Patents by Inventor Jeffrey A. Ridley

Jeffrey A. Ridley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8644836
    Abstract: Routing an incoming call for an IP phone system is disclosed. A location data for a mobile device is received. A way point based at least in part on the location data is determined. A state for a user of the IP phone system is determined based at least in part on the way point. An incoming call is routed to the IP phone system based at least in part on the state.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: February 4, 2014
    Assignee: ShoreTel, Inc.
    Inventors: Jeffrey Ridley, Pascal Crausaz, Edwin Basart
  • Patent number: 8188561
    Abstract: An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: May 29, 2012
    Assignee: Honeywell International Inc.
    Inventors: Robert E. Higashi, Karen M. Newstrom-Peitso, Jeffrey A. Ridley
  • Publication number: 20110070401
    Abstract: An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
    Type: Application
    Filed: December 1, 2010
    Publication date: March 24, 2011
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Robert E. Higashi, Karen M. Newstrom-Peitso, Jeffrey A. Ridley
  • Patent number: 7875944
    Abstract: An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: January 25, 2011
    Assignee: Honeywell International Inc.
    Inventors: Robert E. Higashi, Karen M. Newstrom-Peitso, Jeffrey A. Ridley
  • Publication number: 20090247188
    Abstract: Routing an incoming call for an IP phone system is disclosed. A location data for a mobile device is received. A way point based at least in part on the location data is determined. A state for a user of the IP phone system is determined based at least in part on the way point. An incoming call is routed to the IP phone system based at least in part on the state.
    Type: Application
    Filed: August 3, 2007
    Publication date: October 1, 2009
    Inventors: Jeffrey Ridley, Pascal Crausaz, Edwin Basart
  • Patent number: 7549206
    Abstract: A flow sensor system and a method for fabricating the same. A substrate is provided, comprising a detector wafer upon which a flow sensor is formed. One or more shells can then be configured upon the substrate whose walls form a flow channel. The flow channel is fabricated directly upon the substrate in a manner that allows the flow channel to couple heat transfer directly to the flow sensor in order to eliminate the need for two or more different types of sacrificial layers during the fabrication of the flow sensor upon the substrate and in which the shell(s) is coupled with fluidic measurement to provide for the flow sensor.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: June 23, 2009
    Assignee: Honeywell International Inc.
    Inventors: Robert E. Higashi, Son T. Lu, Jeffrey A. Ridley
  • Publication number: 20090044620
    Abstract: A flow sensor system and a method for fabricating the same. A substrate is provided, comprising a detector wafer upon which a flow sensor is formed. One or more shells can then be configured upon the substrate whose walls form a flow channel. The flow channel is fabricated directly upon the substrate in a manner that allows the flow channel to couple heat transfer directly to the flow sensor in order to eliminate the need for two or more different types of sacrificial layers during the fabrication of the flow sensor upon the substrate and in which the shell(s) is coupled with fluidic measurement to provide for the flow sensor.
    Type: Application
    Filed: August 13, 2007
    Publication date: February 19, 2009
    Inventors: Robert E. Higashi, Son T. Lu, Jeffrey A. Ridley
  • Patent number: 7396476
    Abstract: Methods of fabricating comb drive devices utilizing one or more sacrificial etch-buffers are disclosed. An illustrative fabrication method may include the steps of etching a pattern onto a wafer substrate defining one or more comb drive elements and sacrificial etch-buffers, liberating and removing one or more sacrificial etch-buffers prior to wafer bonding, bonding the etched wafer substrate to an underlying support substrate, and etching away the wafer substrate. In some embodiments, the sacrificial etch-buffers are removed after bonding the wafer to the support substrate. The sacrificial etch-buffers can be provided at one or more selective regions to provide greater uniformity in etch rate during etching. A comb drive device in accordance with an illustrative embodiment can include a number of interdigitated comb fingers each having a more uniform profile along their length and/or at their ends, producing less harmonic distortion during operation.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: July 8, 2008
    Assignee: Honeywell International Inc.
    Inventors: Jeffrey A. Ridley, James A. Neus
  • Patent number: 7396698
    Abstract: A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.
    Type: Grant
    Filed: December 30, 2005
    Date of Patent: July 8, 2008
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Jeffrey A. Ridley
  • Publication number: 20080017944
    Abstract: An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
    Type: Application
    Filed: August 1, 2007
    Publication date: January 24, 2008
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Robert Higashi, Karen Newstrom-Peitso, Jeffrey Ridley
  • Patent number: 7276798
    Abstract: An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be sealed to maintain a vacuum within the volume between the two wafers after the pump out of gas and air. The inside surface of the top wafer may have an anti-reflective pattern. Also, an anti-reflective pattern may be on the outside surface of the top wafer. The seal between the two wafers may be ring-like and have a spacer material. Also, it may have a malleable material such as solder to compensate for any flatness variation between the two facing surfaces of the wafers.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: October 2, 2007
    Assignee: Honeywell International Inc.
    Inventors: Robert E. Higashi, Karen M. Newstrom-Peitso, Jeffrey A. Ridley
  • Publication number: 20060113644
    Abstract: Methods of fabricating comb drive devices utilizing one or more sacrificial etch-buffers are disclosed. An illustrative fabrication method may include the steps of etching a pattern onto a wafer substrate defining one or more comb drive elements and sacrificial etch-buffers, liberating and removing one or more sacrificial etch-buffers prior to wafer bonding, bonding the etched wafer substrate to an underlying support substrate, and etching away the wafer substrate. In some embodiments, the sacrificial etch-buffers are removed after bonding the wafer to the support substrate. The sacrificial etch-buffers can be provided at one or more selective regions to provide greater uniformity in etch rate during etching. A comb drive device in accordance with an illustrative embodiment can include a number of interdigitated comb fingers each having a more uniform profile along their length and/or at their ends, producing less harmonic distortion during operation.
    Type: Application
    Filed: January 17, 2006
    Publication date: June 1, 2006
    Inventors: Jeffrey Ridley, James Neus
  • Publication number: 20060110854
    Abstract: A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.
    Type: Application
    Filed: December 30, 2005
    Publication date: May 25, 2006
    Inventors: Robert Horning, Jeffrey Ridley
  • Patent number: 7012322
    Abstract: Methods of fabricating comb drive devices utilizing one or more sacrificial etch-buffers are disclosed. An illustrative fabrication method may include the steps of etching a pattern onto a wafer substrate defining one or more comb drive elements and sacrificial etch-buffers, liberating and removing one or more sacrificial etch-buffers prior to wafer bonding, bonding the etched wafer substrate to an underlying support substrate, and etching away the wafer substrate. In some embodiments, the sacrificial etch-buffers are removed after bonding the wafer to the support substrate. The sacrificial etch-buffers can be provided at one or more selective regions to provide greater uniformity in etch rate during etching. A comb drive device in accordance with an illustrative embodiment can include a number of interdigitated comb fingers each having a more uniform profile along their length and/or at their ends, producing less harmonic distortion during operation.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: March 14, 2006
    Assignee: Honeywell International Inc.
    Inventors: Jeffrey A. Ridley, James A. Neus
  • Patent number: 7005732
    Abstract: A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.
    Type: Grant
    Filed: October 21, 2003
    Date of Patent: February 28, 2006
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Jeffrey A. Ridley
  • Patent number: 6924165
    Abstract: A method for providing conductive paths into a hermetically sealed cavity is described. The sealed cavity is formed utilizing a silicon-glass micro-electromechanical structure (MEMS) process and the method includes forming recesses on a glass substrate everywhere that a conductive path is to pass into the cavity, and forming conductive leads in and around the recesses. A glass layer is deposited over the substrate, into the recesses, and over the conductive leads and then planarized to expose portions of the conductive leads. A sealing surface is formed on at least a portion of the glass layer. Silicon is then bonded to the sealing surface of the planarized glass layer, the wafer being configured such that a portion of each lead is within the sealed cavity and a portion of each lead is outside the sealed cavity.
    Type: Grant
    Filed: July 14, 2004
    Date of Patent: August 2, 2005
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Jeffrey A. Ridley
  • Publication number: 20050136621
    Abstract: Methods of fabricating comb drive devices utilizing one or more sacrificial etch-buffers are disclosed. An illustrative fabrication method may include the steps of etching a pattern onto a wafer substrate defining one or more comb drive elements and sacrificial etch-buffers, liberating and removing one or more sacrificial etch-buffers prior to wafer bonding, bonding the etched wafer substrate to an underlying support substrate, and etching away the wafer substrate. In some embodiments, the sacrificial etch-buffers are removed after bonding the wafer to the support substrate. The sacrificial etch-buffers can be provided at one or more selective regions to provide greater uniformity in etch rate during etching. A comb drive device in accordance with an illustrative embodiment can include a number of interdigitated comb fingers each having a more uniform profile along their length and/or at their ends, producing less harmonic distortion during operation.
    Type: Application
    Filed: December 22, 2003
    Publication date: June 23, 2005
    Inventors: Jeffrey Ridley, James Neus
  • Patent number: 6888233
    Abstract: A method for providing conductive paths into a hermetically sealed cavity is described. The sealed cavity is formed utilizing a silicon-glass micro-electromechanical structure (MEMS) process and the method includes forming recesses on a glass substrate everywhere that a conductive path is to pass into the cavity, and forming conductive leads in and around the recesses. A glass layer is deposited over the substrate, into the recesses, and over the conductive leads and then planarized to expose portions of the conductive leads. A sealing surface is formed on at least a portion of the glass layer. Silicon is then bonded to the sealing surface of the planarized glass layer, the wafer being configured such that a portion of each lead is within the sealed cavity and a portion of each lead is outside the sealed cavity.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: May 3, 2005
    Assignee: Honeywell International Inc.
    Inventors: Robert D. Horning, Jeffrey A. Ridley
  • Publication number: 20050084998
    Abstract: A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound layer to a back side, edges, and a portion of a front side of the device wafer. The method also includes producing an upper wafer including an etched substrate and interconnect metal, bonding the device wafer and the upper wafer, and dicing the bonded upper wafer and device wafer into individual MEMS devices.
    Type: Application
    Filed: October 21, 2003
    Publication date: April 21, 2005
    Inventors: Robert Horning, Jeffrey Ridley
  • Patent number: RE39143
    Abstract: A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips.
    Type: Grant
    Filed: December 3, 2001
    Date of Patent: June 27, 2006
    Assignee: Honeywell International Inc.
    Inventors: R. Andrew Wood, Jeffrey A. Ridley, Robert E. Higashi