Abstract: A holder includes a main body on which a plurality of circuit lines are laid out. The main body is integrally molded from a plastic material and can be formed thereon with a circuit layout by a specific process, such as a laser activated and chemical plating process. The main body includes a chamber having an opening formed at the top side of the main body, a base surface, and a stepped wall. Each of the circuit lines is arranged on the stepped wall of the chamber stereoscopically. Thus, the holder does not need to make a hole running therethrough to reach electrical connection between surfaces of different heights. Besides, the circuit lines are arranged stereoscopically, so they can extend to the top and bottom sides of the holder. Therefore, the holder can be applied to not only the traditional package but an upside-down package.

Abstract: A MEMS sensor capable of sensing acceleration and pressure includes a frame, a proof mass and flexible bridges connected between the frame and the proof mass in such a way that the proof mass is moveably suspended inside the frame. The proof mass is provided with a pressure sensing diaphragm and a sealed chamber corresponding to the diaphragm such that the proof mass is not only served as a moveable sensing element for acceleration measurement but also a pressure sensing element.

Abstract: A substrate for chip packaging includes a laminated board made of a plurality of ferrite sheets and a coil component disposed on the board. The coil component includes a first coil conductor, a second coil conductor, and a first via-hole conductor. The first coil conductor is disposed on a surface of a first sheet of the board. The second coil conductor is disposed on a surface of a second sheet of the board. The first via-hole conductor includes a first through hole formed at the first sheet and a first conductor filled in the first through hole. The substrate further includes a top surface having a plurality of first conductive pads, and a bottom surface having a plurality of second conductive pads. Each of the first conductive pads is electrically connected with each of the second conductive pads.

Abstract: A MEMS sensor capable of sensing acceleration and pressure includes a frame, a proof mass and flexible bridges connected between the frame and the proof mass in such a way that the proof mass is moveably suspended inside the frame. The proof mass is provided with a pressure sensing diaphragm and a sealed chamber corresponding to the diaphragm such that the proof mass is not only served as a moveable sensing element for acceleration measurement but also a pressure sensing element.

Abstract: A highly thermally conductive interface means comprises a plurality of non-particulate solid components and a liquid bonding paste. The non-particulate solid components are made of high heat-conducting materials and dispersedly disposed on interfaces between heat sources and heat sinks. The liquid bonding paste is applied on interfaces between heat sources and heat sinks and filled into gaps formed among each of said non-particulate solid components so that the heat sources, heat sinks and each of said non-particulate solid components are bonded together.

Abstract: A microelectromechanical sensor device package includes a substrate, a microelectromechanical sensor device and a cap. The substrate has a surface on which a circuit pattern having a plurality of first conductive contacts is provided. The device is mounted on the surface of the substrate and has an active surface on which a plurality of second conductive contacts are provided. A plurality of bonding wires are used to electrically connect the first conductive contacts to the second conductive contacts respectively. The cap is made of an electrically insulating material and attached on the surface of the substrate in a way that the cap covers the microelectromechanical sensor device and a space is formed between the cap and the microelectromechanical sensor device.

Abstract: A bulb for an electric lamp having a light-emitting element includes a light transmittable shell body for housing the light-emitting element. The light transmittable shell body includes an accommodation for receiving the light-emitting element of the electric lamp, and an inner surface surrounding the accommodation. On the inner surface of the light transmittable shell body a plurality of light-guiding portions are provided for guiding the light emitted from the light-emitting element towards an outside of the light transmittable shell body.

Abstract: A method includes the steps of preparing a tray having at least one chamber with an opening facing upward; placing at least one electronic component in the chamber; filling the chamber with a liquid that does not react with the at least one electronic component; and sealing the chamber. In light of this, when the electronic component having any kind of shape is placed in the chamber, the space for movement of the electronic component is limited, so that the electronic component is not subject to damage incurred by collision during transportation. In light of this, the chances of damaging the electronic component during transportation can be effectively decreased.

Abstract: A microinductor comprises an insulating substrate, a lower conductive winding, an upper conductive winding, and a core. The lower conductive winding is disposed on an upper surface of the substrate. The core is made of a material with high permeability and stacked over the lower conductive winding. The upper conductive winding is disposed on an upper surface of the core. The upper conductive winding electrically interconnects with the lower conductive winding so as to form an inductor coil.

Abstract: A semiconductor chip package with inductors includes a substrate, a semiconductor chip, an inductor and an insulator cover. The substrate has an active surface with a patterned circuit thereon. The inductor disposes on the active surface of the substrate. The semiconductor chip stacks over the inductor and electrically interconnects with the patterned circuit of the substrate and the inductor. The insulator cover encapsulates the inductor and the chip.

Abstract: A base substrate for chip scale package includes a carrier member made of electrical conductive metals with a first through opening; an active member laminated by a base layer made of electrical conductive metal and an intermediate layer made of electrical insulating or dielectric material, the active member having a through opening with a diameter larger that the diameter of the through opening of the base metal member; the active member being coupled with the carrier member in such a way that the intermediate layer is adhered to an upper surface of the carrier member, and these through openings are aligned to define a shoulder around the through opening of the base metal plate.

Abstract: A substrate for chip packaging comprises a carrier layer, an etching stopper and an active layer. The carrier layer is made of a conductive metal sheet with a predetermined thickness. The etching stopper is disposed on a side of the carrier layer. The active layer is made of conductive metal materials and disposed on a free side of the etching stopper in a wiring pattern formed by an etching process operating on the active layer.

Abstract: A base substrate for chip scale package includes a carrier member made of electrical conductive metals with a first through opening; an active member laminated by a base layer made of electrical conductive metal and an intermediate layer made of electrical insulating or dielectric material, the active member having a through opening with a diameter larger that the diameter of the through opening of the base metal member; the active member being coupled with the carrier member in such a way that the intermediate layer is adhered to an upper surface of the carrier member, and these through openings are aligned to define a shoulder around the through opening of the base metal plate.