Patents by Inventor Jeffrey Drue David

Jeffrey Drue David has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10276460
    Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: April 30, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Boguslaw A. Swedek
  • Publication number: 20190064253
    Abstract: A method for predicting yield for a semiconductor process. A particular type of wafer is fabricated to have a first set of features disposed on the wafer, with a wafer map identifying a location for each of the first set of features on the wafer. Data from wafer acceptance tests and circuit probe tests is collected over time for wafers of that particular type as made in a semiconductor fabrication process, and at least one training dataset and a least one validation dataset are created from the collected data. A second set of “engineered” features are created and also incorporated onto the wafer and wafer map. Important features from the first and second sets of features are identified and selected, and using those important features as inputs, a number of different process models are run, with yield as the target. The results of the different models can be combined, for example, statistically.
    Type: Application
    Filed: August 24, 2018
    Publication date: February 28, 2019
    Inventors: Jeffrey Drue David, Tomonori D. Honda, Lin Lee Cheong
  • Publication number: 20180358271
    Abstract: Techniques for measuring and/or compensating for process variations in a semiconductor manufacturing processes. Machine learning algorithms are used on extensive sets of input data, including upstream data, to organize and pre-process the input data, and to correlate the input data to specific features of interest. The correlations can then be used to make process adjustments. The techniques may be applied to any feature or step of the semiconductor manufacturing process, such as overlay, critical dimension, and yield prediction.
    Type: Application
    Filed: November 25, 2015
    Publication date: December 13, 2018
    Applicant: STREAM MOSAIC, INC.
    Inventor: Jeffrey Drue DAVID
  • Publication number: 20180356807
    Abstract: Robust machine learning predictions. Temporal dependencies of process targets for different machine learning models can be captured and evaluated for the impact on process performance for target. The most robust of these different models is selected for deployment based on minimizing variance for the desired performance characteristic.
    Type: Application
    Filed: June 12, 2018
    Publication date: December 13, 2018
    Inventors: Tomonori Honda, Rohan D. Kekatpure, Jeffrey Drue David
  • Publication number: 20180321026
    Abstract: Among other things, a computer-based method is described. The method comprises receiving, by one or more computers, a plurality of measured spectra reflected from a substrate at a plurality of different positions on the substrate. The substrate comprises at least two regions having different structural features. The method also comprises performing, by the one or more computers, a clustering algorithm on the plurality of measured spectra to separate the plurality of measured spectra into a number of groups based on the spectral characteristics of the plurality of measured spectra; selecting one of the number of groups to provide a selected group having a subset of spectra from the plurality of measured spectra; and determining, in the one or more computers, at least one characterizing value for the substrate based on the subset of spectra of the selected group.
    Type: Application
    Filed: June 29, 2018
    Publication date: November 8, 2018
    Inventors: Jeffrey Drue David, Boguslaw A. Swedek
  • Patent number: 10086492
    Abstract: A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: October 2, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Boguslaw A. Swedek, Benjamin Cherian
  • Patent number: 10012494
    Abstract: Among other things, a computer-based method is described. The method comprises receiving, by one or more computers, a plurality of measured spectra reflected from a substrate at a plurality of different positions on the substrate. The substrate comprises at least two regions having different structural features. The method also comprises performing, by the one or more computers, a clustering algorithm on the plurality of measured spectra to separate the plurality of measured spectra into a number of groups based on the spectral characteristics of the plurality of measured spectra; selecting one of the number of groups to provide a selected group having a subset of spectra from the plurality of measured spectra; and determining, in the one or more computers, at least one characterizing value for the substrate based on the subset of spectra of the selected group.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: July 3, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Boguslaw A. Swedek
  • Publication number: 20180113440
    Abstract: A method to assist in identifying a spectral feature and a characteristic of the selected spectral feature to monitor during polishing includes polishing a test substrate and measuring a sequence of spectra of light reflected from a substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The sequence of spectra are visually displayed as a contour plot.
    Type: Application
    Filed: December 20, 2017
    Publication date: April 26, 2018
    Inventors: Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu, Boguslaw A. Swedek
  • Publication number: 20180071886
    Abstract: A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.
    Type: Application
    Filed: November 20, 2017
    Publication date: March 15, 2018
    Applicant: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Boguslaw A. Swedek, Benjamin Cherian
  • Patent number: 9886026
    Abstract: In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: February 6, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Harry Q. Lee, Dominic J. Benvegnu, Boguslaw A. Swedek
  • Patent number: 9833874
    Abstract: A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: December 5, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Boguslaw A. Swedek, Benjamin Cherian
  • Patent number: 9811077
    Abstract: A method of controlling polishing includes storing a base spectrum, the base spectrum being a spectrum of light reflected from a substrate after deposition of a deposited dielectric layers overlying a metallic layer or semiconductor wafer and before deposition of a non-metallic layer over the plurality of deposited dielectric layer. After deposition of the non-metallic layer and during polishing of the non-metallic layer on the substrate, measurements of a sequence of raw spectra of light reflected the substrate during polishing are received from an in-situ optical monitoring system. Each raw spectrum is normalized to generate a sequence of normalized spectra using the raw spectrum and the base spectrum. At least one of a polishing endpoint or an adjustment for a polishing rate is determined based on at least one normalized predetermined spectrum from the sequence of normalized spectra.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: November 7, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Tomohiko Kitajima, Jeffrey Drue David, Jun Qian, Taketo Sekine, Garlen C. Leung, Sidney P. Huey
  • Patent number: 9649743
    Abstract: A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: May 16, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Harry Q. Lee
  • Publication number: 20170125313
    Abstract: A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.
    Type: Application
    Filed: January 11, 2017
    Publication date: May 4, 2017
    Applicant: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Boguslaw A. Swedek
  • Publication number: 20170113320
    Abstract: A plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates are represented in the form of a first matrix, and the first matrix is decomposed into products of at least two component matrixes of a first set of component matrixes. The dimensions of each of the at least two component matrixes is reduced to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions.
    Type: Application
    Filed: January 6, 2017
    Publication date: April 27, 2017
    Applicant: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Boguslaw A. Swedek, Benjamin Cherian
  • Publication number: 20170109646
    Abstract: Techniques for measuring and/or compensating for process variations in a semiconductor manufacturing processes. Machine learning algorithms are used on extensive sets of input data, including upstream data, to organize and pre-process the input data, and to correlate the input data to specific features of interest. The correlations can then be used to make process adjustments. The techniques may be applied to any feature or step of the semiconductor manufacturing process, such as overlay, critical dimension, and yield prediction.
    Type: Application
    Filed: December 29, 2016
    Publication date: April 20, 2017
    Inventor: Jeffrey Drue DAVID
  • Patent number: 9583405
    Abstract: Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular spectrum-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum-based endpoint logic. The method includes obtaining a current spectrum. The current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved. The determining is based on the reference and current spectra.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: February 28, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Dominic J. Benvegnu, Jeffrey Drue David, Boguslaw A. Swedek
  • Patent number: 9573242
    Abstract: A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: February 21, 2017
    Assignee: Applied Materials, Inc.
    Inventor: Jeffrey Drue David
  • Patent number: 9551567
    Abstract: Among other things, a machine based method includes representing a plurality of spectra reflected from one or more substrates at a plurality of different positions on the one or more substrates in the form of a first matrix; decomposing, by one or more computers, the first matrix into products of at least two component matrixes of a first set of component matrixes; reducing dimensions of each of the at least two component matrixes to produce a second set of component matrixes containing the at least two matrixes with reduced dimensions; and generating, by the one or more computers, a second matrix by taking a product of the matrixes of the second set of component matrixes.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: January 24, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Jeffrey Drue David, Boguslaw A. Swedek, Benjamin Cherian
  • Patent number: 9482610
    Abstract: A method of controlling processing of a substrate includes measuring a spectrum reflected from the substrate, for each partition of a plurality of partitions of the measured spectrum, computing a partition value based on the measured spectrum within the partition to generate a plurality of partition values, for each reference spectrum signature of a plurality of reference spectrum signatures, determining a membership function for each partition, for each partition, computing a membership value based on the membership function for the partition and the partition value for the partition to generate a plurality of groups of membership values with each group of the plurality of groups associated with a reference spectrum signature, selecting a best matching reference spectrum signature from the plurality of reference spectra signatures based on the plurality of groups of membership values, and determining a characterizing value associated with the best matching reference spectrum signature.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: November 1, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Kiran Lall Shrestha, Boguslaw A. Swedek, Jeffrey Drue David, Harry Q. Lee