Abstract: An electronic chess set includes a plurality of conductive chess pieces, a chessboard having a playing surface including a plurality of individually identifiable locations visible to a user on the chessboard, and an electronic system including a capacitive sensing system. In some embodiments, the capacitive sensing system is configured to determine for each of the plurality of individually identifiable locations: when a chess piece included in the plurality of conductive chess pieces is located at a respective one of the plurality of individually identifiable locations and user-contact with the chess piece is absent; when the chess piece located at the respective one of the plurality of individually identifiable locations is in contact with the user; and when each of the plurality of conductive chess pieces is absent from the respective one of the plurality of individually identifiable locations.

Abstract: An electronic chess set includes a plurality of conductive chess pieces, a chessboard having a playing surface including a plurality of individually identifiable locations visible to a user on the chessboard, and an electronic system including a capacitive sensing system. In some embodiments, the capacitive sensing system is configured to determine for each of the plurality of individually identifiable locations: when a chess piece included in the plurality of conductive chess pieces is located at a respective one of the plurality of individually identifiable locations and user-contact with the chess piece is absent; when the chess piece located at the respective one of the plurality of individually identifiable locations is in contact with the user; and when each of the plurality of conductive chess pieces is absent from the respective one of the plurality of individually identifiable locations.

Abstract: An electronic chess set includes a plurality of conductive chess pieces, a chessboard having a playing surface including a plurality of individually identifiable locations visible to a user on the chessboard, and an electronic system including a capacitive sensing system. In some embodiments, the capacitive sensing system is configured to determine for each of the plurality of individually identifiable locations: when a chess piece included in the plurality of conductive chess pieces is located at a respective one of the plurality of individually identifiable locations and user-contact with the chess piece is absent; when the chess piece located at the respective one of the plurality of individually identifiable locations is in contact with the user; and when each of the plurality of conductive chess pieces is absent from the respective one of the plurality of individually identifiable locations.

Abstract: An electronic chess set includes a plurality of conductive chess pieces, a chessboard having a playing surface including a plurality of individually identifiable locations visible to a user on the chessboard, and an electronic system including a capacitive sensing system. In some embodiments, the capacitive sensing system is configured to determine for each of the plurality of individually identifiable locations: when a chess piece included in the plurality of conductive chess pieces is located at a respective one of the plurality of individually identifiable locations and user-contact with the chess piece is absent; when the chess piece located at the respective one of the plurality of individually identifiable locations is in contact with the user; and when each of the plurality of conductive chess pieces is absent from the respective one of the plurality of individually identifiable locations.

Abstract: An electronic chess set includes a plurality of game pieces, a chessboard having a playing surface including a plurality of individually identifiable locations visible to a user on the chessboard, an illumination system configured to illuminate each of the plurality individually identifiable locations and an electronic system coupled to the illumination system. Each of the individually identifiable locations is configured to receive any one of the plurality of game pieces. The electronic system includes a processor configured to determine when a user is in contact with a selected one of the plurality of game pieces and control an operation of the illumination system to illuminate the playing surface to provide a visual identification of at least one move available for the selected piece in view of a handicap level provided for the user.

Abstract: According to another aspect, a method of determining a current state of a cubic puzzle independent of information concerning a prior state of the cubic puzzle using at least one RGB sensor. With the cubic puzzle maintained in a first state, (a) illuminating a first colored surface selected from the plurality of colored surfaces with a single source of light selected from the plurality of sources of light because of an association with the first colored surface and sensing a color of the first colored surface with the RGB sensor when the first colored surface is illuminated.

Abstract: Generally, in one embodiment, the present disclosure is directed to a method for forming a transistor. The method includes: implanting a substrate to form at least one of an n and p doped region; depositing an epitaxial semiconductor layer over the substrate; forming trenches through the epitaxial layer and partially through at least one of an n and p doped region; forming dielectric isolation regions in the trenches; forming a fin in an upper portion of the epitaxial semiconductor layer by partially recessing the dielectric isolation regions; forming a gate dielectric adjacent at least two surfaces of the fin; and diffusing dopant from at least one of the n and p doped regions at least partially into the epitaxial semiconductor layer to form a diffusion doped transition region adjacent a bottom portion of the fin.

Abstract: Generally, in one embodiment, the present disclosure is directed to a method for forming a transistor. The method includes: implanting a substrate to form at least one of an n and p doped region; depositing an epitaxial semiconductor layer over the substrate; forming trenches through the epitaxial layer and partially through at least one of an n and p doped region; forming dielectric isolation regions in the trenches; forming a fin in an upper portion of the epitaxial semiconductor layer by partially recessing the dielectric isolation regions; forming a gate dielectric adjacent at least two surfaces of the fin; and diffusing dopant from at least one of the n and p doped regions at least partially into the epitaxial semiconductor layer to form a diffusion doped transition region adjacent a bottom portion of the fin.

Abstract: Generally, in one embodiment, the present disclosure is directed to a method for forming a transistor. The method includes: implanting a substrate to form at least one of an n and p doped region; depositing an epitaxial semiconductor layer over the substrate; forming trenches through the epitaxial layer and partially through at least one of an n and p doped region; forming dielectric isolation regions in the trenches; forming a fin in an upper portion of the epitaxial semiconductor layer by partially recessing the dielectric isolation regions; forming a gate dielectric adjacent at least two surfaces of the fin; and diffusing dopant from at least one of the n and p doped regions at least partially into the epitaxial semiconductor layer to form a diffusion doped transition region adjacent a bottom portion of the fin.

Abstract: Generally, in one embodiment, the present disclosure is directed to a method for forming a transistor. The method includes: implanting a substrate to form at least one of an n and p doped region; depositing an epitaxial semiconductor layer over the substrate; forming trenches through the epitaxial layer and partially through at least one of an n and p doped region; forming dielectric isolation regions in the trenches; forming a fin in an upper portion of the epitaxial semiconductor layer by partially recessing the dielectric isolation regions; forming a gate dielectric adjacent at least two surfaces of the fin; and diffusing dopant from at least one of the n and p doped regions at least partially into the epitaxial semiconductor layer to form a diffusion doped transition region adjacent a bottom portion of the fin.

Abstract: A surgical cutting instrument comprises an outer tubular member and an inner tubular member. The outer tubular member includes a proximal section, an intermediate section, a distal section, and a side wall. The side wall defines a central lumen extending from the proximal section to the distal section. The side wall also includes means for conducting fluid within a sidewall of the outer tubular member from the proximal section to the distal section and includes a distal opening positioned to direct fluid at the bur and a treatment site. The inner tubular member is rotatably received within the central lumen. A distal end of the inner tubular member forms a bur extending distally beyond, and exposed relative to, the distal section of the outer tubular member.

Abstract: Trench isolation structure and method of forming trench isolation structures. The structures includes a trench in a silicon region of a substrate, the trench extending from a top surface of the substrate into the silicon region; an ion implantation stopping layer over sidewalls of the trench; a dielectric fill material filling remaining space in the trench, the dielectric fill material not including any materials found in the stopping layer; an N-type dopant species in a first region of the silicon region on a first side of the trench; the N-type dopant species in a first region of the dielectric material adjacent to the first side of the trench; a P-type dopant species in a second region of the silicon region on a second side of the trench; and the P-type dopant species in a second region of the dielectric material adjacent to the second side of the trench.

Abstract: Trench isolation structure and method of forming trench isolation structures. The structures includes a trench in a silicon region of a substrate, the trench extending from a top surface of the substrate into the silicon region; an ion implantation stopping layer over sidewalls of the trench; a dielectric fill material filling remaining space in the trench, the dielectric fill material not including any materials found in the stopping layer; an N-type dopant species in a first region of the silicon region on a first side of the trench; the N-type dopant species in a first region of the dielectric material adjacent to the first side of the trench; a P-type dopant species in a second region of the silicon region on a second side of the trench; and the P-type dopant species in a second region of the dielectric material adjacent to the second side of the trench.

Abstract: A backside contact structure and method of fabricating the structure. The method includes: forming a dielectric isolation in a substrate, the substrate having a frontside and an opposing backside; forming a first dielectric layer on the frontside of the substrate; forming a trench in the first dielectric layer, the trench aligned over and within a perimeter of the dielectric isolation and extending to the dielectric isolation; extending the trench formed in the first dielectric layer through the dielectric isolation and into the substrate to a depth less than a thickness of the substrate; filling the trench and co-planarizing a top surface of the trench with a top surface of the first dielectric layer to form an electrically conductive through via; and thinning the substrate from a backside of the substrate to expose the through via.

Abstract: A method and an apparatus to perform dynamic secure re-routing of data flows for public services are disclosed. In one embodiment, the method includes receiving at a first security appliance a public service message from a second security appliance via a public network. The public service message being associated with a session between the first and the second security appliances, being destined to a first network device coupled to the first security appliance, and including one of a public service request and a public service response. In response to the public service message, the method may further include determining whether a secure communication path exists between the first and the second security appliances.

Abstract: A power outage socket device that may be installed on a variety of lamps or light fixtures. The bottom of the device has a male connector adapted to be inserted into the light socket on the lamp or light fixture, in place of the light bulb. A female socket adapted to receive the light bulb is located on the top of the device. The male connector may be recessed. When power is interrupted, emergency power is provided to one or more emergency light sources on the device to provide light. Emergency power is provided by one or more batteries, which may be rechargeable. The device also may include means for connecting a lamp harp, or for allowing a lamp harp to pass through the device. A photoelectric light sensor may be used to detect ambient light and control whether emergency light is provided when normal power is interrupted.

Abstract: A surgical cutting instrument comprises an outer tubular member and an inner tubular member. The outer tubular member includes a proximal section, an intermediate section, a distal section, and a side wall. The side wall defines a central lumen extending from the proximal section to the distal section. The side wall also includes means for conducting fluid within a sidewall of the outer tubular member from the proximal section to the distal section and includes a distal opening positioned to direct fluid at the bur and a treatment site. The inner tubular member is rotatably received within the central lumen. A distal end of the inner tubular member forms a bur extending distally beyond, and exposed relative to, the distal section of the outer tubular member.

Abstract: A backside contact structure and method of fabricating the structure. The method includes: forming a dielectric isolation in a substrate, the substrate having a frontside and an opposing backside; forming a first dielectric layer on the frontside of the substrate; forming a trench in the first dielectric layer, the trench aligned over and within a perimeter of the dielectric isolation and extending to the dielectric isolation; extending the trench formed in the first dielectric layer through the dielectric isolation and into the substrate to a depth less than a thickness of the substrate; filling the trench and co-planarizing a top surface of the trench with a top surface of the first dielectric layer to form an electrically conductive through via; and thinning the substrate from a backside of the substrate to expose the through via.

Abstract: A backside contact structure and method of fabricating the structure. The method includes: forming a dielectric isolation in a substrate, the substrate having a frontside and an opposing backside; forming a first dielectric layer on the frontside of the substrate; forming a trench in the first dielectric layer, the trench aligned over and within a perimeter Of the dielectric isolation and extending to the dielectric isolation; extending the trench formed in the first dielectric layer through the dielectric isolation and into the substrate to a depth less than a thickness of the substrate; filling the trench and co-planarizing a top surface of the trench with a top surface of the first dielectric layer to form an electrically conductive through via; and thinning the substrate from a backside of the substrate to expose the through via.

Abstract: A wireless timer system (10) is shown including a master unit (12) and multiple remote modules (13). The master unit communicates with the slave units through a RF signal. The master unit includes a control circuit for controlling the activation of the remote modules during at least one designated activation time period having a commencement time and a termination time. The designated activation time period including a plurality of on/off cycles. The control circuit changes the selection of which remote module to activate first upon each occurrence of reaching the designated activation time period. The control circuit may also include a variable time range associated with the activation time period. The control circuit may change the commencement time each day to a time within the variable time range from the commencement time.