Patents by Inventor JEFF KU

JEFF KU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210333848
    Abstract: According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.
    Type: Application
    Filed: July 7, 2021
    Publication date: October 28, 2021
    Inventors: Jeff KU, Tin Poay CHUAH, Howe Yin LOO, Chin Kung GOH, Yew San LIM, Cora Shih Wei NIEN
  • Publication number: 20210329816
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a heat pipe with a liquid reservoir. The heat pipe with a liquid reservoir can include a main heat transfer portion that includes wick material and a vapor channel and a reservoir portion that includes the wick material where the wick material in the reservoir portion occupies at least about fifteen percent more of a volume of the reservoir portion than a percentage of a volume that the wick material occupies in the main heat transfer portion. In an example, the reservoir portion holds surplus liquid that is used when the main heat transfer portion starts to experience dryout.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 21, 2021
    Applicant: Intel Corporation
    Inventors: Gaurav Patankar, Ruander Cardenas, Mark Angus MacDonald, Jeff Ku
  • Patent number: 11153990
    Abstract: In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: October 19, 2021
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Gavin Sung, Tim Liu, Gerry Juan, Jason Y. Jiang
  • Publication number: 20210234403
    Abstract: In one example an electronic device comprises at least one electronic component, a least one power storage device, and a chassis comprising a body formed from a rigid material and comprising a first pad coupled to the body by a first hinge, wherein the first pad is rotatable about the first hinge between a first position in which the first pad is closed and a second position in which the first pad is open, wherein the first pad comprises a first wireless power transmitting device. Other examples may be described.
    Type: Application
    Filed: April 14, 2021
    Publication date: July 29, 2021
    Inventors: Jeff Ku, Gavin Sung, Ivan Wang, Tim Liu, Jason Y. Jiang
  • Publication number: 20210173447
    Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example keyboard includes a plurality of keys and a translucent backplate having a first side and a second side. The example keyboard also includes a coating between the first side of the backplate and the plurality of keys, the coating to pass light to illuminate the plurality of keys, and the coating to obscure the plurality keys when viewed from the second side of the backplate.
    Type: Application
    Filed: February 11, 2021
    Publication date: June 10, 2021
    Inventors: Jeff Ku, Tim Liu, Yihua Lai, Lance Lin, Gavin Sung
  • Publication number: 20210144310
    Abstract: System and method for enabling capturing of multiple images from a display device in which one or more image capturing devices disposed, at least partially, in the display device are controllably oriented to capture one or more views of a subject for combining (e.g., via optical tiling of captured image data) into a composite view.
    Type: Application
    Filed: January 15, 2021
    Publication date: May 13, 2021
    Inventors: Jeff Ku, Tom Chen, Vincent Hung
  • Patent number: 10996913
    Abstract: The present disclosure pertains to multimodal dual displays. A display apparatus comprises a first electronic display, a second electronic display, and a display attachment including a first region configured to attach to the first electronic display, a second region configured to attach to the second electronic display, and an intermediate region configured to change a distance between the first electronic display and the second electronic display. At least one releasable fastener is configured to releasably couple a first edge of the first electronic display to a second edge of the second electronic display. A second set of releasable fasteners is configured to releasably couple a third edge of the first electronic display to a fourth edge of the second electronic display when regions of the display attachment releasably detach from the displays, enabling the displays to rotate to achieve a different configuration and orientation with a different combined aspect ratio.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: May 4, 2021
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Shantanu Kulkarni
  • Publication number: 20210112685
    Abstract: Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.
    Type: Application
    Filed: December 22, 2020
    Publication date: April 15, 2021
    Inventors: Aleksander Magi, Jeff Ku, Juha Paavola, Prakash Kurma Raju
  • Publication number: 20210092517
    Abstract: Systems, apparatus, articles of manufacture, methods are disclosed to reshape fan noise of a fan of an electronic device. An example system includes a microphone to detect a first acoustic signal including fan noise. The example system also includes a processor to: identify a tone in the first acoustic signal; and determine a gain to add to the first acoustic signal to mask the tone. In addition, the example system includes a sound transducer to present a second acoustic signal including the gain.
    Type: Application
    Filed: December 3, 2020
    Publication date: March 25, 2021
    Inventors: Shantanu D. Kulkarni, Jeff Ku, Sumod Cherukkate, Tongyan Zhai, Srikanth Potluri, Jordan E. Maslov
  • Patent number: 10955877
    Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example computing device includes a first display and a second display coupled to the first display via a first hinge. The example computing device also includes a keyboard coupled to the second display via a second hinge.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: March 23, 2021
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Tim Liu, Yihua Lai, Lance Lin, Gavin Sung
  • Patent number: 10917578
    Abstract: System and method for enabling capturing of multiple images from a display device in which multiple image capturing devices disposed, at least partially, in the display device are controllably oriented to capture opposing offset views of a subject for combining (e.g., via optical tiling of captured image data) into a composite view.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: February 9, 2021
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Tom Chen, Vincent Hung
  • Patent number: 10906652
    Abstract: Thermal management system for unmanned aerial vehicles are disclosed. An example housing for an unmanned aerial vehicle includes a central portion defining a cavity. The housing also includes a first arm to support a first propeller. The first arm has a first proximal end coupled to the central portion and a first distal end spaced from the central portion. The first distal end defines an inlet. The first arm defines a first fluid path in communication with the inlet and the central cavity. The housing also includes a second arm to support a second propeller. The second arm has a second proximal end coupled to the central portion and a second distal end spaced from the central portion. The second distal end defines an outlet. The second arm defines a second fluid path in communication with the outlet and the central cavity. The inlet and outlet are in fluid communication via the first path, the central cavity and the second path.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: February 2, 2021
    Assignee: INTEL CORPORATION
    Inventors: Jeff Ku, Gavin Sung, Michael Chih-Huei Wang, Vincent Hung, Jason Y. Jiang
  • Patent number: 10901224
    Abstract: A wearable computing device having a main computing element having a center portion and at least two arms and a display element operably connected to arms to enclose a region within which a body part may be inserted. Each arm may include a docking element connectable to the display element and may be configured to slide within the arm to move the display element relative to the center portion of the main computing element. A pivot arm may pivotably connect the display element to the slider arm to permit pivoting of the display element relative to the plane of the main computing element.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: January 26, 2021
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Gavin Sung, Simon S. Yuan, Lance Lin, Jason Y Jiang
  • Publication number: 20200396864
    Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.
    Type: Application
    Filed: June 27, 2020
    Publication date: December 17, 2020
    Applicant: Intel Corporation
    Inventors: Jeff Ku, Cora Nien, Gavin Sung, Tim Liu, Lance Lin, Wan Yu Liu, Gerry Juan, Jason Y. Jiang, Justin M. Huttula, Evan Piotr Kuklinski, Juha Tapani Paavola, Arnab Sen, Hari Shanker Thakur, Prakash Kurma Raju
  • Publication number: 20200337179
    Abstract: Particular embodiments described herein provide for an expandable heat sink for an electronic device. The expandable heat sink includes flexible thermal conductive material and an activator. The activator can cause the expandable heat sink to be in a retracted configuration with a retracted height or in an expanded configuration with an expanded height, wherein the expanded height is greater than the retracted height. In an example, the flexible thermal conductive material includes graphite sheets.
    Type: Application
    Filed: June 26, 2020
    Publication date: October 22, 2020
    Applicant: Intel Corporation
    Inventors: Jeff Ku, Ming-Che Lee, Wei-Ming Chu, Cora Nien
  • Patent number: 10798235
    Abstract: A mobile device having an internal frame and a sidebar configured to be coupled to the internal frame. The sidebar can include at least one button positioned in a button configuration on an exterior face of the sidebar and a sidebar contact positioned on an interior face of the sidebar. The sidebar can be positioned to interface with a frame contact when the sidebar is coupled to the internal frame. The frame can be operably coupled to a controller for a mobile device such that coupling the sidebar contact to the frame contact operably connects the at least one button of the sidebar to the controller. The sidebar can be exchanged with or decoupled from the frame and replaced with a second sidebar having a different button configuration from the original sidebar.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Simon Tsai, Tim Liu, Gavin Sung, Jeff Ku, Simon S. Yuan
  • Patent number: 10766618
    Abstract: Drones convertible into personal computers are disclosed, A disclosed unmanned aerial vehicle (UAV) includes a body and rotors carried by the body. The rotors move relative to the body from a first position when the UAV is in a drone mode to a second position when the UAV is in a computer mode.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: September 8, 2020
    Assignee: Intel Corporation
    Inventors: Shantanu D. Kulkarni, Gavin Sung, Jeff Ku
  • Patent number: 10747277
    Abstract: System and method for transferring heat generated by internal electronic components of a mobile computer to its external environment. Heat absorption and transfer elements disposed, in part, proximate heat-producing components move the heat to a remote heat sink assembly adapted to dissipate the heat. Example embodiments include one or more fans to produce internal airflow(s) that further facilitate internal heat transfer.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: August 18, 2020
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Shantanu D Kulkarni, Gavin Sung
  • Publication number: 20200128687
    Abstract: Personal computing device covers having stands are disclosed. A disclosed example apparatus includes a protective cover to at least partially cover a personal computing device. The cover includes a fixed panel to be thermally coupled to a chassis of the personal computing device to define a heatsink of the personal computing device, and a foldable panel to be rotatably coupled to the fixed panel via a hinge to support the personal computing device to stand at an angle from a surface.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Inventors: Jeff Ku, Juha Paavola, Mark Carbone, Shantanu Kulkarni, Mikko Makinen, Gustavo Fricke
  • Patent number: D933060
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: October 12, 2021
    Assignee: Intel Corporation
    Inventors: Shantanu Kulkarni, Jeff Ku