Abstract: Methods, system, and devices including a robot apparatus with at least one lower arm configured to rotate about a first rotational axis and at least one upper arm rotatably coupled to the at least one lower arm at a second rotational axis that is spaced away from the first rotational axis. The robot apparatus further include a first end effector coupled to the upper arm. The robot apparatus further includes a second end effector coupled to the at least one upper arm. The robot apparatus is suitable for accommodating varying pitches between two adjacent processing chambers or between two adjacent load lock chambers. The robot apparatus may operate in dual substrate handling mode, single substrate handling mode, or a combination thereof. The robot apparatus may also be an off-axis robot.

Abstract: Methods, systems, and devices including a robot apparatus with at least one lower arm configured to rotate about a first rotational axis and at least one upper arm rotatably coupled to the at least one lower arm at a second rotational axis that is spaced away from the first rotational axis. The robot apparatus further include a first end effector coupled to the upper arm. The robot apparatus further includes a second end effector coupled to the at least one upper arm. The robot apparatus is suitable for accommodating varying pitches between two adjacent processing chambers or between two adjacent load lock chambers. The robot apparatus may operate in dual substrate handling mode, single substrate handling mode, or a combination thereof. The robot apparatus may also be an off-axis robot.

Abstract: A detector disc includes a disc body having a bottom disc and a top cover, the top cover including a first aperture. A sensor is disposed inside the disc body and positioned to be exposed to an external environment via the first aperture in the top cover. The solid state sensor is adapted to detect levels of chemical gas contaminants and output a detection signal based on detected levels of the chemical gas contaminants. A microcontroller is disposed on the PCB and adapted to generate measurement data from the detected levels of the chemical gas contaminants embodied within the detection signal. A wireless communication circuit is disposed on the PCB, the wireless communication circuit adapted to transmit the measurement data wirelessly to a wireless access point device.

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

Abstract: A robot device includes a first link and a second link coupled to the first link via an elbow. One or more of the first link or the second link rotates about an axis of the elbow. The robot device further includes a generator disposed in the elbow. The generator is configured to generate electrical power based on relative angular mechanical movement associated with the elbow. The robot device further includes an end effector configured to transport a substrate within a substrate processing system. The end effector is disposed at a distal end of the second link. The end effector is to receive the electrical power generated by the generator.

Abstract: Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an upper arm and three blades B1, B2, B3 that are independently rotatable. The three blades are configured to service a first dual load lock and second dual load lock wherein each dual load lock includes a different pitch. In some embodiments, a first pitch P1 is smaller than a second pitch P2. Blades B2 and B3 (or optionally blades B1 and B2) can service the first dual load lock with Pitch P1 and blades B1 and B3 can service the second dual load lock including the second pitch P2. Methods of operating the electronic device manufacturing apparatus and the robot apparatus are provided, as are numerous other aspects.

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

Abstract: Electronic device manufacturing systems, robot apparatus and associated methods are described. The robot apparatus includes an arm having an inboard end and an outboard end, the inboard end is configured to rotate about a shoulder axis; a first forearm is configured for independent rotation relative to the arm about an elbow axis at the outboard end of the arm; a first wrist member is configured for independent rotation relative the first forearm about a first wrist axis at a distal end of the first forearm opposite the elbow axis, wherein the first wrist member includes a first end effector and a second end effector. The robot apparatus further includes a second forearm configured for independent rotation relative to the arm about the elbow axis; a second wrist member configured for independent rotation relative the second forearm about a second wrist axis, wherein the second wrist member comprises a third end effector and a fourth end effector.

Abstract: Electronic device manufacturing systems, robot apparatus and associated methods are described. The systems, apparatus and methods are configured to efficiently retrieve and place substrates from N substrate supports (where N>2). The robot apparatus includes at least N end effectors plus one end effector (N+1) or plus two end effectors (N+2) enabling the robot to sequentially retrieve and place substrates within one or more process chambers during a single cycle (e.g., without having to return to a load lock or other location to place proceed substrates and retrieve unprocessed substrates).

Abstract: A method includes receiving a metal component including a raw surface that includes a metal base, a first native oxide disposed on the metal base, and hydrocarbons disposed on the metal base. The method further includes machining the raw surface of the metal component to remove the first native oxide and a first portion of the hydrocarbons from the metal base. The machining generates an as-machined surface of the metal component including the metal base without the first native oxide and without the first portion of the hydrocarbons. The method further includes performing a surface machining of the as-machined surface of the metal component to remove a second portion of the hydrocarbons. The method further includes surface treating the metal component to remove a third portion of the hydrocarbons. The method further includes performing a cleaning of the metal component and drying the metal component.

Abstract: The disclosure describes devices, systems and methods relating to a transfer chamber for an electronic device processing system. For example, a robot can include a first mover configured to be driven by a platform of a linear motor, a support structure disposed on the first mover, a first robot arm attached to the first end of the support structure at a shoulder axis, and a first arm drive assembly. The first drive assembly can include a first pulley attached to a first end of the support structure and to the first robot arm at the shoulder axis, a second pulley attached to a second end of the support structure, a first band connecting the first pulley to the second pulley, and a second mover configured to be driven by the platform of the linear motor, where the second mover is connected to the first band, and where motion of the second mover relative to the first mover causes the first band to a) rotate the first pulley and the second pulley and b) rotate the first robot arm around the shoulder axis.

Abstract: The disclosure describes devices, systems, and methods for causing a factory interface of an electronic device manufacturing system to be moveable between a first position and a second position. An electronic device manufacturing system can include a transfer chamber, processing chambers connected to the transfer chamber, a load lock connected to the transfer chamber, and a factory interface connected to the load lock. The factory interface can be moveable between a first position and a second position. The factory interface, while oriented in the first position, is positioned for transfer of one or more substrates between the factory interface and the load lock, where at least one of the transfer chamber or the load lock are inaccessible for maintenance while the factory interface is oriented at the first position. The factory interface, while oriented in the second position, is positioned to provide maintenance access to at least one of the transfer chamber or the load lock.

Abstract: Methods, apparatus, and assemblies are provided for a substrate carrier adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed.

Abstract: Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an arm component and a blade component. The blade component may comprise two or more end effectors that can retrieve and place two or more substrates at a time. The apparatus can include multiple arm components and multiple blade components. Each blade component can comprise two or more end effectors to carry two or more substrates at one time. The blade components can move independent of one another or may be dependently connected.

Abstract: Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an upper arm and three blades B1, B2, B3 that are independently rotatable. The three blades are configured to service a first dual load lock and second dual load lock wherein each dual load lock includes a different pitch. In some embodiments, a first pitch P1 is smaller than a second pitch P2. Blades B2 and B3 (or optionally blades B1 and B2) can service the first dual load lock with Pitch P1 and blades B1 and B3 can service the second dual load lock including the second pitch P2. Methods of operating the electronic device manufacturing apparatus and the robot apparatus are provided, as are numerous other aspects.

Abstract: A robot apparatus may include a first arm assembly configured to rotate about a first rotational axis. The first arm assembly may include a first end effector and a second end effector spaced by a first end effector pitch. A second arm assembly may be configured to rotate about the first rotational axis. The second arm assembly may include a third end effector and a fourth end effector spaced by a second end effector pitch, wherein the second end effector pitch is different than the first end effector pitch. Other apparatus, electronic device processing systems, and methods are disclosed.

Abstract: A robot may include a first arm assembly including a first upper arm rotatable about a first axis; a first forearm adapted for rotation relative to the first upper arm about a second axis; a first wrist member adapted for rotation relative to the first forearm about a third axis; and a first end effector coupled to the first wrist member, wherein the first end effector is moveable along a first path. A second arm assembly may include a second upper arm rotatable about the first axis; a second forearm adapted for rotation relative to the second upper arm about a fourth axis; a second wrist member adapted for rotation relative to the second forearm; and a second end effector coupled to the second wrist member, wherein the second end effector is moveable along a second path that does not overlap the first path. Other apparatus and methods are disclosed.

Abstract: A robot apparatus may include an upper arm adapted to rotate about a first rotational axis and a forearm rotatably coupled to the upper arm at a second rotational axis. A first wrist member may be rotatably coupled to the forearm at a third rotation axis. A second wrist member may be rotatably coupled to the forearm at the third rotation axis. A first end effector may be coupled to the first wrist member and a second end effector may be coupled to the second wrist member. The first wrist member and the second wrist member may be configured to rotate about the third rotational axis between a first pitch and a second pitch as a function of extension of the robot apparatus. Other apparatus and methods are disclosed.

Abstract: Robots including spaced upper arms are described. The robot includes first and second upper arms rotatable about a shoulder axis wherein the second upper arm is spaced from the first upper arm. The other robot components (first and second forearms, first and second wrist members, and first and second end effectors) are interleaved in the space between the first and second upper arms. Each of the first and second upper arms may be individually and independently controlled. Methods of operating the robot and electronic device processing systems including the robot are provided, as are numerous other aspects.

Abstract: A transfer chamber for semiconductor device manufacturing includes (1) a plurality of sides that define a region configured to maintain a vacuum level and allow transport of substrates between processing chambers, the plurality of sides defining a first portion and a second portion of the transfer chamber and including (a) a first side that couples to two twinned processing chambers; and (b) a second side that couples to a single processing chamber; (2) a first substrate handler located in the first portion of the transfer chamber; (3) a second substrate handler located in the second portion of the transfer chamber; and (4) a hand-off location configured to allow substrates to be passed between the first portion and the second portion of the transfer chamber using the first and second substrate handlers. Method aspects are also provided.