Abstract: The present invention provides systems and methods for loading and unloading substrate carriers onto and off of a transport system. The invention includes a substrate carrier handler adapted to transfer a substrate carrier between a docking station and a transport system, the substrate carrier handler including an end effector adapted to support the substrate carrier; a controller coupled to the substrate carrier handler and operative to control the substrate carrier handler such that the end effector of the substrate carrier handler is operative to selectively engage and disengage the substrate carrier to and from the transport system while the substrate carrier is in motion; and a sensor coupled to the controller and operative to provide a signal to the controller indicative of information about the substrate carrier.

Abstract: In one aspect, a system is disclosed having a substrate carrier loader adapted to load substrate carriers onto a moving conveyor; and a controller coupled to the substrate carrier loader, the controller adapted to assist in at least one of alignment of the substrate carrier loader to the moving conveyor and calibration of the substrate carrier loader to the moving conveyor or a storage location. Numerous other aspects are provided.

Abstract: In one aspect, a substrate loading station for a processing tool includes plural load ports. Each load port is operatively coupled to the processing tool and has a mechanism for opening a substrate carrier. A carrier handler transports substrate carriers from a factory exchange location to the load ports without placing the carriers on any carrier support location other than the load ports. Numerous other aspects are provided.

Abstract: The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that is easily configurable, has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, and then certain portions of the photosensitive material are removed in a developing process completed in the cluster tool.

Abstract: In a first aspect, a first apparatus is provided for inter-station overhead transport of a substrate carrier. The first apparatus includes (1) an overhead transport mechanism; (2) a substrate carrier support suspended from the overhead transport mechanism and adapted to receive and support a substrate carrier; and (3) a stabilization apparatus adapted to limit rocking of the substrate carrier and substrate carrier support relative to the overhead transport mechanism. Numerous other aspects are provided.

Abstract: In a first aspect, a substrate loading station is served by a conveyor which continuously transports substrate carriers. A substrate carrier handler that is part of the substrate loading station operates to exchange substrate carriers with the conveyor while the conveyor is in motion. A carrier exchange procedure may include moving an end effector of the substrate carrier handler at a velocity that substantially matches a velocity of the conveyor. Numerous other aspects are provided.

Abstract: Substrate transport systems, apparatus and methods are described. The systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then actuating a robot assembly to put or pick the substrate at the destination. Numerous other aspects are provided.

Abstract: Systems, apparatus and methods for transporting substrates between system components of an electronic device manufacturing system are provided. The systems and apparatus include an electrostatic end effector having a base, an electrode pair on the base, and spacer members for spacing the substrate from the electrode pairs to provide a gap between the electrode pair and the substrate. Methods of the invention as well as numerous other aspects are provided.

Abstract: A substrate transporting robot apparatus is disclosed which is adapted to transport a substrate to and from a chamber of an electronic device processing system. The apparatus may include an upper arm rotatable in an X-Y plane, a forearm rotatable relative to the upper arm in the X-Y plane, and a wrist member rotatable relative to the forearm in the X-Y plane, the wrist member including an end effector adapted to carry a substrate. The wrist member may be subjected to independent rotation such that various degrees of yaw may be imparted to the wrist member. In some aspects, the independent rotation is provided without a motive power device (e.g., motor) being provided on the arms or wrist member, i.e., the wrist member may be remotely driven. Systems and methods using the robot apparatus are also provided as are numerous other aspects.

Abstract: In a first aspect, a method of managing work in progress within a small lot size semiconductor device manufacturing facility is provided. The first method includes providing a small lot size semiconductor device manufacturing facility having (1) a plurality of processing tools; and (2) a high speed transport system adapted to transport small lot size substrate carriers among the processing tools. The method further includes maintaining a predetermined work in progress level within the small lot size semiconductor device manufacturing facility by (1) increasing an average cycle time of low priority substrates within the small lot size semiconductor device manufacturing facility; and (2) decreasing an average cycle time of high priority substrates within the small lot size semiconductor device manufacturing facility so as to approximately maintain the predetermined work in progress level within the small lot size semiconductor device manufacturing facility. Numerous other aspects are provided.

Abstract: In at least one aspect, a second multi-axis vacuum motor assembly is provided. The second multi-axis vacuum motor assembly includes (1) a first rotor; (2) a first stator adapted to commutate so as to rotate the first rotor across a vacuum barrier and control rotation of a first axis of a robot arm within a vacuum chamber; (3) a second rotor below the first rotor; (4) a second stator below the first stator and adapted to commutate so as to rotate the second rotor across the vacuum barrier and control rotation of a second axis of the robot arm within the vacuum chamber; (5) a first feedback device adapted to monitor rotation of the first axis of the robot arm; and (6) a second feedback device adapted to monitor rotation of the second axis of the robot arm. Numerous other aspects are provided.

Abstract: In a first aspect, a wafer loading station adapted to exchange wafer carriers with a wafer carrier transport system comprises a biasing element adapted to urge the end effector of the wafer loading station away from a moveable conveyor of the wafer carrier transport system upon the occurrence of a unscheduled event such as a power failure or an emergency shutdown. In a second aspect, an uninterruptible power supply commands a controller to cause the wafer carrier handler to retract the end effector from the wafer carrier transport system upon the occurrence of the unscheduled event, and provides the power necessary for the same. Numerous other aspects are provided.

Abstract: In a semiconductor fabrication facility, a conveyor transports substrate carriers. The substrate carriers are unloaded from the conveyor and loaded onto the conveyor without stopping the conveyor. A load and/or unload mechanism lifts the substrate carriers from the conveyor during unloading operations, while matching the horizontal speed of the conveyor. Similarly, during loading operations, the load/unload mechanism lowers a substrate carrier into engagement with the conveyor while matching the horizontal speed of the conveyor. Individual substrates, without carriers, may be similarly loaded and/or unloaded from a conveyor.

Abstract: In a first aspect, a method of opening a substrate carrier is provided. The method includes moving the substrate carrier such that a door of the substrate carrier contacts a supporting member; employing the supporting member to support the door; moving a housing of the substrate carrier away from the supporting member; and pivoting the supporting member and door below a bottom surface of the substrate carrier. Numerous other aspects are provided.

Abstract: In a first aspect, a first apparatus is provided for use in supporting a substrate carrier. The first apparatus includes an overhead transfer flange adapted to couple to a substrate carrier body and an overhead carrier support. The overhead transfer flange has a first side and a second side opposite the first side that is wider than the first side. Numerous other aspects are provided.

Abstract: In at least one aspect, a system is provided that includes (1) a substrate carrier having first docking features; and (2) a loadport having second docking features. The second docking features are adapted to block docking of substrate carriers that do not include the first docking features and to allow docking of substrate carriers that include the first docking features. Numerous other aspects are provided.

Abstract: Embodiments of the present invention generally provide an apparatus and method for transferring substrates in a processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint when compared to conventional techniques.

Abstract: A kinematic pin and a substrate carrier adapted to deter dislodgment of the substrate carrier from the kinematic pin are provided. A shear member on the kinematic pin interacts with a shear feature of the substrate carrier to deter lateral movement of the substrate carrier relative to the kinematic pin. A substrate carrier handler that employs the kinematic pin is also provided.

Abstract: In a first aspect, a first apparatus is provided for use in supporting a substrate carrier. The first apparatus includes an overhead transfer flange adapted to couple to a substrate carrier body and an overhead carrier support. The overhead transfer flange has a first side and a second side opposite the first side that is wider than the first side. Numerous other aspects are provided.

Abstract: In a first aspect, an apparatus is provided for opening a substrate carrier door of a substrate carrier. The apparatus includes a supporting member adapted to (1) support the substrate carrier door at a load port; (2) allow removal of the door from the substrate carrier; and (3) pivot the removed door below a bottom surface of the substrate carrier. Numerous other aspects are provided.