Abstract: Embodiments of the present invention are directed to an uninterruptible power supply for providing AC power to a load having a capacitive element.

Abstract: Disclosed is a printed circuit board, and a method of preparing a printed circuit board, which possesses a coefficient of thermal expansion substantially similar to that of silicon for use in direct semiconductor chip attach structures and similar solder mounted devices. The printed circuit board is fabricated from prepreg having a thermosetting resin and a reinforcement layer consisting of non-woven aramid mat or a liquid crystalline polymer paper. The composite dielectric layer optionally includes plated through holes which are either filled or non-filled, and one or more thin film redistribution layers to provide high density electronic packages. The design places the solder pads at the PTHs where needed. The redistribution layer can be formed using photoimagable dielectrics or laminated controlled-CTE composites and laser via imaging.

Abstract: Embodiments of the present invention are directed to an uninterruptible power supply for providing AC power to a load. In embodiments of the present invention, the uninterruptible power supply includes an input to receive AC power from an AC power source, an output that provides AC power, a DC voltage source that provides DC power, the DC voltage source having an energy storage device, an inverter operatively coupled to the DC voltage source to receive DC power and to provide AC power.

Abstract: A means to fabricate a color filter for use in a display, such as a liquid crystal display, in which a physical barrier is created which prevents the flow of a liquid dye after application and ensures that individual cells are filled with only the desired color. Additionally, a means is disclosed which creates a surface with all colors initially present, followed by an exposure means and a development means which enables the desired color to fill the desired cell.

Abstract: A composition comprising a thermoset resin which may or may not contain fluorine, bromine or both and containing at least one bromine-containing homo- or multicomponent thermoplastic polymer modifier optionally containing a different halogen which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.

Abstract: The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polyarylene ether.

Abstract: Methods are described for fabricating devices having vias containing more than one electrical conductor, in particular coaxial electrical conductors. A plurality of wires are bonded to a first substrate, such as a copper wire to a copper substrate. A second substrate having through-holes with side walls covered with an electrical conductor is disposed over the first substrate so that the wires are within the through-holes and spaced apart from the side walls. The first substrate is spaced apart from the second substrate by dielectric spacers. A polymer is injected into the space between the first and second substrates to provide electrical isolation therebetween. A polymer is injected into the space in the via between the elongated conductors and the conductive sidewall to provide dielectric isolation therebetween. The second substrate has electrically conductive pattern on both sides which are electrically interconnected by the electrically conductive sidewall to form an inner coil of electrical conductors.

Abstract: The invention involves a fluid treatment device and fluid treatment method to solution or melt coat or impregnate a resin or polymer to a predetermined, metered thickness into a substrate. The invention is effective in impregnating or coating various substrates in both a continuous or batch process on one side, two sides, or in the case of a porous substrate, penetration and complete saturation is possible. The invention offers significant advantages and benefits over existing methods and equipment and allows the coating or impregnation process to be performed at lower cost and higher efficiency with increased environmental safety.

Abstract: The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.

Abstract: A composition having enhanced fracture resistance comprising a heat curable reaction product of a fluorine-containing thermoset material and a fluorine-containing homopolymer, wherein the cured reaction product comprises the thermoset material having a plurality of discrete phases of said fluorine-containing homopolymer dispersed therein, the homopolymer phases being in the range of micron to submicron size.

Abstract: The present invention relates to a process for forming a foamed elastomeric polymer. The process involves forming a reverse emulsion of liquid droplets in a continuous liquid phase of polymer precursor and then polymerizing the precursor to entrap uniformly distributed droplets of the liquid in pores formed in the polymer bulk. The liquid in the pores is then removed under supercritical conditions.

Abstract: The present invention relates to a process for forming a foamed elastomeric polymer. The process involves forming a reverse emulsion of liquid droplets in a continuous liquid phase of polymer precursor and then polymerizing the precursor to entrap uniformly distributed droplets of the liquid in pores formed in the polymer bulk. The liquid in the pores is then removed under supercritical conditions.

Abstract: The invention relates to a process for making a foamed polymer. The process involves (a) dispersing thermally degradable solid particles in polymer precursor; (b) crosslinking the polymer precursor to form a rigid, crosslinked polymer without degrading the particles; and (c) heating the polymer to degrade the particles and form the polymer foam.