Abstract: An apparatus for hole drilling in a substrate is provided. The apparatus includes a laser system configured to apply a laser beam onto the substrate for removing material from a set of areas on the substrate by directing the laser beam onto predefined positions corresponding to the set of areas on the substrate in a sequence. The apparatus includes a ventilation system configured to produce a fluid flow along one or more sides of the substrate. The apparatus controls the laser beam such that the laser beam is sequentially positioned according to a first laser beam movement direction and a second laser beam movement direction.

Abstract: Exemplary processing methods include forming a group of LED structures on a substrate layer to form a patterned LED substrate. A light absorption barrier may be deposited on the patterned LED substrate. The methods may further include exposing the patterned LED substrate to light. The light may be absorbed by surfaces of the LED structures that are in contact with the substrate layer, and the light absorption barrier. The methods may still further include separating the LED structures for the substrate layer. The bonding between the LED structures and the substrate layer may be weakened by the absorption of the light by the surfaces of the LED structures in contact with the substrate layer.

Abstract: The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of forming the same. The semiconductor device spacers described herein may be utilized to form stacked semiconductor package assemblies, stacked PCB assemblies, and the like.

Abstract: The present disclosure relates to systems and methods for fabricating semiconductor packages, and more particularly, for forming features in semiconductor packages by laser ablation. In one embodiment, the laser systems and methods described herein can be utilized to pattern a substrate to be utilized as a package frame for a semiconductor package having one or more interconnections formed therethrough and/or one or more semiconductor dies disposed therein. The laser systems described herein can produce tunable laser beams for forming features in a substrate or other package structure. Specifically, frequency, pulse width, pulse shape, and pulse energy of laser beams are tunable based on desired sizes of patterned features and on the material in which the patterned features are formed. The adjustability of the laser beams enables rapid and accurate formation of features in semiconductor substrates and packages with controlled depth and topography.

Abstract: The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of forming the same. The semiconductor device spacers described herein may be utilized to form stacked semiconductor package assemblies, stacked PCB assemblies, and the like.

Abstract: The present disclosure relates to systems and methods for fabricating semiconductor packages, and more particularly, for forming features in semiconductor packages by laser ablation. In one embodiment, the laser systems and methods described herein can be utilized to pattern a substrate to be utilized as a package frame for a semiconductor package having one or more interconnections formed therethrough and/or one or more semiconductor dies disposed therein. The laser systems described herein can produce tunable laser beams for forming features in a substrate or other package structure. Specifically, frequency, pulse width, pulse shape, and pulse energy of laser beams are tunable based on desired sizes of patterned features and on the material in which the patterned features are formed. The adjustability of the laser beams enables rapid and accurate formation of features in semiconductor substrates and packages with controlled depth and topography.

Abstract: Exemplary processing methods include forming a group of LED structures on a substrate layer to form a patterned LED substrate. A light absorption barrier may be deposited on the patterned LED substrate. The methods may further include exposing the patterned LED substrate to light. The light may be absorbed by surfaces of the LED structures that are in contact with the substrate layer, and the light absorption barrier. The methods may still further include separating the LED structures for the substrate layer. The bonding between the LED structures and the substrate layer may be weakened by the absorption of the light by the surfaces of the LED structures in contact with the substrate layer.

Abstract: A method of fabricating a frame to enclose one or more semiconductor dies includes forming one or more features including one or more cavities and one or more through-vias in a substrate by a first laser ablation process, filling the one or more through-vias with a dielectric material, and forming a via-in-via in the dielectric material filled in each of the one or more through-vias by a second laser ablation process. The one or more cavities is configured to enclose one or more semiconductor dies therein. In the first laser ablation process, frequency, pulse width, and pulse energy of a first pulsed laser beam to irradiate the substrate are tuned based on a depth of the one or more features. In the second laser ablation process, frequency, pulse width, and pulse energy of a second pulsed laser beam to irradiate the dielectric material are tuned based on a depth of the via-in-via.

Abstract: The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of forming the same. The semiconductor device spacers described herein may be utilized to form stacked semiconductor package assemblies, stacked PCB assemblies, and the like.

Abstract: The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of forming the same. The semiconductor device spacers described herein may be utilized to form stacked semiconductor package assemblies, stacked PCB assemblies, and the like.

Abstract: The present disclosure relates to systems and methods for fabricating semiconductor packages, and more particularly, for forming features in semiconductor packages by laser ablation. In one embodiment, the laser systems and methods described herein can be utilized to pattern a substrate to be utilized as a package frame for a semiconductor package having one or more interconnections formed therethrough and/or one or more semiconductor dies disposed therein. The laser systems described herein can produce tunable laser beams for forming features in a substrate or other package structure. Specifically, frequency, pulse width, pulse shape, and pulse energy of laser beams are tunable based on desired sizes of patterned features and on the material in which the patterned features are formed. The adjustability of the laser beams enables rapid and accurate formation of features in semiconductor substrates and packages with controlled depth and topography.

Abstract: An additive manufacturing apparatus including a platform and a dispenser configured to deliver successive layers of feed material onto the platform. One or more light sources generate multiple light beams to selectively fuse feed material in a layer on the platform and multiple optical assemblies receive the multiple light beams, where each respective optical assembly transmits a respective light beam along a respective optical path through the optical assembly. Each light beam is directed to a scan spot on the layer of feed material on the platform to scan the light beam to sweep the scan spot along a controllable path across the layer of feed material on the platform. An optical multiplexer selectively transmits the return light emitted or reflected from the respective scan spot from a respective optical path of a selected respective optical assembly of the multiple optical assemblies to the measurement device.

Abstract: A method of fabricating a frame to enclose one or more semiconductor dies includes forming one or more features including one or more cavities and one or more through-vias in a substrate by a first laser ablation process, filling the one or more through-vias with a dielectric material, and forming a via-in-via in the dielectric material filled in each of the one or more through-vias by a second laser ablation process. The one or more cavities is configured to enclose one or more semiconductor dies therein. In the first laser ablation process, frequency, pulse width, and pulse energy of a first pulsed laser beam to irradiate the substrate are tuned based on a depth of the one or more features. In the second laser ablation process, frequency, pulse width, and pulse energy of a second pulsed laser beam to irradiate the dielectric material are tuned based on a depth of the via-in-via.

Abstract: The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of forming the same. The semiconductor device spacers described herein may be utilized to form stacked semiconductor package assemblies, stacked PCB assemblies, and the like.

Abstract: An additive manufacturing apparatus including a platform and a dispenser configured to deliver successive layers of feed material onto the platform. One or more light sources generate multiple light beams to selectively fuse feed material in a layer on the platform and multiple optical assemblies receive the multiple light beams, where each respective optical assembly transmits a respective light beam along a respective optical path through the optical assembly. Each light beam is directed to a scan spot on the layer of feed material on the platform to scan the light beam to sweep the scan spot along a controllable path across the layer of feed material on the platform. An optical multiplexer selectively transmits the return light emitted or reflected from the respective scan spot from a respective optical path of a selected respective optical assembly of the multiple optical assemblies to the measurement device.

Abstract: An additive manufacturing apparatus includes a platform, a dispenser to deliver a plurality of layers of feed material, one or more light sources configured to emit a first light beam and a second light beam, and a polygon beam scanner including a rotatable mirror having a plurality of reflective facets to redirect the first light beam and the second light beam toward the platform to deliver energy to an uppermost layer of feed material. The mirror is positioned and rotatable such that motion of each facet of the plurality of reflective facets causes the first light beam to sweep along a first path on the uppermost layer and causes the second light beam to sweep along the first path following the first light beam.

Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense a plurality of layers of feed material on a top surface of the platform, and an energy delivery system. The energy delivery system has one or more light sources configured to emit a first light beam and a second light beam, and one or more reflective members each having reflective facets to redirect the first light beam or the second light beam toward an uppermost layer of feed material to deliver energy to the uppermost layer. The one or more reflective members are each rotatable such that motion of each sequential facet of the reflective facets of each of the one or more reflective members sweeps the first light beam along a first path on the uppermost layer or sweeps the second light beam along a second path on the uppermost layer.

Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense a plurality of layers of feed material on a top surface of the platform, and an energy delivery assembly. The energy delivery assembly includes a light source to emit one or more light beams, a first reflective member having a plurality of reflective facets, and at least one second reflective member. The first reflective member is rotatable such that sequential facets sweep the light beam sequentially along a path on the uppermost layer. The at least one second reflective member is movable such that the at least one second reflective surface is repositionable to receive at least one of the at least one light beam and redirect the at least one of at least one light beam along a two-dimensional path on the uppermost layer.

Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense a plurality of layers of feed material on a top surface of the platform, and an energy delivery assembly. The energy delivery assembly includes a light source to emit one or more light beams, a first reflective member having a plurality of reflective facets, and at least one second reflective member. The first reflective member is rotatable such that sequential facets sweep the light beam sequentially along a path on the uppermost layer. The at least one second reflective member is movable such that the at least one second reflective surface is repositionable to receive at least one of the at least one light beam and redirect the at least one of at least one light beam along a two-dimensional path on the uppermost layer.

Abstract: An additive manufacturing apparatus includes a platform, a dispenser to dispense a plurality of layers of feed material on a top surface of the platform, and an energy delivery system. The energy deliver system includes a light source to emit a light beam, and a reflective member having a plurality of reflective facets. The reflective member is positioned in a path of the light beam to receive the light beam and redirect the light beam toward the top surface of the platform to deliver energy to an uppermost layer of the layers of feed material to fuse the feed material. The reflective member is rotatable such that sequential facets sweep the light beam sequentially along a path on the uppermost layer.