Abstract: According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

Abstract: Belt assemblies comprising a flexible belt having a longitudinal axis and a plurality of substantially T-shaped plates, each of the substantially T-shaped plates including a substantially horizontal portion and a substantially vertical portion, the substantially vertical portion of each substantially T-shaped plate being fastened to the flexible belt are disclosed. The belt assemblies can be used for vertically suspending loads from the assemblies and transporting loads in a conveyor system.

Abstract: Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

Abstract: In a first aspect, an automatic door opener is provided that includes (1) a platform adapted to support a substrate carrier; (2) a door opening mechanism adapted to open a door of the substrate carrier while the substrate carrier is supported by the platform; and (3) a tunnel. The tunnel is adapted to extend from an opening in a clean room wall toward the platform and at least partially surround the platform. The tunnel is further adapted to direct a flow of air from the clean room wall toward the platform and out of the tunnel. Numerous other aspects are provided.

Abstract: Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

Abstract: In a first aspect, a method of managing work in progress within a small lot size semiconductor device manufacturing facility is provided. The first method includes providing a small lot size semiconductor device manufacturing facility having (1) a plurality of processing tools; and (2) a high speed transport system adapted to transport small lot size substrate carriers among the processing tools. The method further includes maintaining a predetermined work in progress level within the small lot size semiconductor device manufacturing facility by (1) increasing an average cycle time of low priority substrates within the small lot size semiconductor device manufacturing facility; and (2) decreasing an average cycle time of high priority substrates within the small lot size semiconductor device manufacturing facility so as to approximately maintain the predetermined work in progress level within the small lot size semiconductor device manufacturing facility. Numerous other aspects are provided.

Abstract: According to a first aspect, a first conveyor system is provided that is adapted to deliver substrate carriers within a semiconductor device manufacturing facility. The first conveyor system includes a ribbon that forms a closed loop along at least a portion of the semiconductor device manufacturing facility. The ribbon is adapted to (1) be flexible in a horizontal plane and rigid in a vertical plane; and (2) transport a plurality of substrate carriers within at least a portion of the semiconductor device manufacturing facility. Numerous other aspects are provided, as are systems, methods and computer program products in accordance with these and other aspects.

Abstract: In a first aspect, a substrate loading station is served by a conveyor which continuously transports substrate carriers. A substrate carrier handler that is part of the substrate loading station operates to exchange substrate carriers with the conveyor while the conveyor is in motion. A carrier exchange procedure may include moving an end effector of the substrate carrier handler at a velocity that substantially matches a velocity of the conveyor. Numerous other aspects are provided.

Abstract: In a first aspect, an automatic door opener is provided that includes (1) a platform adapted to support a substrate carrier; (2) a door opening mechanism adapted to open a door of the substrate carrier while the substrate carrier is supported by the platform; and (3) a tunnel. The tunnel is adapted to extend from an opening in a clean room wall toward the platform and at least partially surround the platform. The tunnel is further adapted to direct a flow of air from the clean room wall toward the platform and out of the tunnel. Numerous other aspects are provided.

Abstract: In one aspect, a substrate loading station for a processing tool includes plural load ports. Each load port is operatively coupled to the processing tool and has a mechanism for opening a substrate carrier. A carrier handler transports substrate carriers from a factory exchange location to the load ports without placing the carriers on any carrier support location other than the load ports. Numerous other aspects are provided.

Abstract: A system for opening a substrate carrier includes a substrate carrier having an openable portion. The substrate carrier also has an opening mechanism coupled to the openable portion. A substrate transfer location has a support adapted to support a substrate carrier. The substrate transfer location also has an actuator mechanism. The actuator mechanism is positioned relative to the support so as to interact with the opening mechanism of the substrate carrier. The actuator mechanism of the substrate transfer location and the opening mechanism of the substrate carrier are adapted to interface with each other at the substrate transfer location so as to employ movement of the substrate carrier to achieve opening and closing of the substrate carrier.

Abstract: In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

Abstract: The present invention generally provides a robot blade which provides a plurality of semi-conductive or conductive contacts disposed at least partially on the surface of the blade to support a substrate above the blade. The contacts are preferably located inwardly from the edge of the blade and toward the center of the blade to provide a collection area on the blade to capture any particles which may form. The blade is preferably made of a semi-conductive material, such as alumina or other semi-conductive material, to provide an electrical flow path through the contact(s) to discharge any electrical charge which may build up on the substrate during processing.

Abstract: A wafer handler having a central body with a first end and a central axis of rotation is provided. A first end effector, adapted to support a first wafer, is rotatably coupled to the first end of the central body so as to define a first axis of rotation between the central body and the first end effector. Optionally, a second end effector adapted to support a second wafer is rotatably coupled to the second end of the central body so as to define a second axis of rotation between the central body and the second end effector. When the central body is rotated about the central axis of rotation in a first direction over a first angular distance, the first end effector simultaneously rotates about the first axis of rotation and the optional second end effector rotates about the second axis of rotation. Both end effectors are rotated over a second angular distance that is greater than the first angular distance. One or more of the end effectors may be pocketless.

Abstract: A multi-set robot is provided that includes a first robot set having a first motor coupled to a first rotatable member that is rotatable about an axis; a second motor coupled to a second rotatable member that is rotatable about the axis; a first plurality of blades vertically spaced from one another; and a first linkage adapted to enable coordinated movement of the blades on rotation of the first and second rotatable members. The robot also includes a second robot set positioned above the first robot set having a third motor coupled to a third rotatable member that is rotatable about the axis; a fourth motor coupled to a fourth rotatable member that is rotatable about the axis; a second plurality of blades vertically spaced from one another; and a second linkage adapted to enable coordinated movement of the blades on rotation of the third and fourth rotatable members. Other aspects are provided.

Abstract: A jig used in a substrate carrier handling robot calibration process has features that emulate the overhead transport flange and the bottom surface of a standard substrate carrier. The jig further includes features that are allowed to interact with sensors associated with substrate carrier storage locations and/or sensors associated with an end effector of the substrate carrier handling robot. In calibrating the substrate carrier handling robot the jig is juxtaposed with a substrate carrier storage location. The end effector of the robot is moved relative to the substrate carrier storage location and the above-mentioned sensors are allowed to interact with the jig. A controller for the robot detects locations of the end effector at times when the sensors interact with the jig.

Abstract: A storage surface for a semiconductor substrate carrier has substrate carrier sensors that are integrated with locator pins. Each locator pin includes a pin body mounted on, and extending upwardly from, the surface. The pin body has a slot formed at an upper portion of the pin body. A paddle is mounted in the slot of the pin body and is adapted to be actuated in a downward direction when a substrate carrier is seated on the pin body. The pin body has an uppermost point, and when the paddle is unactuated, the paddle does not extend above the uppermost point of the pin body.

Abstract: Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

Abstract: An ID code reader, adapted to read an ID code from a wafer cassette or other substrate carrier, is integrated with a substrate carrier handling robot. In one aspect, the robot includes a support structure, and a chassis mounted for movement on the support structure. In this aspect an ID code reader is mounted on the chassis or otherwise mounted for movement along with an end effector adapted to engage the substrate carrier.

Abstract: A multi-set robot is provided that includes a first robot set having a first motor coupled to a first rotatable member that is rotatable about an axis; a second motor coupled to a second rotatable member that is rotatable about the axis; a first plurality of blades vertically spaced from one another; and a first linkage adapted to enable coordinated movement of the blades on rotation of the first and second rotatable members. The robot also includes a second robot set positioned above the first robot set having a third motor coupled to a third rotatable member that is rotatable about the axis; a fourth motor coupled to a fourth rotatable member that is rotatable about the axis; a second plurality of blades vertically spaced from one another; and a second linkage adapted to enable coordinated movement of the blades on rotation of the third and fourth rotatable members. Other aspects are provided.