Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.

Abstract: Disclosed is a process flows for treating seed layers including copper such that various problems such as oxidation and insufficient coverage can be repaired in an effective and efficient manner.

Abstract: An aspect of the present invention is a process for modifying a substrate in areas that are exposed to actinic radiation, having the steps: (a) providing on the substrate functional groups adapted for conversion to oxygen-containing photoproducts upon exposure to actinic radiation; (b) exposing at least a portion of the substrate to the actinic radiation, converting the functional groups in an exposed region of the substrate to the photoproducts; (c) contacting the photoproducts with a primary or secondary amine in the presence of hydrogen ions, forming imine groups; and (d) contacting the imine groups with a reducing agent, forming amine groups on the substrate in the exposed region.

Abstract: Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields.

Abstract: Disclosed is a method for repairing of seed layers by removal of oxidized metal from the seed layers prior to subsequent metallization. Also disclosed is a method for monitoring such repair to provide substantially metal oxide free seed layers.

Abstract: Disclosed is a method of analyzing components in an electroplating bath. Also disclosed is a method of controlling electroplating baths by monitoring the components of the plating bath in real-time.

Abstract: Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices. Also disclosed are electronic devices containing substantially continuous seed layers.

Abstract: Disclosed are compositions useful for repair and electroplating of seed layers. Also disclosed are methods of repairing and electroplating such seed layers.

Abstract: Disclosed are electrolytes for copper electroplating that provide enhanced fill of small features with less overplate. Also disclosed are methods of plating substrates, such as electronic devices, using such electrolytes.

Abstract: The present invention concerns a process for modifying oxidizable surfaces, including diamond surfaces, including methods for metallizing these surfaces, where these methods include oxidation of these surfaces. The present invention also relates to the products of these methods. In this process, a surface is first plasma oxidized, usually under an RF O2 plasma. Chemical functional groups are then attached to the surface. If the surface is to be metallized, the chemical functional groups are selected to be catalyzable, the surface is then catalyzed for electroless metallization, and the surface is finally treated with an electroless plating solution to metallize the surface. If modified surface is to be patterned, the modified surface is exposed through a mask to pattern the surface after the attachment of the chemical functional groups.

Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.

Abstract: Disclosed are compositions useful for removing antireflective compositions from a substrate. Also disclosed are methods of removing antireflective compositions from a substrate using such compositions.

Abstract: A surface for the alignment of liquid crystals containing directionally-linked groups and compounds useful for preparing such surfaces are disclosed.

Abstract: Patterned conducting polymer surfaces exhibiting excellent properties may be prepared by:(a) forming a surface of a conducting polymer on a surface of a substrate;(b) forming a surface of a blocking material on said surface of said conducting polymer in a pattern-wise fashion, to obtain a first patterned surface containing regions of exposed conducting polymer and regions of blocking material;(c) treating said first patterned surface with an agent which: (i) removes said conducting polymer from said regions of exposed conducting polymer; (ii) decreases the conductivity of said conducting polymer in said regions of exposed conducting polymer; or (iii) increases the conductivity of said conducting polymer in said regions of exposed conducting polymer; and(d) removing said blocking material to obtain a second patterned surface containing an exposed pattern of conducting polymer.

Abstract: A surface for the alignment of liquid crystals containing directionally-linked groups.

Abstract: Fluoropolymeric substrates with metallized surfaces may be prepared by self-assembly of a chemisorbed layer of a metal ion-chelating organosilane onto a fluoropolymer surface after radio-frequency glow discharge plasma surface hydroxylation. The silane covalently binds an aqueous palladium catalyst and subsequent electroless deposition yields homogeneous or patterned metal deposits that exhibit excellent adhesion to the fluoropolymer.

Abstract: Conducting substrate for use in display device having a conducting polymer on the surface of a rigid or flexible, flat, curved or bent substrate.

Abstract: High aspect ratio metal microstructures may be prepared by a method involving(i) forming a layer of a photoresist on a substrate;(ii) exposing the layer to actinic radiation in an imagewise manner and developing the exposed layer to obtain a surface which contains regions having no remaining photoresist and regions covered with photoresist;(iii) metallizing the surface to form a layer of metal on the region of the surface having no remaining photoresist and on the sides of the regions of photoresist remaining on the surface; and(iv) optionally, stripping the photoresist remaining on the surface.Such microstructures are useful as electron emitters, anisotropic high dielectric interconnects, masks for x-ray photolithography, carriers for the controlled release of active agents, and ultramicroelectrode arrays.

Abstract: Fluoropolymeric substrates with metallized surfaces may be prepared by self-assembly of a chemisorbed layer of a metal ion-chelating organosilane onto a fluoropolymer surface after radio-frequency glow discharge plasma surface hydroxylation. The silane covalently binds an aqueous palladium catalyst and subsequent electroless deposition yields homogeneous or patterned metal deposits that exhibit excellent adhesion to the fluoropolymer.

Abstract: Patterns of pre-formed hybridizable nucleic acid oligomers are formed upon a substrate. The substrate is coated with molecules, such as aminosilanes, whose reactivity with nucleic acid molecules can be transformed by irradiation. The coated substrate exposed to patterned irradiation then contacted with pre-formed nucleic acid oligomers. The binding of the preformed nucleic acid oligomers to the coating molecules may be covalent or non-covalent (for example, ionic bonding or hydrogen bonding). If desired, a heterobifunctional crosslinker may be employed, before or after irradiation, with the coating to promote covalent binding of the nucleic acid oligomers to the coating molecules. Also, the irradiation step may be performed with the assistance of a positive-tone or negative-tone photoresist.