Abstract: A method includes machining a raw surface of a metal component to remove first native oxide from a metal base of the metal component to generate an as-machined surface of the metal component. A second native oxide is formed on the metal base of the as-machined surface of the metal component subsequent to the machining. The method further includes, subsequent to the machining, performing operations to generate a finished surface of the metal component. The operations include a surface machining of the as-machined surface of the metal component to remove the second native oxide.

Abstract: A robot apparatus with variable end effector pitch is provided suitable for accommodating varying pitches, e.g., between two adjacent processing chambers or between two adjacent load lock chambers. The robot apparatus may operate in dual substrate handling mode, single substrate handling mode, or a combination thereof. The robot apparatus may also be an off-axis robot. A variety of robot apparatuses according to various embodiments, electronic device processing systems including such robot apparatuses, and methods of use thereof are described.

Abstract: A method of transporting substrates within an electronic device processing system includes rotating a first upper arm of a first arm assembly of a robot. The rotating causes a first end effector of the first arm assembly to move along a first path. The first arm assembly includes the first upper arm, a first forearm, a first wrist member, and the first end effector configured to support a first substrate. The method further includes rotating a second upper arm of a second arm assembly of the robot. The rotating causes a second end effector of the second arm assembly to move along a second path. The second arm assembly includes the second upper arm, a second forearm, a second wrist member, and the second end effector configured to support a second substrate. The second substrate does not overlap with the first substrate in any operating position of the end effectors.

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

Abstract: A robot apparatus may include an upper arm adapted to rotate about a first rotational axis and a forearm rotatably coupled to the upper arm at a second rotational axis. A first wrist member may be rotatably coupled to the forearm at a third rotation axis. A second wrist member may be rotatably coupled to the forearm at the third rotation axis. A first end effector may be coupled to the first wrist member and a second end effector may be coupled to the second wrist member. The first wrist member and the second wrist member may be configured to rotate about the third rotational axis between a first pitch and a second pitch as a function of extension of the robot apparatus. Other apparatus and methods are disclosed.

Abstract: A robot may include a first arm assembly including a first upper arm rotatable about a first axis; a first forearm adapted for rotation relative to the first upper arm about a second axis; a first wrist member adapted for rotation relative to the first forearm about a third axis; and a first end effector coupled to the first wrist member, wherein the first end effector is moveable along a first path. A second arm assembly may include a second upper arm rotatable about the first axis; a second forearm adapted for rotation relative to the second upper arm about a fourth axis; a second wrist member adapted for rotation relative to the second forearm; and a second end effector coupled to the second wrist member, wherein the second end effector is moveable along a second path that does not overlap the first path. Other apparatus and methods are disclosed.

Abstract: An electronic device manufacturing system includes a mainframe including a transfer chamber and facets defining side walls of the transfer chamber. The facets include first facet, second facet, third facet, and fourth facet that form the transfer chamber. The first facet has a first number of substrate access ports. The second facet has a second number of substrate access ports. A first substrate access port of the first facet has a first side dimension and a second substrate access port of the second facet has a second side dimension that is different from the first side dimension. The second facet is adjacent to the first facet. The third facet is adjacent to the second facet. The fourth facet has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.

Abstract: A robot device includes a first link and a second link coupled to the first link via an elbow. One or more of the first link or the second link rotates about an axis of the elbow. The robot device further includes a generator disposed in the elbow. The generator is configured to generate electrical power based on relative angular mechanical movement associated with the elbow. The robot device further includes an end effector configured to transport a substrate within a substrate processing system. The end effector is disposed at a distal end of the second link. The end effector is to receive the electrical power generated by the generator.

Abstract: Disclosed herein are embodiments of an electrostatic end effector, and methods of manufacturing the same. In one embodiment, an electrostatic end effector comprises a ceramic base, a first electrode layer coupled to the ceramic base, and a second electrode layer coupled to the ceramic base. The electrostatic end effector is configured to generate an electrostatic force upon a substrate responsive to a voltage applied to the first electrode. The electrostatic force upon the substrate may increase the friction force upon the substrate which may allow the end effector to accelerate at faster rates than current technologies allow without the substrate slipping on the end effector.

Abstract: The disclosure describes devices, systems and methods relating to a transfer chamber for an electronic device processing system. For example, a method includes causing a robot arm to pick up a substrate. The robot arm is caused to pick up the substrate by causing a first mover to rotate or to change a first distance to a second mover. Rotation of the first mover or the change in the first distance causes the first robot arm to rotate about a shoulder axis. The robot arm is further caused to pick up the substrate by causing one of a) a second mover to rotate or b) a third mover to change a second distance to the second mover. Rotation of the second mover or the change in the second distance causes the robot arm to raise or lower.

Abstract: A method includes machining a raw surface of a metal component to remove first native oxide from a metal base of the metal component to generate an as-machined surface of the metal component. A second native oxide is formed on the metal base of the as-machined surface of the metal component subsequent to the machining. The method further includes, subsequent to the machining, performing operations to generate a finished surface of the metal component. The operations include a surface machining of the as-machined surface of the metal component to remove the second native oxide.

Abstract: A robot apparatus is configured to extend a first end effector into a first process chamber and extend a second end effector into a second process chamber. The first process chamber and the second process chamber are separated by a first pitch. The robot apparatus is further configured to retract the first end effector and the second end effector into a rectangular mainframe while maintaining a distance between the substrates bounded by the first pitch throughout a retraction process, and fold the first end effector and the second end effector inward within a sweep diameter defined by a width of the rectangular mainframe.

Abstract: A semiconductor processing system includes a first component and a second component. The first component forms a first chamber with a first sealed environment at a first state within the first chamber. The second component is coupled to the first component. The second component forms a second chamber with a second sealed environment at a second state within the second chamber. A third component is to change the first state of the first sealed environment within the first chamber to cause the first state to be substantially similar to the second state of the second sealed environment within the second chamber. The second sealed environment is at the second state prior to changing of the first state of the first sealed environment to be substantially similar to the second state.

Abstract: Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber includes a magnetic levitation platform, having a magnetic levitation track disposed along a length of the transfer chamber and configured to generate a magnetic field above the track. The transfer chamber also includes a magnetic levitation track disposed along a width of the transfer chamber such that a plane of this lateral track crosses a plane of the longitudinal track at a junction. The lateral track is configured to generate a magnetic field above or below the track. The platform further includes at least one substrate carrier configured to move along the longitudinal track and the lateral track. The substrate carrier also is configured to rotate at the junction.

Abstract: Replaceable contact pads of end effectors are provided. The contact pads support substrates in electronic device manufacturing. The contact pad includes a contact pad head having a contact surface configured to contact a substrate, a shaft coupled to the contact pad head, the shaft including a shaft indent formed between an underside of the contact pad head and a shaft end, and a circular securing member received around the shaft and seated in the shaft indent and configured to secure the contact pad to the end effector body. End effectors including replaceable contact pads and maintenance methods are described, as are additional aspects.

Abstract: A substrate processing system for an electronic device manufacturing system can include a factory interface forming an interior volume, and a partition disposed in the factory interface. The partition can divide the interior volume into a first factory interface chamber forming a second interior volume, and a second factory interface chamber forming a third interior volume. The partition can be configured to provide a first sealed environment in the first factory interface chamber and a second sealed environment in the second factory interface chamber.

Abstract: An electronic device manufacturing system includes a mainframe that includes a first transfer chamber and facets defining first side walls of the first transfer chamber. The facets include a first facet that has a first number of substrate access ports, a second facet that has a second number of substrate access ports, and a third facet that has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.

Abstract: The disclosure describes devices, systems and methods relating to a transfer chamber for an electronic device processing system. For example, a robot can include a first mover configured to be driven by a platform of a linear motor, a support structure disposed on the first mover, a first robot arm attached to the first end of the support structure at a shoulder axis, and a first arm drive assembly. The first drive assembly can include a first pulley attached to a first end of the support structure and to the first robot arm at the shoulder axis, a second pulley attached to a second end of the support structure, a first band connecting the first pulley to the second pulley, and a second mover configured to be driven by the platform of the linear motor, where the second mover is connected to the first band, and where motion of the second mover relative to the first mover causes the first band to a) rotate the first pulley and the second pulley and b) rotate the first robot arm around the shoulder axis.

Abstract: A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

Abstract: The disclosure describes devices, systems, and methods for causing a factory interface of an electronic device manufacturing system to be moveable between a first position and a second position. An electronic device manufacturing system can include a transfer chamber, processing chambers connected to the transfer chamber, a load lock connected to the transfer chamber, and a factory interface connected to the load lock. The factory interface can be moveable between a first position and a second position. The factory interface, while oriented in the first position, is positioned for transfer of one or more substrates between the factory interface and the load lock, where at least one of the transfer chamber or the load lock are inaccessible for maintenance while the factory interface is oriented at the first position. The factory interface, while oriented in the second position, is positioned to provide maintenance access to at least one of the transfer chamber or the load lock.