Patents by Inventor Jeffrey M. Calvert

Jeffrey M. Calvert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photoresists comprising novolak resin blends
    Patent number: 10976659
    Abstract: Photoresist compositions are provided comprising a radiation sensitive component and at least two distinct novolak resins. In one aspect, photoresists of the invention exhibit notably high dissolution rates, such as in excess of 800 angstroms per second in aqueous developer solution. In another aspect, photoresists of the invention can exhibit good photospeeds, such as 100 mJ/cm2 or less.
    Type: Grant
    Filed: January 28, 2008
    Date of Patent: April 13, 2021
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Jeffrey M. Calvert, Joseph F. Lachowski
  • PHOTOTHERAPY GARMENT FOR TREATING NEONATAL JAUNDICE AND OTHER MEDICAL CONDITIONS
    Publication number: 20200230433
    Abstract: This invention provides a phototherapy garment for treating neonatal jaundice, the phototherapy garment comprising a first layer of a flexible soft-textured non-woven material, a second layer of a flexible stretchable substrate supporting light-emitting diode (LED) light sources and a thin flexible third layer with heat transfer capability to provide dissipation of waste heat from the LEDs of the second layer. This invention also provides a phototherapy garment for treating other medical conditions.
    Type: Application
    Filed: January 23, 2020
    Publication date: July 23, 2020
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: H DAVOD ROSENFELD, JEFFREY M CALVERT
  • PRE-APPLIED UNDERFILL
    Publication number: 20150371916
    Abstract: Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first filled polymer region having a first viscosity and a second filled polymer region having a second viscosity, wherein the first viscosity is less than the second viscosity. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.
    Type: Application
    Filed: June 23, 2014
    Publication date: December 24, 2015
    Inventors: Robert K. BARR, Edgardo ANZURES, Jeffrey M. CALVERT, Herong LEI, David FLEMING, Avin V. DHOBLE, Anupam CHOUBEY
  • Alpha-particle emitter removal
    Patent number: 9099208
    Abstract: Methods of purifying acidic metal solutions by removing at least a portion of alpha-particle emitting materials are provided. The purified metal solutions are useful in a variety of applications requiring low levels of alpha-particle emission.
    Type: Grant
    Filed: May 24, 2012
    Date of Patent: August 4, 2015
    Inventors: Matthew L. Grandbois, Harlan Robert Goltz, Jeffrey M. Calvert, Matthew Lawrence Rodgers, Charles R. Marston
  • PRE-APPLIED UNDERFILL
    Publication number: 20150064851
    Abstract: Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 5, 2015
    Inventors: Michael K. GALLAGHER, Edgardo ANZURES, David FLEMING, Avin V. DHOBLE, Chi Q. TRUONG, Anupam CHOUBEY, Jeffrey M. CALVERT
  • ALPHA-PARTICLE EMITTER REMOVAL
    Publication number: 20120298586
    Abstract: Methods of purifying acidic metal solutions by removing at least a portion of alpha-particle emitting materials are provided. The purified metal solutions are useful in a variety of applications requiring low levels of alpha-particle emission.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 29, 2012
    Applicants: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew L. Grandbois, Harlan Robert Goltz, Jeffrey M. Calvert, Matthew Lawrence Rodgers, Charles R. Marston
  • Electronic devices having air gaps
    Patent number: 7723850
    Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: May 25, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Dana A. Gronbeck, Timothy G. Adams, Jeffrey M. Calvert
  • Photoresists comprising novolak resin blends
    Publication number: 20080182204
    Abstract: Photoresist compositions are provided comprising a radiation sensitive component and at least two distinct novolak resins. In one aspect, photoresists of the invention exhibit notably high dissolution rates, such as in excess of 800 angstroms per second in aqueous developer solution. In another aspect, photoresists of the invention can exhibit good photospeeds, such as 100 mJ/cm2 or less.
    Type: Application
    Filed: January 28, 2008
    Publication date: July 31, 2008
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Jeffrey M. Calvert, Joseph F. Lachowski
  • Air gap formation
    Patent number: 7256127
    Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
    Type: Grant
    Filed: September 13, 2003
    Date of Patent: August 14, 2007
    Assignee: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Dana A. Gronbeck, Timothy G. Adams, Jeffrey M. Calvert
  • Electronic device manufacture
    Patent number: 7018678
    Abstract: Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: March 28, 2006
    Assignee: Shipley Company, L.L.C.
    Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Gregory P. Prokopowicz, Timothy G. Adams
  • Seed layer repair
    Patent number: 6797146
    Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices. Also disclosed are electronic devices containing substantially continuous seed layers.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: September 28, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Denis Morrissey, Jeffrey M. Calvert, Robert D. Mikkola
  • Air gap formation
    Publication number: 20040137728
    Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
    Type: Application
    Filed: September 13, 2003
    Publication date: July 15, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Dana A. Gronbeck, Timothy G. Adams, Jeffrey M. Calvert
  • Electronic device manufacture
    Publication number: 20040130032
    Abstract: A method for manufacturing electronic devices using multiple layers of pre-porous dielectric materials that are made porous subsequent to etching and metal filling of apertures is provided. The pre-porous layers may be made porous sequentially or during a single processing step. Such pre-porous dielectric layers are selected not only to provide low dielectric constants after being made porous, but also to provide a difference in etch rates. Structures having such multiple layers of pre-porous dielectric layers are also provided.
    Type: Application
    Filed: September 24, 2003
    Publication date: July 8, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Timothy G. Adams
  • Electronic device manufacture
    Publication number: 20040052948
    Abstract: Treatment procedures for organic polysilica layers are provided that improve the adhesion of layers of material that are subsequently applied to the treated organic polysilica layers. In particular, layers of organic polymeric material have improved adhesion to such treated organic polysilica layers. These treatment procedures are particularly useful in the manufacture of electronic devices, such as integrated circuits, wherein the organic polysilica layers are used as dielectric materials, cap layers, etch stops and the like.
    Type: Application
    Filed: June 3, 2003
    Publication date: March 18, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Christopher P. Sullivan
  • Electronic device manufacture
    Publication number: 20040033700
    Abstract: Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.
    Type: Application
    Filed: June 3, 2003
    Publication date: February 19, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Gregory P. Prokopowicz, Timothy G. Adams
  • Seed repair and electroplating bath
    Patent number: 6682642
    Abstract: Disclosed are compositions useful for repair and electroplating of seed layers. Also disclosed are methods of repairing and electroplating such seed layers.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: January 27, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert A. Mikkola, Jeffrey M. Calvert
  • Method of electrodepositing copper
    Patent number: 6679983
    Abstract: Disclosed are electrolytes for copper electroplating that provide enhanced fill of small features with less overplate. Also disclosed are methods of plating substrates, such as electronic devices, using such electrolytes.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: January 20, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Denis Morrissey, Robert D. Mikkola, Jeffrey M. Calvert
  • Electroplating method
    Patent number: 6649038
    Abstract: Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields.
    Type: Grant
    Filed: October 13, 2001
    Date of Patent: November 18, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert D. Mikkola, Jeffrey M. Calvert, Denis Morrissey
  • Electroplating bath control
    Patent number: 6645364
    Abstract: Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
    Type: Grant
    Filed: October 19, 2001
    Date of Patent: November 11, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Jeffrey M. Calvert, Robert A. Binstead
  • Electroplating bath control
    Publication number: 20030205476
    Abstract: Disclosed is a method of analyzing organic components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.
    Type: Application
    Filed: June 9, 2003
    Publication date: November 6, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Jeffrey M. Calvert, Robert A. Binstead