Patents by Inventor Jeffrey C. Thompson

Jeffrey C. Thompson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic modules and methods for forming the same
    Patent number: 8535984
    Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: September 17, 2013
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Livia M. Racz, Gary B. Tepolt, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller
  • Valve manifold
    Patent number: 8464754
    Abstract: A valve is provided including a first valve member and a second valve member. The first valve member includes a first step and a first orifice adjacent the first step. The second valve member includes a second step and a second orifice adjacent the second step. The second valve member is movable relative to the first valve member between an open position, in which the first orifice is fluidly connected the second orifice, and a closed position, in which the first orifice is substantially fluidly disconnected from the second orifice. The first and second steps are fluidly connected to the second orifice and substantially fluidly disconnected from the first orifice when the second valve member is in the closed position, and the first and second steps are fluidly connected to the first and second orifices when the second valve member is in the open position.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: June 18, 2013
    Assignee: Eaton Corporation
    Inventors: Dale A. Stretch, Jeffrey C. Thompson, Mahesh Joshi, Shrikant Basurtekar, Jerry L. Carlson, Aaron H. Jagoda, Jayakumar Ravathur, Otto Schultheis, G. Clark Fortune, Paul Brenner, Thomas J. Stoltz
  • Valve damping system
    Patent number: 8356630
    Abstract: A valve is provided including a first valve member and a second valve member. The first valve member includes a first step and a first orifice adjacent the first step. The second valve member includes a second step and a second orifice adjacent the second step. The second valve member is movable relative to the first valve member between an open position, in which the first orifice is fluidly connected the second orifice, and a closed position, in which the first orifice is substantially fluidly disconnected from the second orifice. The first and second steps are fluidly connected to the second orifice and substantially fluidly disconnected from the first orifice when the second valve member is in the closed position, and the first and second steps are fluidly connected to the first and second orifices when the second valve member is in the open position.
    Type: Grant
    Filed: June 2, 2009
    Date of Patent: January 22, 2013
    Assignee: Eaton Corporation
    Inventors: Dale A. Stretch, Jeffrey C. Thompson
  • Interposers, electronic modules, and methods for forming the same
    Patent number: 8273603
    Abstract: In accordance with a method for forming an interposer, a fill hole is formed in a first side of a substrate and a cavity is formed in a second side. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity, and an encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts. In accordance with a method of thermal management, an electronic component and a heat sink are disposed on opposing sides of an interposer that includes a plurality of encapsulated posts.
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: September 25, 2012
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Livia M. Racz, Gary B. Tepolt, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller
  • INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME
    Publication number: 20120086135
    Abstract: In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity.
    Type: Application
    Filed: October 6, 2011
    Publication date: April 12, 2012
    Inventors: Jeffrey C. Thompson, Livia M. Racz, Gary B. Tepolt, Thomas A. Langdo, Andrew J. Mueller
  • Electronic Modules and Methods for Forming the Same
    Publication number: 20110309528
    Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
    Type: Application
    Filed: August 31, 2011
    Publication date: December 22, 2011
    Inventors: Livia M. Racz, Gary B. Tepolt, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller
  • Electronic modules and methods for forming the same
    Patent number: 8017451
    Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: September 13, 2011
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Livia M. Racz, Gary B. Tepolt, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller
  • Die thinning processes and structures
    Patent number: 7960247
    Abstract: Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: June 14, 2011
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Jeffrey C. Thompson, Gary B. Tepolt, Livia M. Racz
  • VALVE DAMPING SYSTEM
    Publication number: 20100236651
    Abstract: A valve is provided including a first valve member and a second valve member. The first valve member includes a first step and a first orifice adjacent the first step. The second valve member includes a second step and a second orifice adjacent the second step. The second valve member is movable relative to the first valve member between an open position, in which the first orifice is fluidly connected the second orifice, and a closed position, in which the first orifice is substantially fluidly disconnected from the second orifice. The first and second steps are fluidly connected to the second orifice and substantially fluidly disconnected from the first orifice when the second valve member is in the closed position, and the first and second steps are fluidly connected to the first and second orifices when the second valve member is in the open position.
    Type: Application
    Filed: June 2, 2009
    Publication date: September 23, 2010
    Inventors: Dale A. Stretch, Jeffrey C. Thompson
  • VALVE MANIFOLD
    Publication number: 20100012204
    Abstract: A valve is provided including a first valve member and a second valve member. The first valve member includes a first step and a first orifice adjacent the first step. The second valve member includes a second step and a second orifice adjacent the second step. The second valve member is movable relative to the first valve member between an open position, in which the first orifice is fluidly connected the second orifice, and a closed position, in which the first orifice is substantially fluidly disconnected from the second orifice. The first and second steps are fluidly connected to the second orifice and substantially fluidly disconnected from the first orifice when the second valve member is in the closed position, and the first and second steps are fluidly connected to the first and second orifices when the second valve member is in the open position.
    Type: Application
    Filed: June 2, 2009
    Publication date: January 21, 2010
    Inventors: Dale A. Stretch, Jeffrey C. Thompson, Mahesh Joshi, Shrikant Basurtekar, Jerry Carlson, Aaron H. Jagoda, Jayakumar Ravathur, Otto Schultheis, Glenn C. Fortune, Paul Brenner, Thomas J. Stoltz
  • TWO STEP VALVE ACTUATOR
    Publication number: 20090294709
    Abstract: A valve is provided including a first valve member and a second valve member. The first valve member includes a first step and a first orifice adjacent the first step. The second valve member includes a second step and a second orifice adjacent the second step. The second valve member is movable relative to the first valve member between an open position, in which the first orifice is fluidly connected the second orifice, and a closed position, in which the first orifice is substantially fluidly disconnected from the second orifice. The first and second steps are fluidly connected to the second orifice and substantially fluidly disconnected from the first orifice when the second valve member is in the closed position, and the first and second steps are fluidly connected to the first and second orifices when the second valve member is in the open position.
    Type: Application
    Filed: June 2, 2009
    Publication date: December 3, 2009
    Inventors: Dale A. Stretch, Jeffrey C. Thompson
  • INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME
    Publication number: 20090250249
    Abstract: Electronic modules and interposers are formed by encapsulating microelectronic dies and/or posts within cavities in a substrate.
    Type: Application
    Filed: March 19, 2009
    Publication date: October 8, 2009
    Inventors: Livia M. Racz, Gary B. Tepolt, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller
  • DIE THINNING PROCESSES AND STRUCTURES
    Publication number: 20090251879
    Abstract: Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.
    Type: Application
    Filed: April 4, 2008
    Publication date: October 8, 2009
    Inventors: Jeffrey C. Thompson, Gary B. Tepolt, Livia M. Racz
  • Electronic Modules and Methods for Forming the Same
    Publication number: 20090250823
    Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.
    Type: Application
    Filed: June 30, 2008
    Publication date: October 8, 2009
    Inventors: Livia M. Racz, Gary B. Tepolt, Jeffrey C. Thompson, Thomas A. Langdo, Andrew J. Mueller