Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.

Abstract: A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.

Abstract: Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis, a first fan including a first outlet and a second outlet, and a second fan having a third outlet and a fourth outlet. In the example electronic device, the first fan is to exhaust air through the first outlet and the second fan is to exhaust air through the third outlet to create a positive pressure in the chassis. The first fan is to exhaust air through the second outlet to an exterior of the chassis, and the second fan is to exhaust air through the fourth outlet to an exterior of the chassis.

Abstract: A vapor chamber system may include a vapor chamber and a heat spreader disposed on the vapor chamber. The heat spreader may include a surface facing the vapor chamber. The surface may include one or more protrusions extending toward the vapor chamber. The protrusions may be configured to thermally couple the heat spreader to the vapor chamber. The protrusions may be conical or may comprise elongated wave structures including alternating upper and lower portions forming a corrugated pattern. The protrusions may define cavities between the heat spreader and the vapor chamber configured to direct airflow for enhanced heat dissipation. The vapor chamber may include upper and lower vapor chamber layers defining a vapor zone therebetween, with support pillars extending between the layers. The protrusions may be aligned with the support pillars for structural enhancement and thermal conduction.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed related to composite materials for electronic device chassis. An example electronic device includes a chassis including a layer of a magnesium alloy or a layer of polyether ether ketone and carbon fiber reinforced plastic and an anodized aluminum coating.

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for deploying feet and/or including hinge gaskets to improve thermal solutions and/or acoustic experience with electronic devices. An example electronic device includes a first panel; a second panel; a hinge coupling the first panel and the second panel; a foot coupled to the second panel, the foot movable between a deployed position and a retracted position; a sensor to detect a position of the first panel; and programmable circuitry to execute instructions to cause the foot to be moved between the deployed position and the retracted position based on the position of the first panel.

Abstract: In one embodiment, an apparatus includes a circuit board (e.g., a motherboard) having conductive contacts that are integral with and extend away from a first metal layer of the circuit board. The contacts may extend away from the circuit board at an angle less than 90 degrees (e.g., less than 45 degrees in some embodiments). The contacts may include flat surfaces that are elevated away from and generally parallel with the upper surface of the circuit board.

Abstract: Disclosed herein is method for finishing a conductive part with a sustainable coating, where the part may be a magnesium-based chassis/housing for electronic equipment. The method includes depositing electrochemically a coating material onto the conductive surface of the component, placing a thin film over the coating material, and attaching the thin film onto the component by way of a vacuum transfer process. A graphite-based coating (e.g., graphene) may also be placed between the conductive surface and the thin film. The thin film may be decorative/cosmetic thin film to provide an attractive aesthetic.

Abstract: In one embodiment, a computing device includes a keyboard, a plurality of openings adjacent to the keyboard with at least one light emitting element positioned below each respective opening, and a flap above the plurality of openings. The flap is moveable between a first position that is generally parallel to the keyboard and a second position that is at an angle less than 90 degrees with respect to the keyboard. The flap includes touch sensing circuitry in areas adjacent to the respective openings and a liquid crystal layer that can be controlled to be generally transparent in the first position and generally opaque in the second position. The computing device may also include photochromatic paint adjacent to the openings.

Abstract: Apparatus, systems, and methods are disclosed for cooling an electronic device. An example electronic device includes a chassis including a first cover and a second cover. The example electronic device also includes a first looped frame spaced apart from the first cover, a second looped frame spaced apart from the second cover, and a printed circuit board between the first looped frame and the second looped frame.

Abstract: The disclosure described herein generally relates to a foldable input/output (I/O) port of a computing device, including: a connector board electrically connected to a circuit board of the computing device; one or more I/O connectors arranged on the connector board, wherein the one or more I/O connectors are electrically connected to the connector board and capable of receiving one or more external connectors when the foldable I/O port is in an open configuration; and a housing portion, pivotably connected to the computing device, wherein the housing portion is capable of housing the connector board and the one or more I/O connectors.

Abstract: Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material with high thermal conductivity and is configured to be overlaid on an internal surface of the housing, such that an internal surface of the apparatus is exposed to the hot air flowing inside the housing, and an external surface of the apparatus occludes at least some of the existing through-holes of the housing. In operation, the apparatus converts the through-holes into passive heat exchanging regions that passively transfer heat from inside the housing to outside the housing, which brings the internal air temperature and junction temperature (Tj) of the heat generating components down. Provided embodiments do not require reworking of the original industrial design (ID) of the housing.

Abstract: Devices and systems for cooling and shielding electromagnetic interference (EMI) are disclosed herein. In one example, a device includes a vapor chamber and one or more heat pipes coupled to the vapor chamber, where the heat pipes are at least partially below the vapor chamber. The heat pipes are to be coupled to a circuit board such that the heat pipes and the vapor chamber form at least a portion of an EMI shield around at least a portion of integrated circuitry on the circuit board.

Abstract: Thermal Management Systems for electronic devices and related methods are disclosed. An example electronic housing includes a housing defining a cavity, electronics in the cavity, and a touch display over the electronics. A heat spreader has a first surface toward the electronics and a second surface opposite the first surface toward the touch display, where the heat spreader is to dissipate heat generated by the electronics. A glass cover is coupled to the housing and has a first side toward the touch display and a second side opposite the first side, where the glass cover is exposed external to the housing. An insulation layer is between the second surface of the heat spreader and the second side of the glass cover to restrict heat transfer from the electronics to the second side of the glass cover.

Abstract: Embodiments disclosed herein include an apparatus with a substrate with a first surface and a second surface. In an embodiment, the substrate comprises a dielectric material. A first region of the substrate has a first metal density, and a second region of the substrate has a second metal density, where the second metal density is lower than the first metal density. In an embodiment, a depression is formed into the first surface of the substrate, where the depression is located at least partially over the second region of the substrate.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.

Abstract: Disclosed herein is a backplate assembly for mounting a component (such as a compression attached memory module (CAMM)) and a co-located component (such as a solid state drive (SSD)) to a printed circuit board (PCB). The backplate assembly includes a backplate mounted on a first face of the PCB and attached to the component on a second face of the PCB that is opposite to the first face. The backplate includes a cutout to receive the co-located component and a perimeter portion that includes a flange extending away from the backplate and the printed circuit board. The backplate assembly also includes a plate cap configured to engage with the flange to attach the plate cap to the backplate and to at least partially cover the co-located component.