a first depth. A second region is exposed to radiation through a second photomask. The second photomask defines areas in which a bump feature is intended on the substrate. The second region is developed with the developer solution, preparing the first and second exposed regions for a layer of metal. A layer of metal is deposited on the substrate, such that the metal attaches to both the substrate and any remaining photoresist on the substrate. The remaining photoresist and its attached metal is dissolved away leaving an interconnect pattern and at least one bump feature.